A method for producing a micro-pattern on surface of a wire is disclosed. The method includes a step of applying a nanoparticle solution to the wire to form a nanoparticle solution layer on the surface of the wire; and a step of irradiating the nanoparticle solution layer with a Bessel beam laser to induce sintering of nanoparticles, thereby forming a micro-pattern on the surface of the wire. It is possible to form a microelectrode pattern on a level of several to tens of micrometers on the surface of a micro-wire having a diameter on a scale of several tens to several hundreds of micrometers. Since a laser optical system with a long depth of focus is used, a micro-pattern with a uniform thickness can be formed on surface of a wire having a curvature in a simple.

The present invention, in some embodiments thereof, provides a preparation method of a miniature solid silicon needle. The preparation method includes the following steps: growing one layer of silicon dioxide on a surface of monocrystalline silicon; depositing one layer of silicon nitride protective film on a surface of the silicon dioxide; coating a surface of the silicon nitride protective film with photoresist; and performing exposing, developing and etching, wherein the protective film adopts silicon nitride and is capable of accelerating etching reaction in the process of etching silicon, so that a diameter of a base of the silicon needle is smaller. According to the present invention, the process is simple, and the solid silicon needle has high durability and is suitable for transdermal drug permeation of biomacromolecule drugs.

A microfluidic chip with high volumetric flow rate is provided that includes at least two vertically stacked microfluidic channel layers, each microfluidic channel layer including an array of spaced apart pillars. Each microfluidic channel layer is interconnected by an inlet/outlet opening that extends through the microfluidic chip. The microfluidic chip is created without wafer to wafer bonding thus circumventing the cost and yield issues associated with microfluidic chips that are created by wafer bonding.

One or more methods of fabricating a microscale canopy wick structure having an array of individual wicks having one or more canopy members. Each method includes selectively etching a substrate to control the thickness of the canopy members and also control the width of a fluid flow channel between adjacent wicks in a manner that enhances the overall performance of the microscale canopy wick structure.

A nanowire probe sensor array including a substrate with a metal pattern thereon. An array of semiconductor vertical nanowire probes extends away from the substrate, and at least some of probes, and preferably all, are individually electrically addressed through the metal pattern. The metal pattern is insulated with dielectric, and base and stem portions of the nanowires are also preferably insulated. A fabrication process patterns metal connections on a substrate. A semiconductor substrate is bonded to the metal pattern. The semiconductor substrate is etched to form the neural nanowire probes that are bonded to the metal pattern. Dielectric is then deposited to insulate the metal pattern.

A method for forming a biological microdevice includes applying a biocompatible coarse scale additive process with an additive device and a biocompatible material to form an object. The coarse scale is a dimension not less than about 100 μm. The method also includes applying a biocompatible fine scale subtractive process with a subtractive device to the object. The fine scale is a dimension not greater than about 1000 μm. The method also includes moving the object between the additive device and the subtractive device. A system is also provided for performing the above method and includes the additive device, the subtractive device, a means for transporting the object between the additive device and subtractive device and a processor with a memory including instructions to perform one or more of the above method steps.

A sensing structure and a method of fabricating a sensing structure for a compressive-type pressure sensor. The method comprises the steps of providing an elastic micropatterned substrate defining a plurality of 3-dimensional microstructures, each microstructure comprising a tip portion pointing away from the substrate in a first direction; forming a conductive film on the elastic micropatterned substrate such that the 3-dimensional microstructures are substantially covered by the conductive film; and forming cracks in the conductive film in areas on 3-dimensional microstructures.

A process flow for forming magnetic tunnel junction (MTJ) nanopillars with minimal sidewall residue and minimal sidewall damage is disclosed wherein a pattern is first formed in a hard mask that is an uppermost MTJ layer. Thereafter, the hard mask sidewall is etch transferred through the remaining MTJ layers including a reference layer, free layer, and tunnel barrier between the free layer and reference layer. The etch transfer may be completed in a single RIE step that features a physical component involving inert gas ions or plasma, and a chemical component comprised of ions or plasma generated from one or more of methanol, ethanol, ammonia, and CO. In other embodiments, a chemical treatment with one of the aforementioned chemicals, and a volatilization at 50° C. to 450° C. may follow an etch transfer through the MTJ stack with an ion beam etch or plasma etch involving inert gas ions.

The method comprises contacting a silicon substrate with a silver salt and an acid for a time effective to produce spikes having a first end disposed on the silicon substrate and a second end extending away from the silicon substrate. The spikes have a second end diameter of about 10 nm to about 200 nm, a height of about 100 nm to 10 micrometers, and a density of about 10 to 100 per square microns. The nanostructures provide antimicrobial properties and can be transferred to the surface of various materials such as polymers.

A variety of homogeneous or layered hybrid nanostructures are fabricated by electric field-directed assembly of nanoelements. The nanoelements and the fabricated nanostructures can be conducting, semi-conducting, or insulating, or any combination thereof. Factors for enhancing the assembly process are identified, including optimization of the electric field and combined dielectrophoretic and electrophoretic forces to drive assembly. The fabrication methods are rapid and scalable. The resulting nanostructures have electrical and optical properties that render them highly useful in nanoscale electronics, optics, and biosensors.