Representative implementations of techniques, methods, and formulary provide repairs to processed semiconductor substrates, and associated devices, due to erosion or dishing of a surface of the substrates. The substrate surface is etched until a preselected portion of one or more embedded interconnect devices protrudes above the surface of the substrate. The interconnect devices are wet etched with a selective etchant, according to a formulary, for a preselected period of time or until the interconnect devices have a preselected height relative to the surface of the substrate. The formulary includes one or more oxidizing agents, one or more organic acids, and glycerol, where the one or more oxidizing agents and the one or more organic acids are each less than 2% of formulary and the glycerol is less than 10% of the formulary.

According to some embodiments, the present disclosure is directed to a printed circuit board for a microphone assembly that includes a top layer structured for a MEMS transducer to be mounted thereon, a bottom layer, at least one edge, a ground plane, and a conductor electrically connected to the ground plane and the bottom layer. The MEMS transducer includes a transducer substrate, a back plate and a diaphragm. The conductor extends vertically from the top layer to the bottom layer of the printed circuit board, and horizontally along a portion of a length of at least one edge of the printed circuit board. The printed circuit board includes two short edges and two long edges, and the conductor is connected to at least one of the four edges.

In a first aspect, the invention relates to a method for producing a via for a semiconductor component. The semiconductor component comprises a via region which is enclosed by vertical trenches. The vertical trenches are only partially filled with a dielectric, so that in particular the parasitic capacitances that occur have been considerably reduced.

In a second aspect, the invention relates to a semiconductor component produced by the method according to the invention.

A membrane is formed through processes including depositing a first piezoelectrical layer, depositing a first electrode layer over the first piezoelectrical layer, patterning the first electrode layer to form a first electrode, depositing a second piezoelectrical layer over the first electrode, depositing a second electrode layer over the second piezoelectrical layer, patterning the second electrode layer to form a second electrode, and depositing a third piezoelectrical layer over the second electrode. The third piezoelectrical layer, the second piezoelectrical layer, and the first piezoelectrical layer are etched to form a through-hole. The through-hole is laterally spaced apart from the first electrode and the second electrode. A first contact plug and a second contact plug are then formed to electrically connect to the first electrode and the second electrode, respectively.

A method including fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a hardmask on a second side of the device wafer, wherein the second side is planar. An etch stop layer is deposited over the hardmask and an exposed portion of the second side of the device wafer. A dielectric layer is formed over the etch stop layer. A via is formed within the dielectric layer. The via is filled with conductive material. A eutectic bond layer is formed over the conductive material. Portions of the dielectric layer uncovered by the eutectic bond layer is etched to expose the etch stop layer. The exposed portions of the etch stop layer is etched. A micro-electro-mechanical system (MEMS) device pattern is etched into the device wafer.

Systems and methods for 3D bioprinting of hydrogel voxels enable microfluidics-assisted digital assembly of spherical particles (DASP). The systems include a 3D motion system, a microfluidic printhead coupled to the 3D motion system, an extrusion device fluidly coupled to the microfluidic printhead, and a sacrificial support matrix. The sacrificial support matrix is designed to support the hydrogel voxels during printing and cross-link the hydrogel voxels. The system includes bio-inks comprising hydrogel compositions having independently controllable viscoelasticity and mesh size. The bio-inks are extruded by the extrusion device and microfluidic printhead to produce the hydrogel voxels. Exploiting the microfluidic printhead enables printing individual spherical hydrogel voxels with diameters from 150 micrometers (m) to 1200 m. Positioning and interconnection of the hydrogel voxels can be precisely controlled. The systems and methods produce free-standing 3D structures and can be used for producing functional tissue mimics.

A structure includes a molded structure, an integrated circuit (IC) die molded into the molded structure, the IC die including one of a fluidic channel or a sensor, an interposer structure molded into the molded structure, and a via structure embedded within the interposer structure, the via structure fluidically or electrically connecting a top surface of the interposer structure to a bottom surface of the interposer structure.

A MEMS audio device includes a first wafer having a top with a first cavity and a bottom with a vent hole coupled to the first cavity, wherein the bottom having first contacts, a second wafer disposed upon the first wafer having a flexible material layer disposed above the first cavity, a third wafer disposed upon the second wafer having physical contacts coupled to the second wafer, wherein the third wafer includes a second cavity disposed above the flexible material layer, a wiring wafer disposed below the first wafer having a second vent hole coupled to the first cavity, wherein the wiring wafer having second contacts coupled to the first contacts, and wherein the flexible material layer forms a diaphragm for the MEMS audio device.

A membrane is formed through processes including depositing a first piezoelectrical layer, depositing a first electrode layer over the first piezoelectrical layer, patterning the first electrode layer to form a first electrode, depositing a second piezoelectrical layer over the first electrode, depositing a second electrode layer over the second piezoelectrical layer, patterning the second electrode layer to form a second electrode, and depositing a third piezoelectrical layer over the second electrode. The third piezoelectrical layer, the second piezoelectrical layer, and the first piezoelectrical layer are etched to form a through-hole. The through-hole is laterally spaced apart from the first electrode and the second electrode. A first contact plug and a second contact plug are then formed to electrically connect to the first electrode and the second electrode, respectively.

A microelectromechanical system (MEMS) device includes: a mechanical layer; a second layer; and a via coupled between the mechanical layer and the second layer. The via comprising a metal layer having a bottom and sides, and oxide on the bottom of the metal layer between the sides of the metal layer.