A device includes a micro-electromechanical system (MEMS) device layer comprising a proof mass. The proof mass includes a first proof mass portion and a second proof mass portion. The first proof mass portion is configured to move in response to a stimuli. The second proof mass portion has a spring attached thereto. The device further includes a substrate disposed parallel to the MEMS device layer. The substrate comprises a bumpstop configured to limit motion of the first proof mass portion. The device includes a first electrode disposed on the substrate facing the second proof mass portion. The first electrode is configured to apply a pulling force onto the second proof mass portion and to move the second proof mass portion towards the first electrode.

A micromechanical sensor system, in particular, an acceleration sensor, including a substrate having a main extension plane, the sensor system including a first mass and a second mass. The first and second masses are each designed to be at least partially movable in a vertical direction, perpendicular to the main extension plane of the substrate. The first mass includes a stop structure, wherein the stop structure has an overlap with the second mass in the vertical direction.

A method embodiment includes providing a MEMS wafer comprising an oxide layer, a MEMS substrate, a polysilicon layer. A carrier wafer comprising a first cavity formed using isotropic etching is bonded to the MEMS, wherein the first cavity is aligned with an exposed first portion of the polysilicon layer. The MEMS substrate is patterned, and portions of the sacrificial oxide layer are removed to form a first and second MEMS structure. A cap wafer including a second cavity is bonded to the MEMS wafer, wherein the bonding creates a first sealed cavity including the second cavity aligned to the first MEMS structure, and wherein the second MEMS structure is disposed between a second portion of the polysilicon layer and the cap wafer. Portions of the carrier wafer are removed so that first cavity acts as a channel to ambient pressure for the first MEMS structure.

A system and method for providing a MEMS sensor are disclosed. In a first aspect, the system is a MEMS sensor that comprises a substrate, an anchor region coupled to the substrate, at least one support arm coupled to the anchor region, at least two guiding arms coupled to and moving relative to the at least one support arm, a plurality of sensing elements disposed on the at least two guiding arms to measure motion of the at least two guiding arms relative to the substrate, and a proof mass system comprising at least one mass coupled to each of the at least two guiding arms by a set of springs. The proof mass system is disposed outside the anchor region, the at least one support arm, the at least two guiding arms, the set of springs, and the plurality of sensing elements.

A coupling device (130) for coupling a plurality of vibration systems (110, 120), which are mounted above a substrate (200) in such a manner that said systems can vibrate along a first direction (x) and are offset with respect to one another in a second direction (y) perpendicular to the first direction (x), has a flexural beam spring (135) which can bend in the first direction (x) and can be connected to the vibration systems (110, 120); in this case, connections (112, 122) between the flexural beam springs (135) and the vibration systems (110, 120) are arranged between at least two connection points (140) of the flexural beam springs (135) to the substrate (200) in such a manner that a deflection of the flexural beam springs (135) which is caused by movements of the vibration systems (110, 120) results in a vibration of the flexural beam springs (135) with antinodes of vibration in the region of the connections (112, 122) between the flexural beam springs (135) and the vibration systems (110, 120).

Inertial sensor comprising a fixed part and at least one mass suspended from the fixed part and means of damping the displacement of the part suspended from the fixed part, said damping means being electromechanical damping means comprising at least one DC power supply source, one electrical resistor and one variable capacitor in series, said variable capacitor being formed partly by the suspended part and partly by the fixed part such that displacement of the suspended part causes a variation of the capacitance of the variable capacitor.

A micromechanical sensor that is produced surface-micromechanically includes at least one mass element formed in a third functional layer that is non-perforated at least in certain portions. The sensor has a gap underneath the mass element that is formed by removal of a second functional layer and at least one oxide layer. The removal of the at least one oxide layer takes place by introducing a gaseous etching medium into a defined number of etching channels arranged substantially parallel to one another. The etching channels are configured to be connected to a vertical access channel in the third functional layer.

A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

An inertial sensor includes: a substrate; a moving element swinging about a swing axis along a Y-axis; a detection electrode provided at the substrate, overlapping the moving element as viewed in a plan view from a Z-axis direction orthogonal to the Y-axis, and forming an electrostatic capacitance with the moving element; an exposure part provided at an inner side of the detection electrode and exposing a surface facing the moving element, of the substrate; a protrusion overlapping the moving element as viewed in a plan view from the Z-axis direction and protruding toward the moving element from the exposure part of the substrate; and a covered electrode provided at a top of the protrusion and having a same electric potential as the moving element.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.