A method for forming a biological microdevice includes applying a biocompatible coarse scale additive process with an additive device and a biocompatible material to form an object. The coarse scale is a dimension not less than about 100 m. The method also includes applying a biocompatible fine scale subtractive process with a subtractive device to the object. The fine scale is a dimension not greater than about 1000 m. The method also includes moving the object between the additive device and the subtractive device. A system is also provided for performing the above method and includes the additive device, the subtractive device, a means for transporting the object between the additive device and subtractive device and a processor with a memory including instructions to perform one or more of the above method steps.

A microstructured substrate includes a plurality of at least one elementary microstructure. An electrical storage device, and more particularly an all-solid-state battery, can include the microstructured substrate.

In an embodiment, an article having an impact textured surface comprises a plurality of vertical pillars; and a plurality of annular impact features; wherein a first portion of the vertical pillars is located in an annulus of the plurality of annular impact features and a second portion of the vertical pillars is located in an area around the plurality of annular impact features; wherein a height of the plurality of annular impact features is at least 10 nanometers greater than a height of the plurality of vertical pillars. In another embodiment, a method of making the article comprises molding the impact textured surface from a mold comprising a plurality of holes and a plurality of annular track features; wherein the plurality of holes corresponds to the plurality of pillars and the plurality of annular track features corresponds to the plurality of annular impact features.

A microfluidic device, including a controllable shape-changing micropillar where a shape of the shape-changing micropillar is changed by a fluid.

A microfluidic device, including a matrix array of controllable shape-changing micropillars where a shape of the shape-changing micropillars is changed by a fluid.

The method comprises contacting a silicon substrate with a silver salt and an acid for a time effective to produce spikes having a first end disposed on the silicon substrate and a second end extending away from the silicon substrate. The spikes have a second end diameter of about 10 nm to about 200 nm, a height of about 100 nm to 10 micrometers, and a density of about 10 to 100 per square microns. The nanostructures provide antimicrobial properties and can be transferred to the surface of various materials such as polymers.

Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.

A test probe head for probe testing multiple chips on a wafer in a single probing. A probe head substrate includes an array of probe tip attach pads on one surface. The array includes a subarray for each probe head chip test site. Probe tips attached to each probe tip attach pad have an across the head tip height variation less than one micrometer (1 m). The subarray probe tips may be on a pitch at or less than fifty microns (50 m). The test probe head may be capable of test probing all chips in a quadrant and even up to all chips on a single wafer in a single probing.

A microelectromechanical system (MEMS) sensor assembly comprises a substrate, a bump stopper extending from the substrate, and a sensor suspended relative to the substrate. The sensor is configured to move relative to the substrate, wherein the bump stopper is configured to restrain the sensor travel distance and prevent contact between the sensor and the substrate. The bump stopper has a surface facing the sensor, wherein an area of contact between the sensor and the surface is less than the total area of the surface.

A photothermal nanostructure device for photothermal heating includes a substrate having a first thermal conductivity, a light absorbing layer on a first side of the substrate and configured to absorb light in a wavelength range and to heat the substrate, and a thermally-insulative layer on the light absorbing layer and configured to reduce heat dissipation from the substrate, the thermally-insulative layer having a second thermal conductivity less than the first thermal conductivity.