An integrated CMOS-MEMS device includes a first substrate having a CMOS device, a second substrate having a MEMS device, an insulator layer disposed between the first substrate and the second substrate, a dischargeable ground-contact, an electrical bypass structure, and a contrast stress layer. The first substrate includes a conductor that is conductively connecting to the CMOS devices. The electrical bypass structure has a conducting layer conductively connecting this conductor of the first substrate with the dischargeable ground-contact through a process-configurable electrical connection. The contrast stress layer is disposed between the insulator layer and the conducting layer of the electrical bypass structure.

A method for manufacturing semiconductor structure includes: providing a substrate having a first surface; forming a trench on the first surface, wherein a bottom surface and side walls of the substrate are configured along an outer periphery of the trench; annealing the substrate with high-purity argon or high-purity hydrogen to flatten the bottom surface and the side walls; conformally disposing a composite-material layer to cover the first surface, the bottom surface and the side walls; disposing a polysilicon material layer in the trench; removing the composite-material layer on the first surface; forming a multi-layer metal interconnection structure on the first surface and the polysilicon material layer, the multi-layer metal interconnection structure including a MEMS frame structure and through holes; removing the polysilicon material layer and the composite-material layer; using plasma treatment to the trench to flatten the bottom surface and the side walls. The plasma contains inert gas and hydrogen.

A microelectromechanical (MEMS) device may be coupled to a dielectric material at an upper planar surface or lower planar surface of the MEMS device. One or more temperature sensors may be attached to the dielectric material layer. Signals from the one or more temperature sensors may be used to determine a thermal gradient along on axis that is normal to the upper planar surface and the lower planar surface. The thermal gradient may be used to compensate for values measured by the MEMS device.

A microelectromechanical (MEMS) system may comprise multiple sensors within cavities of the MEMS system. The operation of different sensors requires different pressures within the respective cavities. A first cavity may be sealed at a first pressure. A through-hole may be etched into a cap layer of the MEMS system to introduce gas into a second cavity such that the cavity has a desired pressure. The cavity may then be sealed by a MEMS valve to maintain the desired pressure in the second cavity.

A method comprises: patterning a substrate, including a conductive region, with photoresist exposed by lithography, where the substrate is mounted on a handle substrate; forming a comb structure with conductive fingers on the substrate by at least removing a portion of the conductive region of the substrate; removing the photoresist; forming, one atomic layer at a time, at least one atomic layer of at least one conductor over at least one sidewall of each conductive finger; attaching at least one insulator layer to the comb structure, and the substrate from which the comb structure is formed; and removing the handle substrate.

A high-temperature miniaturized resonant gyroscope, which comprises a resonator, a circuit board, a piezoelectric element, a supporting base, a shell and a binding post, wherein the resonator is arranged in the shell and connected with the supporting base, the piezoelectric element is connected with the binding post through a metal conductor, and key process points of internal elements of the gyroscope are fixedly connected by high-temperature materials and high-temperature processes. The gyroscope is a small-sized gyroscope capable of working at a high temperature; the present disclosure also provides an inertial navigation system, which comprises a triaxial gyroscope, a triaxial accelerometer and a damper, wherein the gyroscope is fixedly connected with the damper, and the gyroscope adopts the high-temperature resonant gyroscope. A drilling measurement system and a measurement method.

A MEMS sensor with a media access opening in its carrier board. The MEMS sensor has an integrally filter mesh closing the media access opening. The mesh can be applied in unstructured form over the whole surface of the carrier board. Then, a structuring is performed to produce preferably at the same time a perforation forming the filter mesh.

A mounting structure includes a micro vibrator and a mounting substrate. The micro vibrator includes a curved surface portion having an annular curved surface and a connecting portion extending from the curved surface portion toward an inner center position of the curved surface portion. The micro vibrator is disposed so that the connecting portion is bonded to the mounting substrate and the curved surface portion is in a hollow state free from other elements. The mounting substrate includes a plurality of electrode portions that are arranged to face and surround a rim of the curved surface portion of the micro vibrator, and spaced apart from each other, the rim being an end of the curved surface portion opposite to the connecting portion. Further, the mounting substrate includes a guard electrode.

Various embodiments of the present disclosure are directed towards an integrated chip including a microelectromechanical systems (MEMS) structure overlying a substrate. A capping structure overlies the MEMS structure. The capping structure at least partially defines a cavity. The MEMS structure is disposed in the cavity. An outgas structure adjacent to the cavity. The outgas structure comprises an amorphous material.

Embodiments of the present disclosure relate generally to acoustically decoupled microelectromechanical system devices and, more particularly, to acoustically decoupled microelectromechanical system devices anchored upon phononic crystals. In some embodiments described herein, a device may comprise a resonator, a handle layer, and a pedestal disposed between the resonator and the handle layer, the pedestal connecting the resonator to the handle layer. In the devices described herein, the resonator and the handle layer may be non-coplanar. In some embodiments, the handle layer comprises a phononic crystal to acoustically decouple the resonator from the substrate of the handle layer.