A method for producing a system, including a first microelectromechanical element and a second microelectromechanical element, including the following: providing, a substrate, having the first microelectromechanical element and the second microelectromechanical element, and a cap element, a getter material being situated on the substrate in a first region in a surrounding environment of the first microelectromechanical element and/or on the cap element in a first corresponding region; situating the cap element on the substrate using a wafer bonding technique so that a sealed first chamber is formed that contains the first microelectromechanical element and the first region and/or the first corresponding region, a sealed second chamber being formed that contains the second microelectromechanical element; producing an opening in the second chamber; and sealing the opening at a first ambient pressure, in particular a first gas pressure.

A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the polysilicon layer is exposed to a pressure level of the first cavity. A cap wafer is bonded to a second surface of the MEMS wafer opposite the first surface of the MEMS wafer. The bonding the cap wafer creates a second cavity comprising the second portion of the polysilicon layer and a third cavity. A second surface of the first portion of the polysilicon layer is exposed to a pressure level of the third cavity. The first cavity or the third cavity is exposed to an ambient environment.

A micro-electro-mechanical system acoustic sensor, a micro-electro-mechanical system package structure and a method for manufacturing the same are provided. The micro-electro-mechanical system acoustic sensor comprises a substrate, a cantilever structure and a diaphragm sensor. The cantilever structure is formed on the substrate, and comprises a fixed end and a free cantilever portion extended from the fixed end. The free cantilever portion comprises a free end. The free end and the fixed end are respectively at opposing sides of the free cantilever portion. The free cantilever portion is capable of generating a vibration wave in an empty space. The diaphragm sensor is formed on the substrate, and comprises a diaphragm film, a back plate, and at least one electrical contact point. The back plate and the diaphragm film have a first empty gap there between. The empty space and the first empty gap communicate to each other.

A MEMS device includes a substrate, a proof mass capable of moving relative to the substrate, and a motion limit structure. The motion limit structure includes an arm structure flexibly coupled to the proof mass or the substrate. The arm structure has a first contact region and a second contact region. In response to a shock force that causes the proof mass to move, the first contact region contacts a first stop region on the other one of the proof mass and the substrate. Following contact of the first contact region with the first stop region and upon continuation of the shock force, the second contact region contacts a second stop region on the other one of the proof mass and the substrate such that the contact between the second contact and stop regions reduces a contact force between the first contact and stop regions.

A micro-device comprising: a substrate, a stationary element rigidly connected to the substrate, a first mobile element suspended from the stationary element by first retention elements and configured to move with respect to the stationary element, a second mobile element suspended from the first mobile element by second retention elements and configured to move with respect to the first mobile element and the stationary element, a first cavity, at least some of the walls of which are formed by the stationary element and in which the first mobile element is encapsulated, a second cavity positioned in the first cavity, at least some of the walls of which are formed by the first mobile element, in which the second mobile element is encapsulated and which is insulated from the first cavity.

A MEMS sensor that comprises a sensing reference plane, at least one anchor coupled to the sensing reference plane, wherein the sensing reference plane is divided by a first and a second axis forming four quadrants on the sensing reference plane, at least one proof mass coupled to the at least one anchor, wherein one of the at least one proof mass moves under an external excitation, and a pattern of sensing elements on the sensing reference plane to detect motion normal of the at least one proof mass relative to the sensing reference plane, wherein the pattern of sensing elements comprises at least three sensing elements in each of the four quadrants.

A micro-electromechanical system (MEMS) device comprises a fixed portion and a proofmass suspended by at least one composite beam. The composite beam is cantilevered relative to the fixed portion and extends between a first end that is integrally formed with the fixed portion and a second distal end. The composite beam comprises an insulator having a top surface and at least two side surfaces; a conductor extending away from the fixed portion and surrounding at least a portion of the insulator; and a second conductor positioned adjacent to the top surface of the conductor and extending parallel with the insulator away from the fixed portion. The second conductor is separated from the first conductor to provide a low parasitic conductance of the composite beam.

In some embodiments a method of manufacturing a sensor system can comprise forming a first structure having a substrate layer and a first sensor that is positioned on a first side of the substrate layer, bonding a cap structure over the first sensor on the first side of the substrate layer, and depositing a first dielectric layer over the cap structure. After bonding the cap structure and depositing the first dielectric layer, a second sensor is fabricated on the first dielectric layer. The second sensor includes material that would be adversely affected at a temperature that is used to bond the cap structure to the first side of the substrate layer.

A sensor device and a method for manufacturing the sensor device. The sensor device is equipped with an impact element that includes an inner part of dielectric bulk material and an outer part of diamond-like coating material. The inner part is made to be lower at the edges than in the middle, and the outer part is formed of a diamond-like coating layer that covers the inner part. The DLC coated impact element is mechanically more robust than the rectangular prior art structures. Furthermore, the tapered form of the impact element improves conductivity of the DLC coating such that discharge of static buildup in the impact element is effectively enabled.

Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.