A micromechanical component includes a substrate that extends along a main extension plane of the micromechanical component, the micromechanical component including a drive mass which is suspended on the substrate via a drive spring of the micromechanical component so as to be able to move relative to the substrate, the micromechanical component including a test mass that is movably suspended relative to the drive mass, the drive spring being disposed in such a way that the drive mass and/or the test mass surround(s) the drive spring at least in part essentially parallel to the main extension plane.

The present disclosure provides a flexible MEMS switch, including an MEMS body and a packaging body outside the MEMS body, the packaging body includes a first flexible cover plate and a second flexible cover plate arranged at two opposite sides of the MEMS body respectively, a first cavity is formed between the first flexible cover plate and the MEMS body, and a second cavity is formed between the second flexible cover plate and the MEMS body. The present disclosure further provides a method for manufacturing the flexible MEMS switch.

A system, device and method for stress-sensitive component isolation in severe environments are disclosed. For example, a device for stress-sensitive component isolation is disclosed, which includes a circuit board assembly, a plurality of electronic components mounted onto a surface of the circuit board assembly, and a protective cap disposed over at least one electronic component and mounted onto the surface of the circuit board assembly. The protective cap can be filled with a low modulus material if additional structural support is desired for the electronic component.

A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

A microelectromechanical system (MEMS) device is disclosed. The MEMS device includes a device substrate with a top device surface and a bottom device surface having a MEMS component in a device region. A top device bond ring is disposed on the top device surface surrounding the device region and a bottom device bond ring is disposed on the bottom device surface surrounding the device region. A top cap with a top cap bond ring is bonded to the top device bond ring by a top eutectic bond and a bottom cap with a bottom cap bond ring is bonded to the bottom device bond ring by a bottom eutectic bond. The eutectic bonds encapsulate the MEMS device.

A microelectromechanical system (MEMS) device is disclosed. The MEMS device includes a device substrate with a top device surface and a bottom device surface having a MEMS component in a device region. A top device bond ring is disposed on the top device surface surrounding the device region and a bottom device bond ring is disposed on the bottom device surface surrounding the device region. A top cap with a top cap bond ring is bonded to the top device bond ring by a top eutectic bond and a bottom cap with a bottom cap bond ring is bonded to the bottom device bond ring by a bottom eutectic bond. The eutectic bonds encapsulate the MEMS device.

A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

Systems, apparatus, articles of manufacture, and methods to reduce delamination of layers in semiconductor packages with window assemblies are disclosed. An apparatus comprising: a translucent panel, a semiconductor substrate, a stack of bonding materials between the translucent panel and the semiconductor substrate, and a buffer material extending along a lateral side of the stack of bonding materials.

A physical quantity sensor includes a sensor element, and a container (package) that stores the sensor element on a bottom plate (first base material). An outer edge of the container has a rectangular shape in a plan view. Lengths of each side of the rectangular shape are 2.0 mm or more and 7.0 mm or less, a thickness of the container is 0.50 mm or more and less than 1.85 mm, and when a thickness of the bottom plate is t, 0.4 mmt1.1 mm is satisfied.

A pressure sensor comprises a first substrate containing a processing circuit integrated thereon and a cap attached to the first substrate. The cap includes a container, a holder, and one or more suspension elements for suspending the container from the holder. The container includes a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. The container is suspended from the holder such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit.