The invention belongs to the technical field of metal micro-forming, and in particular relates to a method for inflating micro-channels. The present invention is aimed at the problems of low process flexibility, single product type, and non-closed structure of the micro-channel when preparing metal micro-channels by micro-plastic forming of ultra-thin metal strips. The present invention uses a method combining numerical simulation and bond rolling experiment to analyze the effect of the hydrogen pressure and bond strength of the metal composite ultra-thin strip after bond rolling on the pore diameter of the micro-channel, and the corresponding relationship between the micro-channel pore diameter and the titanium hydride content, heating temperature, and bond strength of the metal composite ultra-thin strip is obtained. The present invention has no special requirements on molds, wide selection of metal materials, low requirements for equipment capabilities; closed tubular micro-channel products with different pore diameters and different distributions can be prepared according to requirements, with rich product categories and high process flexibility.

A method includes obtaining an active device layer. The active device layer has a first surface with one or more active feature areas. First portions of the active feature areas are exposed, and second portions of the active feature areas are covered by an insulating layer. A conformal overcoat layer is formed on the first surface. A base of a microelectromechanical systems (MEMS) device layer is formed on the conformal overcoat layer. The MEMS device layer is spatially segregated from the active feature areas by removing portions of the base of the MEMS device layer in one or more antiparasitic regions (APRs) that correspond to the active feature areas. Metal MEMS features are formed on the base of the MEMS device layer. Selected portions of the active feature areas are exposed removing portions of the conformal overcoat layer that overlay the active feature areas.

The invention belongs to the technical field of metal micro-forming, and in particular relates to a method for inflating micro-channels. The present invention is aimed at the problems of low process flexibility, single product type, and non-closed structure of the micro-channel when preparing metal micro-channels by micro-plastic forming of ultra-thin metal strips. The present invention uses a method combining numerical simulation and bond rolling experiment to analyze the effect of the hydrogen pressure and bond strength of the metal composite ultra-thin strip after bond rolling on the pore diameter of the micro-channel, and the corresponding relationship between the micro-channel pore diameter and the titanium hydride content, heating temperature, and bond strength of the metal composite ultra-thin strip is obtained.

A system and method (referred to as the system) fabricates controllable atomic assemblies in two and three dimensions. The systems identify by a non-invasive imager, a local atomic structure, distribution of vacancies, and dopant atoms and modify, by a microscopic modifier, the local atomic structure, via electron beam irradiation. The systems store, by a knowledge base, cause-and-effect relationships based on a non-invasive imaging and electron scans. The systems detect, by detectors, changes in the local atomic structure induced by the electron irradiation; and fabricate, a modified atomic structure by a beam control software and feedback.

A mirror device includes a frame body, a mirror configured to tilt about a Y-axis with respect to the frame body, a fixed inner comb electrode including a plurality of electrode fingers arranged in the arrangement direction along the Y-axis and provided at the frame body, and a movable inner comb electrode including a plurality of electrode fingers arranged in the arrangement direction and provided at the mirror, the electrodes fingers of the fixed inner comb electrode and the movable inner comb electrode being alternately arranged. The mirror includes a mirror body and an extension extending from the mirror body. Some of the electrode fingers of the movable inner comb electrode are provided at the mirror body, and another electrode fingers of the movable inner comb electrode are provided at the extension.

A method for manufacturing a millimeter scale electromechanical device includes coupling a stainless steel ply to a polymer carrier ply, coating the stainless steel ply in a photo resist material, masking the photoresist material, exposing the photoresist material to cure a portion of the photoresist material, developing the photoresist material to remove uncured photoresist material from the stainless steel ply, chemically etching the stainless steel ply to remove a patterned portion of the stainless steel ply, dissolving the polymer carrier ply to release unwanted chips of the stainless steel ply, and adhering the patterned stainless steel ply to a flexible material ply to form a sub-laminate.

A micro-nano incremental mechanical surface treatment method, comprising the following steps: using a modification tool having a designable end to contact a surface of a substrate material, rotating the modification tool in a local region and compressing the material surface, presetting processing parameters by means of 3D modeling software, and after the tool has processed the entire surface, enabling the tool to move downwards to the indented surface compressed previously. The process continues until the surface material is compressed to a pre-defined thickness, thereby achieving the goals of grain refinement and surface performance improvement. By means of the present method, a workpiece having a complex shape can be flexibly and designably surface modified. The method has the advantages of high bonding strength, no pollution, and low cost.

An apparatus includes an optical writing module and an optical characterization module. The optical writing module is configured to emit a laser beam and guide the laser beam toward a substrate. The optical characterization module is optically coupled with the optical writing module such that the optical writing module and the optical characterization module share the same optical path. The optical writing module is configured to emitting an observation light beam toward the substrate. The optical characterization module is further configured to determine whether a mixture of solution and suspension is in contact with the substrate. When the mixture is determined in contact with the substrate, the laser beam is enabled to irradiate the mixture near a surface of the substrate, so as to form a mechanically rigid material deposition in contact with the substrate.

The plasma-assisted method of precise alignment and pre-bonding for microstructure of glass and quartz microchip belongs to micromachining and bonding technologies of the microchip. The steps of which are as follows: photoresist and chromium layers on glass or quartz microchip are completely removed followed by sufficient cleaning of the surface with nonionic surfactant and quantities of ultra-pure water. Then the surface treatment is proceeded for an equipping surface with high hydrophily with the usage of plasma cleaning device. Under the drying condition, the precise alignment is accomplished through moving substrate and cover plate after being washed with the help of microscope observation. Further on, to achieve precise alignment and pre-bonding of the microstructure of glass and quartz microchip, a minute quantity of ultrapure water is instilled into a limbic crevice for adhesion, and entire water is completely wiped out by vacuum drying following sufficient squeezing. Based on the steps above, it is available to achieve permanent bonding by further adopting thermal bonding method. In summary, it takes within 30 min to finish the whole operation of precise alignment and pre-bonding by this method. Besides, this method is of great promise because of its speediness, efficiency, easy maneuverability, operational safety and wide applications.

At the first etching step of etching an SOI substrate from a first silicon layer side, a portion of a first structure formed of the first silicon layer is formed as a pre-structure having a larger shape than a final shape. At the mask formation step of forming a final mask on a second silicon layer side of the SOI substrate, a first mask corresponding to the final shape of the first structure is formed in the pre-structure. At the second etching step of etching the SOI substrate from the second silicon layer side, the second silicon layer and the pre-structure are, using the first mask, etched to form the final shape of the first structure.