A micromechanical spring for an inertial sensor includes first and second spring elements situated parallel to each other and anchored on an anchoring element of the inertial sensor; and a third spring element situated between the two spring elements, anchored on the anchoring element, and having on both external sides a defined number of nub elements that are formed so as to have an increasing distance from the spring elements in a defined fashion as the distance from the anchoring element increases.

A semiconductor device includes a substrate having an opening extending through the substrate and at least one support member on a sidewall of the opening, a vibration membrane on the substrate, a cover layer on the vibration membrane. The substrate, the vibration membrane, and the cover layer define a cavity. The opening exposes a lower surface portion of the vibration membrane. The at least one support member on the sidewall of the opening provides support to the vibration membrane in a deformation of the vibration membrane to prevent breakage.

A micromechanical structure in accordance with various embodiments may include: a substrate; and a functional structure arranged at the substrate; wherein the functional structure includes a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region; and wherein at least a section of the functional region has an elastic modulus in the range from about 5 GPa to about 70 GPa.

Described examples include a micromechanical device having a substrate. The micromechanical device includes a MEMS element and a via between the MEMS element and the substrate, the via having a conductive layer extending from the substrate to the MEMS element and having a structural integrity layer on the conductive layer.

The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

The invention concerns a micro check valve (10) comprising a substrate body (12) having a top side (16) and an underside (14), wherein at least the top side (16) has a sealing bar (34) between a first trough (30) and a second trough (32). The substrate body (12) also has a passage (24) which leads from the underside (14) of the substrate body (12) to the top side (16) of the substrate body (12) and ends on the top side (16) of the substrate body (12) in the first trough (30). In addition arranged on the top side (16) of the substrate body (12) is a diaphragm (18) which is mounted flexibly at least in the region of the sealing bar (34) and the first and second troughs (30, 32). The diaphragm (18) also has at least one through opening (42) arranged above the second trough (32).

The invention further concerns a system having a plurality of micro check valves (10) and a method for the production thereof.

Disclosed herein is a micro-electro-mechanical mirror device having a fixed structure defining an external frame delimiting a cavity, a tiltable structure extending into the cavity, a reflecting surface carried by the tiltable structure and having a main extension in a horizontal plane, and an actuation structure coupled between the tiltable structure and the fixed structure. The actuation structure is formed by a first pair of actuation arms causing rotation of the tiltable structure around a first axis parallel to the horizontal plane. The actuation arms are elastically coupled to the tiltable structure through elastic coupling elements and are each formed by a bearing structure and a piezoelectric structure. The bearing structure of each actuation arm is formed by a soft region of a first material and the elastic coupling elements are formed by a bearing layer of a second material, the second material having greater stiffness than the first material.

A MEMS device comprises a first membrane structure having a reinforcement region formed from one piece of the first membrane structure, wherein the reinforcement region has a larger layer thickness than an adjoining region of the first membrane structure. The MEMS device includes an electrode structure, wherein the electrode structure is vertically spaced apart from the first membrane structure.

A microphone includes a substrate, an opening in the substrate, and a support structure in the opening. The support structure includes a first bracket formed in a closed-loop pattern and a second bracket connecting the first bracket to a periphery of the opening. The support structure in the opening increases the mechanical reliability of the microphone.

A method for manufacturing a MEMS sound transducer for generating and/or detecting sound waves in the audible wavelength range and/or in the ultrasonic range, includes arranging at least one piezoelectric element on a support substrate. A diaphragm is formed on the at least one piezoelectric element. In forming the diaphragm, a flowable and curable polymer, which forms the diaphragm after curing, is at least partially cast around the at least one piezoelectric element. The invention further relates to the MEMS sound transducer formed by the method.