A semiconductor device includes a semiconductor chip including a chip substrate and a MEMS element, wherein the chip substrate includes a first surface and a second surface arranged opposite to the first surface, and wherein the MEMS element is disposed at the first surface of the chip substrate and the MEMS element includes a sensitive area; at least one electrical interconnect structure electrically connected to the first surface of the chip substrate; a chip carrier electrically connected to the at least one electrical interconnect structure; a flexible film provided over the second surface of the chip substrate to form a pocket in which the semiconductor chip resides; and a compressible material arranged between the second surface of the chip substrate and the flexible film.

Embedded sensor structures and stretchable embedded sensor films including a plurality of embedded sensor packages are described. An embedded sensor structure may include a sensor package including an integrated circuit (IC) die and sensor die bonded to a front side of the IC die, with the sensor die including a diaphragm that is deflectable toward a cavity. A planarization layer laterally surrounds the sensor package, and metal routing is formed on a top side of the sensor die and spanning over the planarization layer. Other aspects are also described and claimed.

An example method of producing a microelectromechanical system (MEMS) package, the method comprising: applying first epoxy layers to a first substrate, at least one of the first epoxy layers coupled to a second substrate; applying a first post gel heat treatment to the first epoxy layers; after applying the first post gel heat treatment to the first epoxy layers, applying second epoxy layers to the second substrate and to the first epoxy layers; and applying a second post gel heat treatment to the first epoxy layers and the second epoxy layers.

Embedded sensor structures and stretchable embedded sensor films including a plurality of embedded sensor packages are described. An embedded sensor structure may include a sensor package including an integrated circuit (IC) die and sensor die bonded to a front side of the IC die, with the sensor die including a diaphragm that is deflectable toward a cavity. A planarization layer laterally surrounds the sensor package, and metal routing is formed on a top side of the sensor die and spanning over the planarization layer. Other aspects are also described and claimed.