In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.

An acoustic transduction unit, a manufacturing method thereof and an acoustic transducer, and relates to the technical field of electronic devices. A first electrode is arranged on a first substrate, a support layer is arranged on a side, close to the first electrode, of the first substrate, and a conductive diaphragm layer is arranged on a side, away from the first substrate, of the support layer; a cavity is enclosed by the support layer, overlapping areas exist between orthographic projections of the first electrode, the conductive diaphragm layer and the cavity on the first substrate, and the conductive diaphragm layer serves as both a diaphragm layer and a second electrode in the acoustic transduction unit, it allows the conductive diaphragm layer to be configured as both the diaphragm layer and the second electrode, a layer structure of the acoustic transduction unit is simple.

A transducer element includes array elements. At least one array element includes a substrate and a first electrode layer, a diaphragm layer, and a second electrode layer that are sequentially stacked thereon. An array element has a working region including working sub-regions, and a peripheral region surrounding the working region; overlapping portions of the first electrode layer, the diaphragm layer and the second electrode layer form cells, and a cell is located in a working sub-region; portions of the diaphragm layer and portions of the first electrode layer that are located in the working sub-regions have cavities therebetween, and the portions of the diaphragm layer are configured to vibrate in a direction perpendicular to the substrate between the first and second electrode layers; two adjacent cavities communicate; the diaphragm layer has release holes located in the peripheral region; and a release hole communicates with at least one cavity.

A MEMS micromirror device includes a monolithic body of semiconductor material having a first main surface and a second main surface, with the monolithic body having an opening extending from the second main surface and including a suspended membrane of monocrystalline semiconductor material extending between the opening and the first main surface of the monolithic body. The suspended membrane includes a supporting frame and a mobile mass carried by the supporting frame and rotatable about an axis parallel to the first main surface, with the mobile mass having a width less than a width of the opening. A reflecting region extends over the mobile mass.

A MEMS device includes a body pivoting around a pivot axis, a support, and a suspension structure mechanically coupling the body to the support. The suspension structure includes a torsion element defining the pivot axis, and first and second spring elements extending with an angle relative to the pivot axis on opposing sides of the torsion element so that a distance between at least portions of the first and second spring elements is changing in the direction of the pivot axis. The extension of the first and second spring elements in the direction of the pivot axis is larger than the extension of the torsion element in the direction of the pivot axis.

A method for manufacturing an electroacoustic transducer includes a frame; an element movable with respect to the frame, the movable element including a membrane and a structure for rigidifying the membrane; a first transmission arm, the movable element being coupled to an end of the first transmission arm; wherein the trimming of the membrane and the trimming of the rigidification structure are decorrelated in a region around an intersection between the position of the first transmission arm and the periphery of the rigidification structure.

Various embodiments of the present disclosure are directed towards a microelectromechanical system (MEMS) device including a conductive bonding structure disposed between a substrate and a MEMS substrate. An interconnect structure overlies the substrate. The MEMS substrate overlies the interconnect structure and includes a moveable membrane. A dielectric structure is disposed between the interconnect structure and the MEMS substrate. The conductive bonding structure is sandwiched between the interconnect structure and the MEMS substrate. The conductive bonding structure is spaced laterally between sidewalls of the dielectric structure. The conductive bonding structure, the MEMS substrate, and the interconnect structure at least partially define a cavity. The moveable membrane overlies the cavity and is spaced laterally between sidewalls of the conductive bonding structure.

A small-array MEMS (micro-electro mechanical system) microphone apparatus is provided. The apparatus includes first and second microphone modules. A first microphone of the first microphone module captures a first acoustic signal from a sound source through a first acoustic hole. A second microphone of the second microphone module captures a second acoustic signal from the sound source through a second acoustic hole. A first integrated circuit performs a first logic operation on the first acoustic signal and the second acoustic signal to generate a first sum acoustic signal. The first integrated circuit performs a sampling delay on the second acoustic signal with a first clock signal, and subtracts the delayed second acoustic signal from the first acoustic signal to obtain a first differential acoustic signal. The first differential acoustic signal has a first directivity. A second integrated circuit bypasses and outputs the second acoustic signal which is omnidirectional.

A method of producing a device includes providing a substrate which has a recess. A multitude of loose particles is introduced into the recess. A first portion of the particles is coated by using a coating process having a depth of penetration which extends from an opening of the recess, along a direction of depth, and into the recess, so that the first portion is connected to form a solidified porous structure. The depth of penetration of the coating process which extends into the recess is set such that a second portion of the particles is not connected by means of the coating, and such that the solidified first portion of the particles is arranged between the second portion of the particles and surroundings of the recess. According to the invention, the second portion of the particles is at least partly removed from the recess.

A die-wrapped packaged device includes at least one flexible substrate having a top side and a bottom side that has lead terminals, where the top side has outer positioned die bonding features coupled by traces to through-vias that couple through a thickness of the flexible substrate to the lead terminals. At least one die includes a substrate having a back side and a topside semiconductor surface including circuitry thereon having nodes coupled to bond pads. One of the sides of the die is mounted on the top side of the flexible circuit, and the flexible substrate has a sufficient length relative to the die so that the flexible substrate wraps to extend over at least two sidewalls of the die onto the top side of the flexible substrate so that the die bonding features contact the bond pads.