Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.

An electronic component element includes a piezoelectric substrate and a comb-shaped electrode located on one principal surface of the piezoelectric substrate. A support layer is arranged around the comb-shaped electrode. A cover layer is disposed so as to cover the support layer and the comb-shaped electrode. Via-hole electrodes extend through the cover layer and are connected to the comb-shaped electrode. An uneven portion is located on a principal surface of the cover layer that is opposite to a principal surface of the cover layer that is opposed to the comb-shaped electrode.

Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.

According to an aspect of the present invention, there is provided an oil pressure sensor attaching structure in which a plurality of guide protrusion portions are disposed with a gap in a circumferential direction and surround an oil passage opening portion. The guide protrusion portions have an arc-shaped wall portion and a protrusion portion. An accommodation portion which has an accommodation opening portion opening upward is provided on an inside of the plurality of guide protrusion portions in a radial direction. The sensor case has a columnar portion, a plurality of flange portions, and an annular portion that surrounds the columnar portion. The flange portion is disposed between the upper surface and the protrusion portions in the vertical direction at a first position in the circumferential direction. The annular portion has a first portion and a second portion.

A groove is provided at an outer side of an outer wall of a pressure sensor in a radial direction, and opens at one end side in an axial direction of the pressure sensor. A horizontally extending stopper is provided at an inner wall of a sensor accommodation recessed portion. A fixing portion is provided on the outer side of the outer wall of the pressure sensor in the radial direction, and enters the stopper. The fixing portion protrudes outward in the radial direction from the outer wall of the pressure sensor accommodated in the accommodation recessed portion, and contacts the stopper in the axial direction.

A micro-electro-mechanical system sensor device is disclosed. The sensor device comprises a micro-electro-mechanical system (MEMS) layer, comprising: an actuator layer and a cover layer, wherein a portion of the actuator layer is coupled to the cover layer via a dielectric; and an out-of-plane sense element interposed between the actuator layer and the cover layer, wherein the MEMS device layer is connected to a complementary metal-oxide-semiconductor (CMOS) substrate layer via a spring and an anchor.

Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.

A method for manufacturing a micromechanical component having a substrate and having a cap connected to the substrate and enclosing with the substrate a first cavity is provided, a first pressure existing, and a first gas mixture having a first chemical composition being enclosed, in the first cavity, in a first method step an access opening that connects the first cavity to an environment of the micromechanical component being constituted in the substrate or in the cap, in a second method step the first pressure and/or the first chemical composition being established in the first cavity, in a third method step the access opening being sealed with the aid of a laser by the introduction of energy or heat into an absorbing portion of the substrate or of the cap, the introduction of energy or heat being controlled by spatial displacement of a laser beam along a path proceeding substantially parallel to a surface, facing away from the first cavity, of the substrate or of the cap.

A MEMS micromirror device comprising, a reflective movable mirror and an underlying substrate. A viscous liquid or gel is located between the movable mirror and substrate.

A MEMS micromirror device comprising, a reflective movable mirror, and a surrounding substrate coplanar to the mirror. A physical gap between the mirror and the surrounding substrate filled with fluid and finger structures extend from a perimeter of the movable mirror into the physical gap.