A method for operating an integrated MEMS microphone device is proposed. The integrated MEMS microphone device comprises a package housing enclosing an interior cavity, wherein an integrated MEMS microphone die with a movable membrane, at least one environmental sensor and a thermal decoupling circuit are arranged inside the cavity. The method comprising the steps of repeatedly operating the environmental sensor in a measurement mode and activating the thermal decoupling circuit for a transition phase preceding and/or succeeding the measurement mode of the environmental sensor. During the transition phase a heat dissipation into the cavity is gradually adjusted.

Techniques are disclosed for systems and methods using microelectromechanical systems MEMS techniques to provide cryogenic and/or general cooling of a device or sensor system. In one embodiment, a system includes a compressor assembly and MEMS expander assembly in fluid communication with the compressor assembly via a gas transfer line configured to physically separate and thermally decouple the MEMS expander assembly from the compressor assembly. The MEMS expander assembly includes a plurality of expander cells each including a MEMS displacer, a cell regenerator, and an expansion volume disposed between the MEMS displacer and the cell regenerator, and the plurality of cell regenerators are configured to combine to form a contiguous shared regenerator for the MEMS expander assembly.

A die-wrapped packaged device includes at least one flexible substrate having a top side and a bottom side that has lead terminals, where the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals. At least one die includes a substrate having a back side and a topside semiconductor surface including circuitry thereon having nodes coupled to bond pads. One of the sides of the die is mounted on the top side of the flexible circuit, and the flexible substrate has a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the flexible substrate so that the die bonding features contact the bond pads.

A method for operating an integrated MEMS microphone device is proposed. The integrated MEMS microphone device comprises a package housing enclosing an interior cavity, wherein an integrated MEMS microphone die with a movable membrane, at least one environmental sensor and a thermal decoupling circuit are arranged inside the cavity. The method comprising the steps of repeatedly operating the environmental sensor in a measurement mode and activating the thermal decoupling circuit for a transition phase preceding and/or succeeding the measurement mode of the environmental sensor. During the transition phase a heat dissipation into the cavity is gradually adjusted.

A method of forming a multiple layer, hybrid interposer structure includes forming a plurality of first openings through a substrate, the substrate comprising a heat spreading material; forming a first metal material within the plurality of first openings and on top and bottom surfaces of the substrate; patterning the first metal material; forming a dielectric layer over the patterned first metal material; forming a plurality of second openings within the dielectric layer to expose portions of the patterned first metal material on the top and bottom surfaces of the substrate; filling the plurality of second openings with a second metal material, in contact with the exposed portions of the patterned first metal material; forming a third metal material on the top and bottom surfaces of the substrate, the third metal material in contact with the second metal material and the dielectric layer; and patterning the third metal material.

Techniques are disclosed for systems and methods using microelectromechanical systems MEMS techniques to provide cryogenic and/or general cooling of a device or sensor system. In one embodiment, a system includes a compressor assembly and MEMS expander assembly in fluid communication with the compressor assembly via a gas transfer line configured to physically separate and thermally decouple the MEMS expander assembly from the compressor assembly. The MEMS expander assembly includes a plurality of expander cells each including a MEMS displacer, a cell regenerator, and an expansion volume disposed between the MEMS displacer and the cell regenerator, and the plurality of cell regenerators are configured to combine to form a contiguous shared regenerator for the MEMS expander assembly.

A monolithic vapor chamber heat dissipating device uses a phase change liquid and one or more wicks to dissipate heat from a heat-generating system. The phase change liquid and one or more wicks may be directly coupled to the heat-generating system, or may be coupled to an intermediate evaporator substrate. The phase change liquid vaporizes as it absorbs heat from the heat-generating system. When the vapor rises and encounters a condenser substrate, the vapor condenses and transfers the heat to the condenser substrate. The condensed vapor is drawn by gravity and the one or more wicks to the phase change liquid coupled to the heat-generating system.

The invention is directed to a microfluidic device, which comprises distinct, parallel levels, including a first level and a second level. It further includes: a first microchannel, a second microchannel, and a node. This node comprises: an inlet port, a cavity, a via, and an outlet port. The cavity is formed on the first level and is open on a top side. The inlet port is defined on the first level; it branches from the first microchannel and communicates with the cavity through an ingress thereof. The outlet port, branches to the second microchannel on the second level. The via extends from the bottom side of the cavity, down to the outlet port, so the cavity may communicate with the outlet port. In addition, the cavity comprises a liquid blocking element to prevent an aqueous liquid filling the inlet port to reach the outlet port.

A die-wrapped packaged device includes at least one flexible substrate having a top side and a bottom side that has lead terminals, where the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals. At least one die includes a substrate having a back side and a topside semiconductor surface including circuitry thereon having nodes coupled to bond pads. One of the sides of the die is mounted on the top side of the flexible circuit, and the flexible substrate has a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the flexible substrate so that the die bonding features contact the bond pads.

A thermal management device includes a microfluidic volume having a first peripheral side and a second peripheral side and including at least one thermal element, a first port to the microfluidic volume, a second port from the microfluidic volume, an inlet valve at the first port to the microfluidic volume, an outlet valve at the second port, and a valve piezoelectric element in mechanical communication with a portion of at least one of the inlet valve and the outlet valve to move at least the portion of the at least one of the inlet valve and the outlet valve and selectively allow fluid flow through the microfluidic volume.