A simplified MEMS fabrication process and MEMS device is provided that allows for cheaper and lighter-weight MEMS devices to be fabricated. The process comprises etching a plurality of holes or other feature patterns into a MEMS device, and then etching away the underlying wafer such that, after the etching process, the MEMS device is the required thickness and the individual die are separated, avoiding the extra steps of wafer thinning and die dicing. By etching trenches into the substrate wafer and filling them with a MEMS base material, sophisticated taller MEMS devices with larger force may be made.

A microelectromechanical system (MEMS) device may include a MEMS structure over a first substrate. The MEMS structure comprises a movable element. Depositing a first conductive material over the first substrate and etching trenches in a second substrate. Filling the trenches with a second conductive material and depositing a third conductive material over the second conductive material and the second substrate. Bonding the first substrate and the second substrate and thinning a backside of the second substrate which exposes the second conductive material in the trenches.

Systems, processes and devices are provided for laser-based manufacturing of resonators and MEMS devices from bulk material including optically transparent material. Processes include digital marking of resonator structures in bulk material through non-linear interaction of ultrafast laser beam inscribing and material. The resonator structure may be defined and released through selective wet etching of the laser-modified areas, utilizing a combination of basic and acidic aqueous solutions. Processes can also include hydrofluoric thinning prior to wet etching to prevent laser surface damages. Systems and processes can pattern and fabricate resonator structures and concentricring structures. Embodiments provide miniaturized vibratory sensors from low loss material, such as fused silica and quartz, with an improved resolution and accuracy of measurements for inertial sensing, time referencing, bio-sensing and acoustic sensing.

A method for forming a bore for a cavity within a semiconductor layer stack. The method includes forming a first partial bore using a first laser ablation step starting at an outer surface of the stack so that the first partial bore extends with a first mean dimension and aligned in parallel with the outer surface, starting from the outer surface, and a bottom surface of the first partial bore lying between the outer surface and the cavity, and forming a second partial bore using a second laser ablation step started from the bottom surface of the first partial bore so that the second partial bore extends with a second mean dimension, aligned in parallel with the outer surface and is smaller than the first mean dimension, through the bottom surface into the cavity or an access channel opening at the cavity or connected to the cavity.

The present disclosure relates to a method of manufacturing a layered structure for a MEMS apparatus, a layered structure manufactured by the method, and a MEMS apparatus 200 (300, 400, 500) comprising the layered structure. For the layered structure, a high-temperature curing step is provided in the manufacturing process, for example, after structuring the functional layer 3. The structured regions and trenches of the functional layer 3 and in particular the spring structure formed in the functional layer 3 have smoothened side walls and/or rounded corners in regions 3a after the curing step, so that their fracture limits can thus be increased and early fractures of the functional layer 3 during operation of the MEMS apparatus 200 (300, 400, 500) can be avoided.

A method for making a hollow structure in a substrate. The method includes creating a lattice structure with at least two mutually spaced trench structures, creating a cavity structure below the lattice structure with respect to a normal direction by forming a buried, contiguous cavity that spans at least the area of the two trench structures. A micromechanical sensor is also described.