A micromechanical micromirror array including a frame including a cutout, a micromirror device suspended on the frame in the area of the cutout in a first plane, a first pivoting vane device suspended on the frame protruding into the area of the cutout, coupled to the micromirror device via a first spring device, a second pivoting vane device suspended on the frame protruding into the area of the cutout, coupled to the micromirror device via a second spring device, a first drive device for deflecting the first pivoting vane device along a first axis, perpendicular to the first plane, and a second drive device for the antiphase deflection of the second pivoting vane device along the first axis.

A MEMS includes a substrate having a cavity, and a moveable element arranged in the cavity, the moveable element including a first electrode, a second electrode and a third electrode that is arranged between the first electrode and the second electrode and is fixed in an electrically insulated manner from the same at discrete areas. The moveable element is configured to perform a movement along a movement direction in a substrate plan in response to an electric potential between the first electrode and the third electrode or in response to an electric potential between the second electrode and the third electrode. A dimension of the third electrode perpendicular to the substrate plane is lower than a dimension of the first electrode and a dimension of the second electrode perpendicular to the substrate plane.

A camera system incorporating a MEMS actuator to achieve focus adjustments to compensate for the thermal expansion of the lens assembly is disclosed. The camera comprises a lens barrel, lens holder, infra-red (IR) filter, board circuit, MEMS actuator, housing package for the actuator, and an image sensor. The image sensor is directly wire bonded to pads on the circuit board such that these pads are movable at the image sensor end and fixed at the circuit board end. When the camera is exposed to temperature variations, the MEMS actuator moves the sensor along the optical axis to maintain the image in focus.

A sensor device includes a first and second Micro-Electro-Mechanical (MEM) structures. The first MEM structure includes a first heating element on a first layer of the first MEM structure. The first heating element includes an input adapted to receive an input signal. The first MEM structure also includes a first temperature sensing element on a second layer of the first MEM structure. The second MEM structure includes a second heating element on a first layer of the second MEM structure and a second temperature sensing element on a second layer of the second MEM structure. An output circuit has a first input coupled to the first temperature sensing element and a second input coupled to the second temperature sensing element.

The invention provides a method for preparing a MEMS conductive part and a conductive coating. A conductive unit includes a fixed member, a moving member which can reciprocate relative to the fixed member, and a plurality of groups of conductive electroplating layers which are electrically connected with the moving member and the fixed member, the moving member includes a first wall and a second wall connected with the first wall, and the fixed member includes a first wall connected with the first wall. The end components (fixed and moving components) displace relatively freely and transmit electric signals at the same time.

A method for manufacturing a microelectromechanical systems (MEMS) structure with sacrificial supports to prevent stiction is provided. A first etch is performed into an upper surface of a carrier substrate to form a sacrificial support in a cavity. A thermal oxidation process is performed to oxidize the sacrificial support, and to form an oxide layer lining the upper surface and including the oxidized sacrificial support. A MEMS substrate is bonded to the carrier substrate over the carrier substrate and through the oxide layer. A second etch is performed into the MEMS substrate to form a movable mass overlying the cavity and supported by the oxidized sacrificial support. A third etch is performed into the oxide layer to laterally etch the oxidized sacrificial support and to remove the oxidized sacrificial support. A MEMS structure with anti-stiction bumps is also provided.

A micromechanical pressure sensor device and a corresponding manufacturing method. The micromechanical pressure sensor device is equipped with a sensor substrate; a diaphragm system that is anchored in the sensor substrate and that includes a first diaphragm and a second diaphragm situated spaced apart therefrom, which are circumferentially connected to one another in an edge area and enclose a reference pressure in an interior space formed in between; and a plate-shaped electrode that is suspended in the interior space and that is situated spaced apart from the first diaphragm and from the second diaphragm and forms a first capacitor with the first diaphragm and forms a second capacitor with the second diaphragm. The first diaphragm and the second diaphragm are designed in such a way that they are deformable toward one another when acted on by an external pressure.

A MEMS device formed using the materials of the BEOL of a CMOS process where a post-processing of vHF and post backing was applied to form the MEMS device and where a total size of the MEMS device is between 50 um and 150 um. The MEMS device may be implemented as an inertial sensor among other applications.

A MEMS angular rate sensor is presented with two pairs of suspended masses that are micromachined on a semiconductor layer. A first pair includes two masses opposite to and in mirror image of each other. The first pair of masses has driving structures to generate a mechanical oscillation in a linear direction. A second pair of masses includes two masses opposite to and in mirror image of each other. The second pair of masses is coupled to the first pair of driving masses with coupling elements. The two pairs of masses are coupled to a central bridge. The central bridge has a differential configuration to reject any external disturbances. Each of the masses of the two pairs of masses includes different portions to detect different linear and angular movements.

An actuator element of a MEMS device on a substrate is provided to create large, out-of-plane deflection. The actuator element includes a metallic layer having a first portion contacting the substrate and a second portion having an end proximal to the first portion. A distal end is cantilevered over the substrate. A first insulating layer contacts the metallic layer on a bottom contacting surface of the second cantilevered portion from the proximal to the distal end. A second insulating layer contacts the metallic layer on a portion of a top contacting surface at the distal end. The second portion of the metallic layer is prestressed. A coefficient of thermal expansion of the first and second insulating layers is different than a coefficient of thermal expansion of the metallic layer. And, a Young's modulus of the first and second insulating layer is different than a Young's modulus of the metallic layer.