A hinge between a first part and a second part of a microelectromechanical system including a first element and a second element free to move relative to each other in an out-of-plane direction is disclosed. The hinge includes a first rigid part; a second part fixed to a first face of the first part by one end and anchored to the second element by a second end, the second part deforming in bending in the out-of-plane direction; and a third part fired to a first face of the first part by a second end, and anchored to the first element by a second end, the third part deforming in bending in the out-of-plane direction. In an undeformed state, the second part and the third part each includes one face located in the same plane orthogonal to the out-of-plane direction.

A MEMS inertial sensor includes a supporting structure and an inertial structure. The inertial structure includes at least one inertial mass, an elastic structure, and a stopper structure. The elastic structure is mechanically coupled to the inertial mass and to the supporting structure so as to enable a movement of the inertial mass in a direction parallel to a first direction, when the supporting structure is subjected to an acceleration parallel to the first direction. The stopper structure is fixed with respect to the supporting structure and includes at least one primary stopper element and one secondary stopper element. If the acceleration exceeds a first threshold value, the inertial mass abuts against the primary stopper element and subsequently rotates about an axis of rotation defined by the primary stopper element. If the acceleration exceeds a second threshold value, rotation of the inertial mass terminates when the inertial mass abuts against the secondary stopper element.

A micromechanical z-inertial sensor includes a substrate; a movable seismic mass in a micromechanical functional layer; a torsion spring connected to the movable seismic mass and about which the seismic mass able to rotate; an electrode layer below the seismic mass and that, in an outer region is connectible to a potential of the substrate and is connected to the seismic mass via an insulating layer; and electrodes at a distance above and below an inner region of the electrode surface.

A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.

For manufacturing an optical microelectromechanical device, a first wafer of semiconductor material having a first surface and a second surface is machined to form a suspended mirror structure, a fixed structure surrounding the suspended mirror structure, elastic supporting elements which extend between the fixed structure and the suspended mirror structure, and an actuation structure coupled to the suspended mirror structure. A second wafer is machined separately to form a chamber delimited by a bottom wall having a through opening. The second wafer is bonded to the first surface of the first wafer in such a way that the chamber overlies the actuation structure and the through opening is aligned to the suspended mirror structure. Furthermore, a third wafer is bonded to the second surface of the first wafer to form a composite wafer device. The composite wafer device is then diced to form an optical microelectromechanical device.

A microphone includes a substrate having a first sound hole formed therein, a sound-sensing module mounted on the substrate so as to be aligned with the first sound hole, a signal-processing chip mounted on the substrate so as to be electrically connected to the sound-sensing module, a cover mounted on the substrate so as to accommodate the sound-sensing module therein and including a filter accommodation portion having a second sound hole formed therein, and a sound delay filter elastically accommodated in the filter accommodation portion so as to be aligned with the second sound hole. The microphone has a simplified structure, and can be manufactured to as to improve the stability and reliability thereof.

An apparatus for deflecting with respect to one or more axes a device mounted on the apparatus, the apparatus comprising: a mounting support; a device chassis defining a plane and a clockwise direction in the plane, wherein the device chassis comprises two or more arm bridges, wherein a first arm bridge is extending from a first side of the device chassis and a second arm bridge is extending from a second and opposite side of the device chassis. One or more arm bridges comprising a first arm extending continuously in a clockwise direction to a first standoff and a second arm extending continuously in an anti-clockwise direction to a second standoff. The apparatus comprising one or more standoff supports comprised between each standoff and the mounting support.

A device for converting mechanical energy to electrical energy that include a mechanical device comprising a seismic mass flexibly connected to a base by at least one spring, a mechano-electric transducer that is associated with the mechanical device for converting mechanical energy of the seismic mass to electric energy, and an electric circuit that is connected to the mechano-electric transducer in a way that electric current is generated in the electric circuit when the seismic mass moves relative to the base. The mechano-electric transducer is designed to adjust a force that the mechano-electric transducer can exert on the mechanical device and by that to control the conversion level of the mechanical energy to the electrical energy.

A device includes a micro-electromechanical system (MEMS) device layer comprising a proof mass. The proof mass includes a first proof mass portion and a second proof mass portion. The first proof mass portion is configured to move in response to a stimuli. The second proof mass portion has a spring attached thereto. The device further includes a substrate disposed parallel to the MEMS device layer. The substrate comprises a bumpstop configured to limit motion of the first proof mass portion. The device includes a first electrode disposed on the substrate facing the second proof mass portion. The first electrode is configured to apply a pulling force onto the second proof mass portion and to move the second proof mass portion towards the first electrode.

A method to create a multi-zone microstructure spring includes releasing a buckling layer from a substrate, wherein the buckling layer displaces into a curved shape after the releasing. The buckling layer is displaced, relative to the substrate, through at least one of a first zone, a second zone, and a third zone, wherein the buckling layer provides positive stiffness in the first zone, zero stiffness in a second zone, and negative stiffness in a third zone, and the buckling layer must pass through the first zone to reach the second zone and the buckling layer must pass through the second zone to reach the third zone. A multi-zone microstructure spring includes a substrate and a buckling layer. The buckling layer has a surface area. The buckling layer has a positive stiffness in a first zone, zero stiffness in a second zone, and a negative stiffness in a third zone. The buckling layer must pass through the first zone to reach the second zone and the buckling layer must pass through the second zone to reach the third zone. The buckling layer is connected to the substrate. The microstructure includes an elastic connection. The elastic connection is in contact with the buckling layer over a fraction of the buckling layer's surface area.