The present disclosure relates to an optical scanner package comprising a scanner element, a lower substrate having an inner space, and a semi-spherical transmissive window. The semi-spherical transmissive window has different inclinations in an incident position thereof and in an emission position thereof, and interference caused by sub-reflection can thus be reduced. Since the incident angle α and the maximum emission angle β are small, anti-reflection coating design is easy, and light loss can be reduced. There is an advantage in that, even when the optical scanning angle (OSA) γ of a laser is large, the maximum emission angle β is small, and emitted laser light thus has a small change in characteristics. In addition, since there are curvatures on both sides of two axes, there is little restriction regarding the incident direction even in the case of two-axis driving.

A micro-electromechanical system (MEMS) device comprises a fixed portion and a proofmass suspended by at least one composite beam. The composite beam is cantilevered relative to the fixed portion and extends between a first end that is integrally formed with the fixed portion and a second distal end. The composite beam comprises an insulator having a top surface and at least two side surfaces; a conductor extending away from the fixed portion and surrounding at least a portion of the insulator; and a second conductor positioned adjacent to the top surface of the conductor and extending parallel with the insulator away from the fixed portion. The second conductor is separated from the first conductor to provide a low parasitic conductance of the composite beam.

An electrostatic device includes: a fixed portion, a moveable portion, and an elastically-supporting portion that are formed in a same substrate; and a first glass package and a second glass package that are anodically bonded to each other on one and the other of front and back surfaces of the substrate with the fixed portion and the elastically-supporting portion separated from each other, the second glass package forms a sealed space in which the moveable portion is arranged between the first and second glass packages, an electret is formed at least partially in the fixed portion and the moveable portion, and a first electrode connected to the fixed portion and exposed on an outer surface of the second glass package and a second electrode connected to the elastically-supporting portion and exposed on the outer surface of the second glass package are formed in the second glass package.

A pressure sensor includes a base, a sensor facing the base in a height direction with a space between the sensor and the base to sense pressure applied to a sensing surface on a side opposite to the base in the height direction, a surrounding portion raised in the height direction from the base and surrounding the sensor with a groove extending around the sensor, between the surrounding portion and the sensor, a coupling portion coupling the sensor with the surrounding portion, and a beam in the groove to apply a resistance to the surrounding portion moving toward the sensor.

A micro-electromechanical system (MEMS) device includes a movable comb structure located in a cavity within an enclosure, and a stationary structure affixed to the enclosure. The movable comb structure includes a comb shaft portion and movable comb fingers laterally protruding from the comb shaft portion. The movable comb structure includes a metallic material portion. The movable structure and the stationary structure are configured to generate an electrical output signal based on lateral movement of the movable structure relative to the stationary structure.

The micromirror device includes: a movable portion having a mirror portion on which a reflecting surface for reflecting incident light is formed; a first support portion that is connected to the movable portion on a first axis located in a plane including the reflecting surface of the mirror portion in a stationary state, and that swingably supports the movable portion around the first axis; and a pair of first actuators that are connected to the first support portion and face each other across the first axis, each of which being a piezoelectric drive type first actuator that allows the movable portion to swing around the first axis, in which in a case where the movable portion swings around the first axis, at least a part of the first actuator swings around the first axis in a phase opposite to a phase of the movable portion, and assuming that a ratio of a rotation angle of the first actuator to a rotation angle of the movable portion is R, 0<R<1.00 is satisfied.

Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge. In some embodiments, the MEMS devices comprise a charge transfer circuit for providing the amount of charge.

A semiconductor structure includes a substrate; a sensing device disposed over the substrate and including a plurality of protruding members protruded from the sensing device; a sensing structure disposed adjacent to the sensing device and including a plurality of sensing electrodes protruded from the sensing structure towards the sensing device; and an actuating structure disposed adjacent to the sensing device and configured to provide an electrostatic force on the sensing device based on a feedback from the sensing structure. Further, a method of manufacturing the semiconductor structure is also disclosed.

A piezoelectric microelectromechanical systems microphone is provided comprising a substrate including at least one wall defining a cavity, the at least one wall defining an anchor region around a perimeter, a piezoelectric film layer forming a membrane, the piezoelectric film layer being supported at the anchor region by a spring region, and an electrode disposed over the piezoelectric film layer. A method of manufacturing such a MEMS microphone is also provided.

A device includes a micro-electromechanical system (MEMS) device layer comprising a proof mass. The proof mass includes a first proof mass portion and a second proof mass portion. The first proof mass portion is configured to move in response to a stimuli. The second proof mass portion has a spring attached thereto. The device further includes a substrate disposed parallel to the MEMS device layer. The substrate comprises a bumpstop configured to limit motion of the first proof mass portion. The device includes a first electrode disposed on the substrate facing the second proof mass portion. The first electrode is configured to apply a pulling force onto the second proof mass portion and to move the second proof mass portion towards the first electrode.