A torsion bar portion is of a meandering shape including a plurality of straight sections and a plurality of turnover sections. The plurality of straight sections extends in a first direction along a swing axis and is juxtaposed in a second direction intersecting with the first direction. The plurality of turnover sections alternately couples two ends of the straight sections. Wiring is disposed on the torsion bar portion. The wiring includes first wiring sections and second wiring sections. The first wiring sections include damascene wiring sections that are disposed so as to be embedded in grooves formed in the turnover sections and that are made of a first metal material including Cu. The second wiring sections are disposed on the straight sections and are made of a second metal material more resistant to plastic deformation than the first metal material.

A micromechanical mirror device has: a plate-shaped mirror having a reflecting surface for reflecting light, the reflecting surface being configured to be planar; a closed frame structure supporting the plate-shaped mirror and completely framing an edge of the plate-shaped mirror; a spring arrangement having at least two spring structures arranged mirror-symmetrically and connecting the closed frame structure to a stationary support structure, the spring arrangement being configured such that the closed frame structure and the plate-shaped mirror can be brought into a resonant vibrational state with respect to the support structure; and a connecting arrangement having at least four connecting spring structures arranged mirror-symmetrically and each connecting the plate-shaped mirror to the closed frame structure; the connecting spring structures being configured to be elastically deformable and arranged such that they deform back and forth in the resonant vibrational state so that the plate-shaped mirror is partially mechanically decoupled from the closed frame structure.

An optical module 1 includes: a mirror unit 2 including a base 21, a movable mirror 22, and a fixed mirror 16; a beam splitter unit 3 that is disposed on one side of the mirror unit 2 in a Z-axis direction; a light incident unit 4 that causes measurement light L0 to be incident to the beam splitter unit 3; a first light detector 6 that is disposed on the one side of the beam splitter unit 3 in the Z-axis direction, and detects interference light L1 of measurement light which is emitted from the beam splitter unit 3; a support 9 to which the mirror unit 2 is attached; a first support structure 11 that supports the beam splitter unit 3; and a second support structure 12 that is attached to the support 9 and supports the first light detector 6.

A movable device includes a movable portion including a reflecting surface; a pair of drive beams to support the movable portion rotatably around a predetermined rotation axis with the movable portion disposed between the pair of drive beams; and a support portion configured to support the pair of drive beams. The support portion has a light passing portion on each of both sides of the movable portion in a direction intersecting with the rotation axis in a plane along the reflecting surface in a state in which the movable portion is not rotated, the light passing portion allowing light reflected by the reflecting surface to pass through the light passing portion.

A microelectromechanical system (MEMS) device including an oscillator structure configured to oscillate about a rotation axis; a frame that is rotationally fixed, the frame including a frame recess within which the oscillator structure is suspended; and a suspension assembly mechanically coupled to and between the oscillator structure and the frame, the suspension assembly configured to suspend the oscillator structure within the frame recess. The suspension assembly includes a central support beam that extends lengthwise along the rotation axis, the central support beam being mechanically coupled to and between the oscillator structure and the frame; a first outer support beam mechanically coupled to the oscillator structure and laterally displaced from the central support beam in a first direction orthogonal to the rotation axis; and at least one first interior support beam directly coupled to and between the central support beam and the first outer support beam.

A micro-electro-mechanical system (MEMS) device may comprise a first layer that includes a stator comb actuator; a second layer that includes a rotor comb actuator; a mirror structure that includes a mirror; and a first set of hinges and a second set of hinges configured to tilt the mirror structure about a first axis of the MEMS device based on a driving torque caused by the stator comb actuator engaging with the rotor comb actuator. The first set of hinges may be configured to resist a lateral linear force on the mirror structure in a direction associated with the first axis caused by the stator comb actuator engaging with the rotor comb actuator. The second set of hinges may be configured to resist an in-plane torque on the mirror structure about a second axis of the MEMS device caused by the stator comb actuator engaging with the rotor comb actuator.

According to one embodiment, a sensor includes a base body, a first structure body, and a second structure body. The first structure body includes a first fixed portion, a first conductive portion, and first electrodes. The first fixed portion is fixed to the base body. The first conductive portion is held by the first fixed portion. The first conductive portion is separated from the base body in a first direction. The first electrodes are held by the first conductive portion. A distance between the base body and the first electrodes is changeable. The second structure body includes a second conductive portion and second electrodes. The second conductive portion is fixed to the base body. The second electrodes are held by the second conductive portion. One of the second electrodes is between the one of the first electrodes and the other one of the first electrodes.

According to an embodiment, a semiconductor device includes a first actuator, a second actuator, a first frame provided between the first actuator and the second actuator, a first connection member connecting the first actuator and the first frame to each other, a second connection member connecting the first actuator and the first frame to each other at a position different from a position at which the first connection member connects the first actuator and the first frame to each other, a third connection member connecting the second actuator and the first frame to each other, a fourth connection member connecting the second actuator and the first frame to each other at a position different from a position at which the third connection member connects the second actuator and the first frame to each other.

A micromechanical apparatus includes a substrate, a movable element disposed in a reference plane in an undeflected state, a transmission structure having a first transmission side coupled to the substrate, and a second transmission side coupled to the movable element, and an actuator configured to provide a force along a force direction parallel to the reference plane and apply the same to the first transmission side. The transmission structure is configured to transfer the force along the force direction to a movement of the movable element out of the reference plane.

A method for producing a MEMS device comprises fabricating a first semiconductor layer and selectively depositing a second semiconductor layer over the first semiconductor layer, wherein the second semiconductor layer comprises a first part composed of monocrystalline semiconductor material and a second part composed of polycrystalline semiconductor material. The method furthermore comprises structuring at least one of the semiconductor layers, wherein the monocrystalline semiconductor material of the first part and underlying material of the first semiconductor layer form a spring element of the MEMS device and the polycrystalline semiconductor material of the second part and underlying material of the first semiconductor layer form at least one part of a comb drive of the MEMS device.