B81B2203/0338

Substrate assembly and method of bonding substrates

A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.

MICROFLUIDIC CHIP
20230137571 · 2023-05-04 ·

The present disclosure relates to a microfluidic chip. The microfluidic chip includes a first substrate, and the first substrate includes a sample input hole and a reaction region located downstream of the sample input hole. The reaction region includes at least one groove, an orthographic projection of each groove on the first substrate is an axisymmetric pattern, a width of the axisymmetric pattern in a first direction is not less than a width of the axisymmetric pattern in a second direction, and the first direction is perpendicular to the second direction.

Isotachophoresis for Purification of Nucleic Acids

The present disclosure relates to fluidic systems and devices for processing, extracting, or purifying one or more analytes. These systems and devices can be used for processing samples and extracting nucleic acids, for example by isotachophoresis. In particular, the systems and related methods can allow for extraction of nucleic acids, including non-crosslinked nucleic acids, from samples such as tissue or cells. The systems and devices can also be used for multiplex parallel sample processing.

Three-dimensional features formed in molded panel

Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.

Connected field effect transistors

Examples include a fluidic die. The fluidic die comprises an array of field effect transistors including field effect transistors of a first size and field effect transistors of a second size. At least one connecting member interconnects at least some of the field effect transistors of the array of field effect transistors. The fluidic die further comprises a first fluid actuator connected to a first set of field effect transistors having at least one field effect transistor of the first size. The die includes a second fluid actuator connected to a second respective set of field effect transistors having a first respective field effect transistor of the second size interconnected to at least one other field effect transistor of the array.

MEMS MICROPHONE AND METHOD OF MANUFACTURING THE SAME
20230382714 · 2023-11-30 ·

A MEMS microphone includes a substrate having a cavity, a diaphragm disposed above the cavity and having a ventilation path, and a back plate disposed above the diaphragm and having a plurality of air holes. The ventilation path includes a plurality of slits extending in a circumferential direction.

SYSTEMS AND METHODS FOR INTERFACING A METALLIC MICROCHANNEL AND A METALLIC CAPILLARY

Embodiments disclosed are systems and methods for interfacing a metallic capillary in a microchannel of a metallic body. A method may include inserting a portion of the metallic capillary into a portion the microchannel of the metallic body, sintering the portion of the metallic capillary to the portion of the microchannel of the metallic body, disposing a sacrificial powder at least proximate to the metallic capillary and the metallic body after sintering the portion of the metallic capillary and the portion of the microchannel of the metallic body, and infiltrating at least the portion of the metallic capillary sintered to the portion of the microchannel of the metallic body with an infiltrant in the presence of the sacrificial powder disposed at least proximate to the metallic capillary and the metallic body.

SYSTEMS AND METHODS FOR FABRICATING MICROFLUIDIC DEVICES

This disclosure describes techniques for fabricating a high-resolution, non-cytotoxic and transparent microfluidic device. A material can be selected based on having an optical property with a predetermined degree of transparency to provide viewability of a biological sample through the microfluidic device and a level of cytotoxicity within a predetermined threshold to provide viability of the biological sample within the microfluidic device. An additive manufacturing technique can be selected from a plurality of additive manufacturing techniques for fabricating the microfluidic device based on the selected material to provide a resolution of dimensions of one or more channels of the microfluidic device higher than a predetermined resolution threshold.

Plurality of filters

A method may include etching a number of holes into a carrier wafer layer to form a plurality of filters in the carrier wafer layer, patterning a chamber layer over a first side of the carrier wafer layer to form chambers above each filter formed in the carrier wafer layer, forming a layer over the chamber layer, grinding a second side of the carrier wafer layer to expose the number of holes etched into the carrier wafer layer, and bonding a molded substrate to the carrier wafer layer opposite the chamber layer.

MICROFLUIDIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
20220258185 · 2022-08-18 ·

A microfluidic device comprising: a first substrate (402,502,602,702,802) having a first assembling side (402a,702a, 802a); and a second substrate (404,504,604,704,804) having a second assembling side (404a, 504a, 604a, 804a) connectable with the first assembling side (402a,702a, 802a) to assemble the first substrate (402,502,602,702,802) and the second substrate (404,504,604,704,804) together. At least one of the first assembling side (402a,702a, 802a) and the second assembling side (404a, 504a, 604a, 804a) has a fluid chamber channel (406,706,806), and after the first substrate (402,502,602,702,802) and the second substrate (404,504,604,704,804) are connected together, the fluid chamber channel (406,706,806) forms a fluid chamber having a fluid inlet (408,608,708,808) and a fluid outlet (410,510,610,710,810). The at least one of the first assembling side (402a,702a, 802a) and the second assembling side (404a, 504a, 604a, 804a) having the fluid chamber channel (406,706,806) has an outlet expansion groove (418,518,618,718,818, 818) adjacent to and extending downstream from the fluid outlet (410,510,610,710,810), and wherein at the fluid outlet (410,510,610,710,810), an outer peripheral profile of the outlet expansion groove (418,518,618,718,818, 818) is located outside an outer peripheral profile of the fluid outlet (410,510,610,710,810).