A micro-electro-mechanical system (MEMS) package includes a wafer with an interconnect layer disposed thereon. A first device substrate including a first MEMS device and a second device substrate including a second MEMS device are laterally spaced apart from each other and disposed on the wafer. A first and a second bond seal rings are disposed below the first and the second device substrates, respectively, and both bonded to the interconnect layer. A first handle substrate includes a first cavity having a first pressure, and is bonded to the first device substrate. A second handle substrates includes a second cavity having a second pressure different from the first pressure, and is bonded to the second device substrate. A hole is disposed in the second bond seal ring for pressure adjustment in the second cavity.

Crosslinkable random copolymers comprising atom transfer radical polymerization (ATRP) initiators and crosslinked copolymer films formed from the copolymers are provided. The random copolymers, which are polymerized from one or more alkyl halide functional inimers and one or more monomers having a crosslinkable functionality, are characterized by pendant ATRP initiating groups and pendant crosslinkable groups.

Disclosed herein are devices comprising stretchable interdigitated electrode arrays and methods for fabricating the devices. The devices are capable of acting as elongation sensors by sensing a change in the capacitance of the device as the distance between the interdigitated fingers changes when the device is elongated or compressed. The device may be coupled to other devices such as to be able to sense elongation or compression of the coupled device. The interdigitated fingers of the device are supported by a substrate and may be fabricated using traditional microfabrication techniques.

Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge. In some embodiments, the MEMS devices comprise a charge transfer circuit for providing the amount of charge.

A MEMS temperature sensor including a clamped-clamped microbeam having a drive electrode on one side configured for applying an AC current, and a sense electrode diagonally situated on the other side, a first anchor at one end and a second anchor at the other end of the microbeam. The first anchor receive a DC bias currents, which heats the microbeam to an operating temperature. The sense electrode is configured to capacitively sense oscillations in the microbeam due to an applied AC current. The MEMS temperature sensor has a three wafer construction in which the components are formed. The device is encapsulated by aluminum, and metal wires connect the first and second anchor, the drive electrode and the sense electrode to side electrode pads outside of the encapsulation. The MEMS temperature sensor has a linear operating region of 30-60 degrees Celsius.

An electrostatic MEMS transducer includes a membrane and an actuator array. The actuator array includes a plurality of vertical parallel-plate actuator cells. Each vertical actuator cell comprises two silicon electrodes and a polysilicon electrode positioned between the two silicon electrodes. The actuator cells are configured to generate oscillation of the membrane responsive to an electrical signal.

The present invention relates to substrates and composites having dynamic, reversible micron-level luminal surface deformation including texture or geometric instabilities, e.g., surface wrinkling and folding. The surface deformation and its reversal to the original surface form or to another, different surface form, is effective to reduce or prevent surface fouling and, more particularly, in certain applications, to reduce or prevent unwanted platelet adhesion and thrombus formation. The substrates and composites include a wide variety of designs and, more particularly, biomedical-related designs, such as, synthetic vascular graft or patch designs.

A micromechanical device and a method for producing a micromechanical device. The micromechanical device includes a MEMS substrate, a functional layer, and a cap part. The functional layer is located between the MEMS substrate and the cap part. The cap part includes a cap substrate. The micromechanical device has a main extension plane. The micromechanical system and the cap part enclose a cavern. The micromechanical device has a sealed cavern access.

A method for manufacturing an optical microelectromechanical device, includes forming, in a first wafer of semiconductor material having a first surface and a second surface, a suspended mirror structure, a fixed structure surrounding the suspended mirror structure, elastic supporting elements extending between the fixed structure and the suspended mirror structure, and an actuation structure coupled to the suspended mirror structure. The method continues with forming, in a second wafer, a chamber delimited by a bottom wall having a through opening, and bonding the second wafer to the first surface of the first wafer and bonding a third wafer to the second surface of the first wafer so that the chamber overlies the actuation structure, and the through opening is aligned to the suspended mirror structure, thus forming a device composite wafer. The device composite wafer is diced to form an optical microelectromechanical device.

According to an implementation, a method for manufacturing a microelectromechanical system mirror device is provided. A mirror portion of the mirror device is rotatable about a first axis having an associated first resonance frequency and a second axis different from the first axis and having an associated second resonance frequency. The method includes estimating a deviation of a first geometry parameter of the mirror device from a reference value, and adjusting a manufacturing step for the mirror device to modify a second geometry parameter of the mirror device different from the first geometry parameter such that a variation of a frequency ratio between the first resonance frequency and the second resonance frequency caused by the deviation of the first geometry parameter and the modifying of the second geometry parameter is below a predefined threshold.