A MEMS gyroscope includes a driven mass that moves in response to a drive force. A drive amplitude sense electrode is included as a feature of the drive mass and extends in a direction perpendicular to the drive direction. A change in capacitance is measured based on the relative location of the drive amplitude sense electrode to a known fixed position, which in turn is used to accurately determine a location of the driven mass.

A method of manufacturing a semiconductor structure comprising: depositing a first layer in contact with a first surface area of a substrate; depositing a second layer in contact with a second surface area of the substrate, the second surface area substantially co-planar with and outwards of the first surface area; depositing a third layer in contact with the first layer and the second layer; removing a portion of the third layer to expose a portion of the first layer; and removing at least a portion of the first layer to create a cavity between the substrate, the second layer and the third layer.

A hinge between a support and a movable part in an out-of-plane direction of a microelectromechanical structure includes two torsion beams, and two bending elements connecting the movable part and the support and each comprising two beams extending perpendicularly to the axis of rotation. Each beam is connected to the support by a first end and to the movable part by a second end, the first ends and the second ends of the beams being disposed with respect to one another in such a way that the orientation of the first end towards the second end of one beam is opposite to the orientation of the first end towards the second end of the other beam.

A package structure includes a first substrate and a first device disposed on the first substrate. The first device includes at least one anchor structure, a film structure anchored by the anchor structure and an actuator configured to control the film structure to form a first vent temporarily. The film structure partitions a space into a first volume to be connected to an ear canal and a second volume connected to an ambient of a wearable sound device. The ear canal and the ambient are connected via the first vent when the first vent is opened. The first vent is opened by controlling a first membrane portion and a second membrane portion of the film structure, such that a difference between a first displacement of the first membrane portion and a second displacement of the second membrane portion is larger than a thickness of the film structure.

Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) structure including a composite spring. A first substrate underlies a second substrate. A third substrate overlies the second substrate. The first, second, and third substrates at least partially define a cavity. The second substrate comprises a moveable mass in the cavity and between the first and third substrates. The composite spring extends from a peripheral region of the second substrate to the moveable mass. The composite spring is configured to suspend the moveable mass in the cavity. The composite spring includes a first spring layer comprising a first crystal orientation, and a second spring layer comprising a second crystal orientation different than the first crystal orientation.

A MEMS device includes a body pivoting around a pivot axis, a support, and a suspension structure mechanically coupling the body to the support. The suspension structure includes a torsion element defining the pivot axis, and first and second spring elements extending with an angle relative to the pivot axis on opposing sides of the torsion element so that a distance between at least portions of the first and second spring elements is changing in the direction of the pivot axis. The extension of the first and second spring elements in the direction of the pivot axis is larger than the extension of the torsion element in the direction of the pivot axis.

A microelectromechanical device includes a fixed structure having a frame defining a cavity, a tiltable structure elastically suspended above the cavity with main extension in a horizontal plane, a piezoelectrically driven actuation structure which can be biased to cause a desired rotation of the tiltable structure about a first and second rotation axes, and a supporting structure integral with the fixed structure and extending in the cavity starting from the frame. Lever elements are elastically coupled to the tiltable structure at a first end by elastic suspension elements and to the supporting structure at a second end by elastic connecting elements which define a lever rotation axis. The lever elements are elastically coupled to the actuation structure so that their biasing causes the desired rotation of the tiltable structure about the first and second rotation axes.

Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A two-fold symmetric switch may be formed by a primary, secondary, and optionally tertiary set of voids formed in the movable plate. These voids may define the spring beams which provide a stable and reliable restoring force to the switch.

A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

A semiconductor structure includes a substrate, a sensing device disposed over the substrate and including a plurality of protruding members protruded from the sensing device; a sensing structure disposed adjacent to the sensing device and including a plurality of sensing electrodes protruded from the sensing structure towards the sensing device; and an actuating structure disposed adjacent to the sensing device and configured to provide an electrostatic force on the sensing device based on a feedback from the sensing structure. Further, a method of manufacturing the semiconductor structure is also disclosed.