B81C1/00119

3D printer, resin, and interconnect
10597289 · 2020-03-24 ·

Custom 3d printer and resin for microfluidic flow channels and 3D printed high density, reversible, chip-to-chip microfluidic interconnects.

COPLANAR FLUIDIC INTERCONNECT

An apparatus includes a polymer base layer having a surface. A die has a surface that is substantially coplanar with the surface of the polymer base layer. The die includes a fluidic actuator to control fluid flow across the surface of the die. A fluidic channel is coupled to the polymer base layer to provide a fluidic interconnect between the die and a fluidic input/output port.

METHOD TO CREATE MULTILAYER MICROFLUIDIC CHIPS USING SPIN-ON CARBON AS GAP FILLING MATERIALS

A microfluidic chip with high volumetric flow rate is provided that includes at least two vertically stacked microfluidic channel layers, each microfluidic channel layer including an array of spaced apart pillars. Each microfluidic channel layer is interconnected by an inlet/outlet opening that extends through the microfluidic chip. The microfluidic chip is created without wafer to wafer bonding thus circumventing the cost and yield issues associated with microfluidic chips that are created by wafer bonding.

MICROFLUIDIC CHIP AND MICROFLUIDIC DEVICE
20200061614 · 2020-02-27 · ·

A microfluidic chip includes a flow passage plate, a flat plate, and an annular seal. In the flow passage plate, a recess forming a flow passage for liquid and a communication hole communicating with the recess are formed. The flat plate is stacked on or under the flow passage plate to close the recess for defining the flow passage. In the flat plate, a communication through-hole communicating with the recess is formed. The annular seal is located on, or formed on, an outer surface of at least one of the flow passage plate and the flat plate, the annular seal surrounding at least one of the communication hole and the communication through-hole. The annular seal is made of an elastomer.

Gradient structures interfacing microfluidics and nanofluidics, methods for fabrication and uses thereof

A fluidic chip includes at least one nanochannel array, the nanochannel array including a surface having a nanofluidic area formed in the material of the surface; a microfluidic area on said surface; a gradient interface area having a gradual elevation of height linking the microfluidic area and the nanofluidic area; and a sample reservoir capable of receiving a fluid in fluid communication with the microfluidic area. In another embodiment, a fluidic chip includes at least one nanochannel array, the nanochannel array includes a surface having a nanofluidic area formed in the material of the surface; a microfluidic area on said surface; and a gradient interface area linking the microfluidic area and the nanofluidic area, where the gradient interface area comprises a plurality of gradient structures, and the lateral spacing distance between said gradient structures decreases towards said nanofluidic area; and a sample reservoir capable of receiving a fluid in fluid communication with the microfluidic area.

Ultrasonic welding of a microfluidic device

The invention is about an ultrasonic welding-based microfluidic device. It is mainly made of a first element and a second element welded one to the other via at least one structure (10, 10). The structure (10, 10) comprises an elongated welded portion for said welding, a welding channel (12, 12) extending between the first and second elements and along one side of the welded portion, and a draining channel (13) communicating with the welding channel (12, 12) and the microfluidic path (20, 20) of the device. The invention is further about a method of manufacturing such a device.

Wafer-Scale Assembly of Insulator-Membrane-Insulator Devices for Nanopore Sensing
20200033321 · 2020-01-30 ·

Described herein are nanopore devices as well as methods for assembling a nanopore device including one or more nanopores that can be used to detect molecules such as nucleic acids, amino acids (proteins), and the like. Specifically, a nanopore device includes an insulating layer that reduces electrical noise and thereby improves the sensing resolution of the one or more nanopores integrated within the nanopore device.

Microfluidic devices and methods for the extrusion of tubular structures

Methods and devices are disclosed for the controlled formation of structures, including tubular structures, using microfluidic devices. In one embodiment, a microfluidic device includes three or more microfluidic arrays that are provided in a stacking configuration, with an inner streaming layer and an outer streaming layer for flowing a streaming fluid, and at least one intermediate matrix layer for flowing a matrix fluid. Fluid flow in each layer is directed from a peripheral region towards, and distributed around, a common central outlet. Guided by the streaming fluid, a sheath of matrix solution is formed, which may be solidified to form a tubular material. Some embodiments allow for the controlled and continuous extrusion of tubular structures with tailored heterogeneities and/or predictable mechanical and chemical properties. Devices and methods are also provided for the on- and off-chip fixation and optional perfusion of tubular structures.

Methods including panel bonding acts and electronic devices including cavities
11885736 · 2024-01-30 · ·

A method is disclosed. In one example, the method includes bonding a first panel of a first material to a base panel in a first gas atmosphere, wherein multiple hermetically sealed first cavities encapsulating gas of the first gas atmosphere are formed between the first panel and the base panel. The method further includes bonding a second panel of a second material to at least one of the base panel and the first panel, wherein multiple second cavities are formed between the second panel and the at least one of the base panel and the first panel.

POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE
20190390919 · 2019-12-26 ·

Embodiments described herein relate to the concept and designs of a polymer-based thermal ground plane. In accordance with one embodiment, a polymer is utilized as the material to fabricate the thermal ground plane. Other embodiments include am optimized wicking structure design utilizing two arrays of micropillars, use of lithography-based microfabrication of the TGP using copper/polymer processing, micro-posts, throttled releasing holes embedded in the micro-posts, atomic layer deposition (ALD) hydrophilic coating, throttled fluid charging structure and sealing method, defect-free ALD hermetic coating, and compliant structural design.