A method of creating a polymer surface with surface structures is disclosed. The method includes creating a mold, forming a metal sheet into the molds, creating a surface structure on a surface of the metal sheet by exposing the surface to laser pulses, and bringing a curable polymer to be in contact with the surface of the metal sheet containing the surface structure, curing the curable polymer, and separating the cured polymer from the metal sheet, resulting in a polymer surface containing the surface structure. The polymer surfaces with the surface structures can be hydrophobic or superhydrophobic depending on the micro and nano features contained by the surface structures.

A method of creating a polymer surface with surface structures is disclosed. The method includes creating a mold, forming a metal sheet into the molds, creating a surface structure on a surface of the metal sheet by exposing the surface to laser pulses, and bringing a curable polymer to be in contact with the surface of the metal sheet containing the surface structure, curing the curable polymer, and separating the cured polymer from the metal sheet, resulting in a polymer surface containing the surface structure. The polymer surfaces with the surface structures can be hydrophobic or superhydrophobic depending on the micro and nano features contained by the surface structures.

In an assembly between a MEMS and/or NEMS electromechanical component and a casing, the electromechanical component includes at least one suspended and movable structure which is provided with at least one fixing zone, on which a region for receiving the casing is fixed, the suspended structure being at least partially formed in a cover for protecting the component or in a layer which is different from the one in which a sensitive element of the component is formed.

A MEMS device and a method of forming the same. A disclosed method includes: providing a silicon substrate layer, a buried oxide layer and a device silicon layer; using a microfabrication process to pattern a set of device features on the device silicon layer including a shuttle mass and an anchor frame; removing the silicon substrate layer and buried oxide below the shuttle mass; placing a shadow mask on a surface of the device silicon layer, wherein the shadow mask has an microscale opening to expose at least one device feature; and forming a nanoscale stopper on a sidewall of the at least one device feature by depositing a deposition material through the opening in a controlled manner.

Disclosed is a peeling method of a cover member including forming a recessed portion that opens one side surface of a substrate, on a region different from a region in which a pattern is formed and forming an opening region including the opening of the recessed portion; attaching the cover member so as to cover the one side surface; adjusting a pressure for increasing a pressure within a space formed by the recessed portion and the cover member by attaching the cover member to the substrate to be higher than a pressure on a side opposite to the space with the cover member interposed therebetween; and peeling off the cover member from the substrate, in a state where the pressure within the space is increased by the adjusting of the pressure.

The present disclosure provides a method for processing a conductive structure. The method includes the following steps of: forming on a first surface a groove concave from the first surface towards a second surface by means of dry etching; extending the groove from the second surface to form a via through a silicon base; and processing a conductive structure within the via. The method can be applied to a silicon base having a thickness larger than 300 m. It breaks the limit on thickness that can be processed in the related art and is capable of providing electrical connectivity on both sides of a silicon base. The method is simple and highly reliable, has high processing efficiency and is applicable to mechanized production.

A MEMS probe and manufacturing method thereof are provided. The method is mainly to form connected first-level, second-level, and third-level pin grooves on both sides of the silicon substrate through an etching process, followed by two electroplating processes to deposit nickel-cobalt-phosphorus alloy in the first-level pin groove to form the tip of the microprobe, and to deposit nickel-cobalt alloy in the second-level pin groove and the third-level pin to form the pin head and pin arm, thereby forming a three-level microprobe. A circuit substrate made of ceramic material is disposed with at least one window, the surface of the circuit substrate adjacent to the window is provided with a plurality of circuit pads, and the circuit substrate is abutted to the pin arm of the microprobe. The silicon substrate is then removed, to form a plurality of cantilever microprobes made of nickel-cobalt-phosphorus alloy and nickel-cobalt alloy on the circuit substrate.

A MEMS device and a method of forming the same. A disclosed method includes: providing a silicon substrate layer, a buried oxide layer and a device silicon layer; using a microfabrication process to pattern a set of device features on the device silicon layer including a shuttle mass and an anchor frame; removing the silicon substrate layer and buried oxide below the shuttle mass; placing a shadow mask on a surface of the device silicon layer, wherein the shadow mask has an microscale opening to expose at least one device feature; and forming a nanoscale stopper on a sidewall of the at least one device feature by depositing a deposition material through the opening in a controlled manner.

A method of creating a polymer surface with surface structures is disclosed. The method includes creating a mold, forming a metal sheet into the molds, creating a surface structure on a surface of the metal sheet by exposing the surface to laser pulses, and bringing a curable polymer to be in contact with the surface of the metal sheet containing the surface structure, curing the curable polymer, and separating the cured polymer from the metal sheet, resulting in a polymer surface containing the surface structure. The polymer surfaces with the surface structures can be hydrophobic or superhydrophobic depending on the micro and nano features contained by the surface structures.

Disclosed is a peeling method of a cover member including forming a recessed portion that opens one side surface of a substrate, on a region different from a region in which a pattern is formed and forming an opening region including the opening of the recessed portion; attaching the cover member so as to cover the one side surface; adjusting a pressure for increasing a pressure within a space formed by the recessed portion and the cover member by attaching the cover member to the substrate to be higher than a pressure on a side opposite to the space with the cover member interposed therebetween; and peeling off the cover member from the substrate, in a state where the pressure within the space is increased by the adjusting of the pressure.