A method of manufacturing and assembling a sandwich flexure mechanism assembly is set forth herein. The method involves manufacture of a monolithic sandwich flexure module having a multitude of out of plane rigid inter-stage connections between at least some sets of twin stages of the monolithic sandwich flexure module. The method further involves assembling an interconnect subassembly to intermediate bodies of the monolithic sandwich flexure module. The interconnect subassembly furnishing in-plane rigid inter-stage connections between pairs of the intermediate bodies that constitute sister stages of the monolithic sandwich flexure module. The method can further involve assembling a motion body, actuators, and displacement sensors at the monolithic sandwich flexure module.

A semiconductor structure includes a first device and a second device. The first device includes a plate including a plurality of apertures; a membrane disposed opposite to the plate and including a plurality of corrugations, and a conductive plug extending through the plate and the membrane. The second device includes a substrate and a bond pad disposed over the substrate, wherein the conductive plug is bonded with the bond pad to integrate the first device with the second device, and the plate includes a semiconductive member and a tensile member, and the semiconductive member is disposed within the tensile member.

A method of manufacturing and assembling a sandwich flexure mechanism assembly is set forth herein. The method involves manufacture of a monolithic sandwich flexure module having a multitude of out of plane rigid inter-stage connections between at least some sets of twin stages of the monolithic sandwich flexure module. The method further involves assembling an interconnect subassembly to intermediate bodies of the monolithic sandwich flexure module. The interconnect subassembly furnishing in-plane rigid inter-stage connections between pairs of the intermediate bodies that constitute sister stages of the monolithic sandwich flexure module. The method can further involve assembling a motion body, actuators, and displacement sensors at the monolithic sandwich flexure module.

Embodiments disclosed are systems and methods for interfacing a metallic capillary in a microchannel of a metallic body. A method may include inserting a portion of the metallic capillary into a portion the microchannel of the metallic body, sintering the portion of the metallic capillary to the portion of the microchannel of the metallic body, disposing a sacrificial powder at least proximate to the metallic capillary and the metallic body after sintering the portion of the metallic capillary and the portion of the microchannel of the metallic body, and infiltrating at least the portion of the metallic capillary sintered to the portion of the microchannel of the metallic body with an infiltrant in the presence of the sacrificial powder disposed at least proximate to the metallic capillary and the metallic body.

A microelectromechanical systems (MEMS) device including a substrate, a membrane layer and a plurality of patterned backplates is provided. The membrane layer is disposed on the substrate and has a plurality of corrugated structures. A top surface of the membrane layer has a rounded-corner feature, and a bottom surface of the membrane layer has a sharp-corner feature. The plurality of patterned backplates are disposed above the membrane layer. A manufacturing method of a MEMS device is also provided.