Certain exemplary embodiments can provide a method comprising, via computer aided design, designing parts of an object that comprises an outer shell and an inner body, at least one of the outer shell and the inner body defining a specific volume negative space relief. In certain exemplary embodiments, the specific volume negative space relief defines a channel constructed to pass at least one of a fluid and a gas.

A method for processing glass is provided. The method includes the steps of providing a glass element and removing glass material from the glass element by etching with an alkaline etching medium in an organic solvent.

A method of manufacturing a Fabry-Perot interference filter includes a forming step of forming a first thinned region, a first mirror layer, a sacrificial layer, and a second mirror layer are formed on a first main surface of a wafer, and the first thinned region in which at least one of the first mirror layer, the sacrificial layer, and the second mirror layer is partially thinned along each of a plurality of lines is formed; a cutting step of cutting the wafer into a plurality of substrates along each of the plurality of lines by forming a modified region within the wafer along each of the plurality of lines through irradiation of a laser light, after the forming step; and a removing step of removing a portion from the sacrificial layer through etching, between the forming step and the cutting step or after the cutting step.

Certain exemplary embodiments can provide a method comprising, via computer aided design, designing parts of an object that comprises an outer shell and an inner body, at least one of the outer shell and the inner body defining a specific volume negative space relief. In certain exemplary embodiments, the specific volume negative space relief defines a channel constructed to pass at least one of a fluid and a gas.

A microelectromechanical systems (MEMS) device includes a mirror structure, a frame, a first cantilever, a second cantilever, and first to fourth transmission springs. The first cantilever includes a first electrode. The second cantilever includes a second electrode spaced apart from the first electrode. The mirror structure is suspended in the frame by the first cantilever and the second cantilever. The first transmission spring connects the first cantilever to a first end of the mirror structure. The second transmission spring connects the second cantilever to the first end of the mirror structure. The third transmission spring connects the first cantilever to a second end of the mirror structure. The fourth transmission spring connects the second cantilever to the second end of the mirror structure.

A method of manufacturing a Fabry-Perot interference filter includes a forming step of forming a first thinned region, a first mirror layer, a sacrificial layer, and a second mirror layer are formed on a first main surface of a wafer, and the first thinned region in which at least one of the first mirror layer, the sacrificial layer, and the second mirror layer is partially thinned along each of a plurality of lines is formed; a cutting step of cutting the wafer into a plurality of substrates along each of the plurality of lines by forming a modified region within the wafer along each of the plurality of lines through irradiation of a laser light, after the forming step; and a removing step of removing a portion from the sacrificial layer through etching, between the forming step and the cutting step or after the cutting step.

Method for fabricating an enclosure (2) bounding a cavity (4), the enclosure being intended to be applied against a sample to be analysed (E), the cavity being configured to extend between the sample and an acoustic transducer (T), the cavity opening onto a contact face (3) intended to be applied against the sample, the enclosure comprising: a contact aperture (3o) formed in the contact face, and opening into the cavity; a membrane (5) extending through the cavity, facing the contact face, so that all or part of the cavity lies between the membrane and a cover (2c);
wherein the method comprises the steps of microstructuring three substrates, so as to form the cover, the rear portion of the cavity, the membrane and the front portion of the cavity.

A method for wafer treatment is disclosed. A wafer is provided with a main surface, a surface layer, and a base layer. The surface layer is disposed between the main surface and the base layer, and the surface layer covers the base layer and exposes the main surface. Then, at least one laser process is performed to fully irradiate the main surface and the surface layer with a first laser to generate a plurality of optimized regions in the main surface and the surface layer, so that the optimized regions form at least one stress-relieving array.