B81B2203/0154

ARRAY OF HEATING RESISTORS FOR MEMS MIRRORS
20220204339 · 2022-06-30 ·

A micro-electromechanical system (MEMS) apparatus has an array of micro-mirrors and a control circuit for rotating the micro-mirrors synchronously at a resonant frequency. An array of heating resistors is used to heat the array of micro-mirrors compensate for changes in resonant frequency with temperature. A temperature sensor is mounted proximate the chip package for detecting a temperature proximate the array of micro-mirrors. A temperature control circuit, coupled to the temperature sensor and the array of heating resistors, provides current to the array of heating resistors in response to a change in temperature that will change the resonant frequency.

Microelectromechanical mirror device with piezoelectric actuation, having an improved structure

A microelectromechanical mirror device has a fixed structure defining a cavity. A tiltable structure carrying a reflecting surface is elastically suspended above the cavity with a main extension in a horizontal plane. Elastic elements are coupled to the tiltable structure and at least one first pair of driving arms, which carry respective regions of piezoelectric material, are biasable to cause rotation of the tiltable structure about at least one first axis of rotation parallel to a first horizontal axis of the horizontal plane. The driving arms are elastically coupled to the tiltable structure on opposite sides of the first axis of rotation and are interposed between the tiltable structure and the fixed structure. The driving arms have a thickness, along an orthogonal axis transverse to the horizontal plane, smaller than a thickness of at least some of the elastic elements coupled to the tiltable structure.

Accelerometer Contact Microphones And Methods Thereof
20230276171 · 2023-08-31 ·

Small form-factor MEMS devices and methods of using the devices. An exemplary MEMS device includes an ACM. Certain devices comprise nanometer scale sensing gaps in the out-of-plane direction to increase vibration sensitivity in a vacuum casing. Certain devices described herein provide a differential sensing mechanism. Accelerometer contact microphones having an operational bandwidth ranging from 0 Hz and 10,000 Hz are also disclosed. The vibration acceleration sensitivity of certain devices described herein is better 100 μg√Hz.

Actuator device

An actuator device includes a support portion, a movable portion, a connection portion which connects the movable portion to the support portion on a second axis, a first wiring which is provided on the connection portion, a second wiring which is provided on the support portion, and an insulation layer which includes a first opening exposing a surface opposite to the support portion in a first connection part located on the support portion in one of the first wiring and the second wiring and covers a corner of the first connection part. The rigidity of a first metal material forming the first wiring is higher than the rigidity of a second metal material forming the second wiring. The other wiring of the first wiring and the second wiring is connected to the surface of the first connection part in the first opening.

Optical device

An optical device includes: a base that includes a main surface; a movable unit that includes an optical function unit; and an elastic support unit that is connected between the base and the movable unit, and supports the movable unit so that the movable unit is movable along a first direction perpendicular to the main surface. The elastic support unit includes a lever, a first torsion support portion that extends along a second direction perpendicular to the first direction and is connected between the lever and the movable unit, and a second torsion support portion that extends along the second direction and is connected between the lever and the base. A torsional spring constant of the first torsion support portion is greater than a torsional spring constant of the second torsion support portion.

MICROMECHANICAL COMPONENT FOR A CAPACITIVE SENSOR OR SWITCH DEVICE
20220155168 · 2022-05-19 ·

A micromechanical component for a capacitive sensor or switch device, having a substrate having a substrate surface, a diaphragm mounted on the substrate surface having a self-supporting region, at least one lever element and at least one first electrode connected to the at least one lever element. The at least one lever element is connected to the diaphragm in such a way that when there is a warping of the self-supporting region of the diaphragm the at least one lever element is set into a rotational movement, whereby the at least one connected first electrode is set into a first adjustment movement oriented at an angle to the substrate surface. The at least one lever element and the at least one first electrode connected to the at least one lever element are situated between the substrate surface and the diaphragm inner side of the self-supporting region of the diaphragm.

Batch Fabrication of MEMS Scanning Mirror
20220137397 · 2022-05-05 · ·

Methods are disclosed for manufacturing a Micro-ElectroMechanical Systems (MEMS) scanning mirror. In an embodiment, one method includes depositing a hinge material on a substrate and removing first and second portions of the substrate to form an outer frame, an inner frame, and a mirror plate in the substrate. First and second portions of the hinge material rotationally couple the outer frame to the inner frame and the inner frame to the mirror plate for rotation about first and second orthogonal axes of rotation. In another embodiment, a third portion of the substrate rotationally couples the inner frame to the mirror plate. In still another embodiment, an elastomer material is configured as a bending hinge that rotationally couples the outer frame to the inner frame.

MEMS DEVICE HAVING AN IMPROVED STRESS DISTRIBUTION AND MANUFACTURING PROCESS THEREOF

A MEMS device is formed by a body of semiconductor material which defines a support structure. A pass-through cavity in the body is surrounded by the support structure. A movable structure is suspended in the pass-through cavity. An elastic structure extends in the pass-through cavity between the support structure and the movable structure. The elastic structure has a first and second portions and is subject, in use, to mechanical stress. The MEMS device is further formed by a metal region, which extends on the first portion of the elastic structure, and by a buried cavity in the elastic structure. The buried cavity extends between the first and the second portions of the elastic structure.

Mirror device

In order to expand the surface area of a reflective layer, the space between adjacent turns of a drive coil, which is wound a plurality of turns on a peripheral edge front surface of the principal surface of a movable portion which, being inside a frame-formed support substrate, is connected to the support substrate by torsion bars, is filled and flattened with a smoothing layer, thereby adopting a configuration such that the reflective layer can also be provided in the region of the upper surface of the drive coil.

Optical device

In an optical device, an elastic support unit includes a pair of levers which face in a second direction perpendicular to a first direction, a pair of first torsion support portions which are connected between the levers and the base, a pair of second torsion support portions which are connected between the pair of levers and the movable unit, and a first link member that bridges the levers. The levers and the first link member define a light passage opening. Each of connection positions between the levers and the first torsion support portions is located on a side opposite to the movable unit with respect to the center of the light passage opening in a third direction perpendicular to the first direction and the second direction. A maximum width of the light passage opening in the second direction is defined by a gap between the levers in the second direction.