Patent classifications
B81B2203/0163
MICROPHONE AND MANUFACTURING METHOD THEREOF
A microphone includes a substrate having a first sound hole formed therein, a sound-sensing module mounted on the substrate so as to be aligned with the first sound hole, a signal-processing chip mounted on the substrate so as to be electrically connected to the sound-sensing module, a cover mounted on the substrate so as to accommodate the sound-sensing module therein and including a filter accommodation portion having a second sound hole formed therein, and a sound delay filter elastically accommodated in the filter accommodation portion so as to be aligned with the second sound hole. The microphone has a simplified structure, and can be manufactured to as to improve the stability and reliability thereof.
MICRO-ACOUSTIC RESONATOR SPRINGY ANCHOR BASED ON OFFSET ACOUSTIC REFLECTOR TRENCHES
A circuit includes: integrated circuit (IC) layers; a cavity formed in at least one of the IC layers; and a micro-acoustic resonator suspended in the cavity by an anchor. The anchor includes: a bridge portion coupled to the micro-acoustic resonator and extending over the cavity; a first acoustic reflector portion adjacent the bridge portion, extending over the cavity, and oriented differently than the bridge portion; and a second acoustic reflector portion adjacent the first acoustic reflector portion, extending over the cavity, and oriented differently than the first acoustic reflector portion.
MEMS INERTIAL SENSOR WITH HIGH RESISTANCE TO STICTION
An inertial structure is elastically coupled through a first elastic structure to a supporting structure so as to move along a sensing axis as a function of a quantity to be detected. The inertial structure includes first and second inertial masses which are elastically coupled together by a second elastic structure to enable movement of the second inertial mass along the sensing axis. The first elastic structure has a lower elastic constant than the second elastic structure so that, in presence of the quantity to be detected, the inertial structure moves in a sensing direction until the first inertial mass stops against a stop structure and the second elastic mass can move further in the sensing direction. Once the quantity to be detected ends, the second inertial mass moves in a direction opposite to the sensing direction and detaches the first inertial mass from the stop structure.
Vehicle operator awareness system
Systems and methods for maintaining autonomous vehicle operator awareness are provided. A method can include determining, by a computing system, an awareness challenge for an operator of a vehicle. The awareness challenge can be based on object data. The awareness challenge can have one or more criteria. The criteria can include a challenge response interval, a response time, and an action for satisfying the awareness challenge. The method can include initiating, by the computing system, a timer measuring elapsed time from a start time of the challenge response interval. The method can include communicating to the operator, by the computing system, a soft notification indicative of the awareness challenge during the challenge response interval. The method can include determining, by the computing system, whether the operator provides a user input after the response time interval and whether the user input corresponds to the action for satisfying the awareness challenge.
MEMS SENSOR STRUCTURE COMPRISING MECHANICALLY PRELOADED SUSPENSION SPRINGS
A MEMS sensor comprising preloaded suspension springs and a method for mechanically preloading suspension springs of a MEMS sensor are described. The MEMS sensor comprises a MEMS support structure; a plurality of suspension springs connected to said support structure; and, a proof mass flexibly suspended by said suspension springs; wherein at least one of said suspension springs is mechanically preloaded with a compressive force for reducing the natural frequency of said proof mass.
Micromechanical device having a decoupled micromechanical structure
A micromechanical device having a substrate wafer, a functional layer situated above it which has a mobile micromechanical structure, and a cap situated on top thereof, having a first cavity, which is formed at least by the substrate wafer and the cap and which includes the micromechanical structure. The micromechanical device has a fixed part and a mobile part, which are movably connected to each other with at least one spring element, and the first cavity is situated in the mobile part. Also described is a method for producing the micromechanical device.
Micromechanical spring structure
A micromechanical spring structure, including a spring beam and a rigid micromechanical structure, the spring beam including a first end and an opposing second end along a main extension direction. The spring beam includes a fork having two support arms on at least one of the two ends, which is anchored to the rigid micromechanical structure, the two support arms being anchored to a surface of the rigid micromechanical structure, which extends perpendicular to the main extension direction of the spring beam.
Robust method for gyroscope drive amplitude measurement
A MEMS gyroscope includes a driven mass that moves in response to a drive force. A drive amplitude sense electrode is included as a feature of the drive mass and extends in a direction perpendicular to the drive direction. A change in capacitance is measured based on the relative location of the drive amplitude sense electrode to a known fixed position, which in turn is used to accurately determine a location of the driven mass.
Ultrasonic MEMS acoustic transducer with reduced stress sensitivity and manufacturing process thereof
An ultrasonic MEMS acoustic transducer formed in a body of semiconductor material having first and second surfaces opposite to one another. A first cavity extends in the body and delimits at the bottom a sensitive portion, which extends between the first cavity and the first surface of the body. The sensitive portion houses a second cavity and forms a membrane that extends between the second cavity and the first surface of the body. An elastic supporting structure extends between the sensitive portion and the body and is suspended over the first cavity.
MEMS actuator structures resistant to shock
Shock-resistant MEMS structures are disclosed. In one implementation, a motion control flexure for a MEMS device includes: a rod including a first and second end, wherein the rod is tapered along its length such that it is widest at its center and thinnest at its ends; a first hinge directly coupled to the first end of the rod; and a second hinge directly coupled to the second of the rod. In another implementation, a conductive cantilever for a MEMS device includes: a curved center portion includes a first and second end, wherein the center portion has a point of inflection; a first root coupled to the first end of the center portion; and a second root coupled to the second end of the center portion. In yet another implementation, a shock stop for a MEMS device is described.