A temperature-stabilized MEMS device in which heat is generated by ohmic heating as an electric current passes through at least part of one of the structural layers of the device. Various implementation options are disclosed in which the heating occurs in a device layer (25) of the device, either in an outer frame (2) or within the area of an active structure (3), or where heating occurs within a substrate (1) or a cover (8) of the device. One application of particular relevance is a gyroscope device.

One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate-in effect, heating the MEMS component and optionally related circuitry to a steady-state oven temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

Motion and/or orientation sensing systems can utilize gyroscopes, accelerometers, magnetometers, and other sensors for measuring motion or orientation of connected objects. Temperature changes affect the precision of the data output by the motion/orientation sensing device. A system is provided for controllably heating a device within a package to a desired temperature that varies based on the ambient temperature. The operating temperature of the device can then be known and controlled. The ambient temperature can be known through an ambient temperature sensor, for example. Given this information, a controller compensates the data output by the device to further improve the accuracy in the measurements. Like the amount of heating provided to the package, the amount of compensation is also based on the ambient temperature and/or the device temperature.

A microelectromechanical systems die including a thermally conductive substrate, at least one insulator film disposed on the thermally conductive substrate, a sensor material disposed on the at least one insulator film, and a heater circumferentially disposed around the sensor material.

An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board.

An accelerometer includes a housing, a proof mass assembly encased in the housing, and one or more heating elements configured to heat the proof mass assembly in response to an electrical current. The one or more heating elements include a positive temperature coefficient of resistance (PTC) material. The PTC material exhibits a relatively high increase in resistance above a threshold temperature. For example, a ratio of the resistance of the PTC material above the threshold temperature to the resistance of the PTC material at room temperature (PTC ratio) is greater than five.

A MEMS oscillator includes a first baseplate, a MEMS chip, and a second heater. The MEMS chip is disposed on the first baseplate, the MEMS chip includes a first MEMS resonator and a first heater, and the second heater is disposed outside the MEMS chip. The MEMS resonator is directly heated inside the MEMS chip by using the first heater, and is heated outside the MEMS chip by using the second heater.