The present publication discloses a micromechanical structure including at least one active element, the micromechanical structure comprising a substrate, at least one layer formed on the substrate forming the at least part of the at least one active element, mechanical contact areas through which the micromechanical structure can be connected to other structures like printed circuit boards and like. In accordance with the invention the micromechanical structure includes weakenings like trenches around the mechanical contact areas for eliminating the thermal mismatch between the active element of the micromechanical structure and the other structures.

A housing for a micromechanical sensor element, including a cavity in which the sensor element is disposable, and a damping element, the micromechanical sensor element being immobilizable in the cavity by the damping element so that the damping element and the sensor element together have a substantially common center of mass.

A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

A stress-isolated microelectromechanical systems (MEMS) device and a method of manufacture of the stress-isolated MEMS device are provided. MEMS devices may be sensitive to stress and may provide lower performance when subjected to stress. A stress-isolated MEMS device may be manufactured by etching a trench and/or a cavity in a first side of a substrate and subsequently forming a MEMS device on a surface of a platform opposite the first side of the substrate. Such a stress-isolated MEMS device may exhibit better performance than a MEMS device that is not stress-isolated. Moreover, manufacturing the MEMS device by first forming a trench and cavity on a backside of a wafer, before forming the MEMS device on a suspended platform, provides increased yield and allows for fabrication of smaller parts, in at least some embodiments.

A method is described for closing off a micromechanical device by laser melting, having the steps: (A) providing a micromechanical device having an access channel that has a collar at an external opening; (B) closing off the external opening of the access channel by laser irradiation of the collar, the collar being at least partly melted and the external opening being closed with melt made of a material of the collar. Also described is a micromechanical device having a laser melt closure, in particular produced by the method according to the present invention, the micromechanical device having an access channel that has a collar at an external opening, the external opening of the access channel being closed by a melt closure made of a material of the collar.

A radio frequency (RF) front end device is disclosed. The device comprises a plurality of micro-electro-mechanical system (MEMS) transfer switches having a plurality of parallel switch inputs and parallel switch outputs. The device comprises a plurality of banks of a plurality of parallel signal conditioning devices and each bank comprising a plurality of parallel paths having an input side and an output side, at least two of the banks of the plurality of signal conditioning devices couple the input side to the plurality of parallel switch outputs of a preceding MEMS transfer switch and the output side to the plurality of parallel switch inputs of a succeeding MEMS transfer switch. The MEMS transfer switches are controlled to condition a wideband signal through a selected set of signal conditioning devices to improve selection sensitivity of at least one frequency in a wideband. A method and RF communications device are also disclosed.

Disclosed examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.

Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.

Disclosed are lenses and eyewear that provide the user with both forward vision and rearward vision by means of an angled, reflective portion of the lens.

A micro-electro-mechanical device formed in a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region above the first buried cavity; and a second buried cavity extending in the sensitive region. A decoupling trench extends from a first face of the monolithic body as far as the first buried cavity and laterally surrounds the second buried cavity. The decoupling trench separates the sensitive region from a peripheral portion of the monolithic body.