A overhanging device cavity structure comprises a substrate and a cavity disposed in or on the substrate. The cavity comprises a first cavity side wall and a second cavity side wall opposing the first cavity side wall on an opposite side of the cavity from the first cavity side wall. A support extends from the first cavity side wall to the second cavity side wall and at least partially divides the cavity. A device is disposed on, for example in direct contact with, the support and extends from the support into the cavity.

An actively reversible and reusable dry adhesion system, and related methods for using the same, may comprise a first plurality of nanoparticles, e.g., carbon nanotubes, formed on a first substrate that may be selectively reconfigured in response to an active stimulus, e.g., electrical current, temperature gradient, magnetism, etc.; a second plurality of nanoparticles, e.g., carbon nanotubes, formed on a second substrate that may be selectively reconfigured in response to the active stimulus; and a switch or button that may be operably connected to the first and second substrates. The switch or button may be configured to selectively apply the active stimulus. When the switch or button is activated, the first and second pluralities of nanoparticles may interlock to adhere the first substrate to the second substrate. The dry adhesion system may form an interlocking fastener on a nanoscale, and may be reversible and reusable.

A MEMS inertial sensor device, method of operation, and fabrication process are described wherein a MEMS inertial sensor and drive actuation units are coupled together in operational engagement, where the MEMS inertial sensor includes a substrate and a proof mass array positioned in spaced apart relationship above a surface of the substrate and constructed with a plurality of proof mass sub-structures which are each separately connected to the substrate with orthogonally disposed pairs of spring suspension structures and which are each rigidly connected to one or more adjacent proof mass sub-structures with one or more connector bars so that the plurality of proof mass sub-structures move as a single proof mass array that can operate at resonant frequencies of at least 100 kHz when oscillating in first and second orthogonal directions.

An integrated circuit includes a mechanical device for detection of spatial orientation and/or of change in orientation of the integrated circuit. The device is formed in the BEOL and includes an accommodation whose sides include metal portions formed within various metallization levels. A mobile metal component is accommodated within the accommodation. A monitor inside the accommodation defines a displacement area for the metal component and includes electrically conductive elements disposed at the periphery of the displacement area. The component is configured so as to, under the action of the gravity, come into contact with the two electrically conductive elements in response to a given spatial orientation of the integrated circuit. A detector is configured to detect an electrical link passing through the component and the electrically conductive elements.

An electrooptical apparatus includes a torsion hinge (torsion hinge) that has a first opening portion. Around the first opening portion, the opposite side of the torsion hinge to a substrate is in contact with a first connecting portion of a mirror support post that has a tubular shape. A resin that constitutes a sacrificial layer does not remain within the mirror support post. A second end portion of the mirror support post which is at a side opposite the substrate forms a flat plate portion. The second end portion is in contact with a mirror. Therefore, the surface of the mirror does not have any dimple.

A mirror device manufacturing method includes a forming step of forming a structure by forming a base portion, a movable portion, and a coupling portion coupling the base portion and the movable portion to each other such that the movable portion is able to swing with respect to the base portion through processing of a wafer, and forming a mirror layer in the movable portion; and a collecting step of performing collection of foreign substances from the structure using a collection member after the forming step. A mirror unit manufacturing method includes a sealing step of sealing the mirror device after the collecting step.