A MEMS device includes a movable mirror and a solid material below the mirror that removes more heat from the mirror and creates more viscous drag than if the solid material were absent while allowing free movement of the mirror. A MEMS system includes a movable mirror, transparent window, electronic package, and a fluid-tight cavity between the window and the electronic package filled with a fluid exhibiting higher thermal conductivity than air. Another system has a reflective movable mirror, transparent window, and a lid that holds the window close to the mirror without obstructing its free movement. There is greater vertical clearance between the MEMS system and lid than between the mirror and MEMS system. Another MEMS device has a movable mirror and a surrounding substrate coplanar to the mirror. A gap between the mirror and substrate is filled with fluid. Finger structures extend from the mirror into the gap.

An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.

A process for fabricating a device for detecting electromagnetic radiation, including an encapsulation structure including an encapsulation layer on which a relief rests, and a sealing layer, which has a local breakage in continuity at the relief.

A semiconductor device package includes a redistribution layer structure, a lid, a sensing component and an encapsulant. The lid is disposed on the redistribution layer structure and defines a cavity together with the redistribution layer structure. The sensing component is disposed in the cavity. The encapsulant surrounds the lid.

A microphone assembly includes a substrate defining a port, a MEMS transducer, a guard ring, and a can. The MEMS transducer is coupled to the substrate such that the MEMS transducer is positioned over the port. The guard ring is coupled to the substrate and surrounds the MEMS transducer. The guard ring includes a plurality of edges that further includes a first edge and an opposing second edge. A portion of the first edge and a portion of the second edge have a reduced thickness relative to adjacent ones of the plurality of edges. The can is coupled to the guard ring such that the substrate and the can cooperatively define an interior cavity.

A cavity type semiconductor package with a substrate and a cap is disclosed. The semiconductor package includes a first semiconductor die coupled to the substrate and a layer of flexible material on a surface of the cap. A trace is on the layer of flexible material. The cap is coupled to the substrate with the layer of flexible material and the trace between the cap and the substrate. A second semiconductor die is coupled to the layer of flexible material and the trace on the cap. The cap further includes an aperture to expose the second semiconductor die to the ambient environment. The layer of flexible material absorbs stress during operation cycles of the package induced by the different coefficient of thermal expansions of the cap and the substrate to reduce the likelihood of separation of the cap from the substrate.

An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.

A semiconductor package structure includes an electronic device having an exposed region adjacent to a first surface, a dam surrounding the exposed region of the semiconductor die and disposed on the first surface, the dam having a top surface away from the first surface, an encapsulant encapsulating the first surface of the electronic device, exposing the exposed region of the electronic device. A surface of the dam is retracted from a top surface of the encapsulant. A method for manufacturing the semiconductor package structure is also provided.

A method for producing sensor devices includes generating a semiconductor wafer having a plurality of sensor chips, wherein each sensor chip comprises a micro-electromechanical systems (MEMS) structure arranged at a main surface of the semiconductor wafer; forming a plurality of gas-permeable covers over the main surface of the semiconductor wafer, wherein each gas-permeable cover covers a corresponding MEMS structure of the MEMS structures and forms a cavity above the corresponding MEMS structure; and singulating the semiconductor wafer into a plurality of sensor devices.

In an assembly between a MEMS and/or NEMS electromechanical component and a casing, the electromechanical component includes at least one suspended and movable structure which is provided with at least one fixing zone, on which a region for receiving the casing is fixed, the suspended structure being at least partially formed in a cover for protecting the component or in a layer which is different from the one in which a sensitive element of the component is formed.