A device (30, 40) for the transfer of a plurality of watch components (2) arranged on a first support (10) to their arrangement on a second support (20), wherein it comprises an inlet surface (31, 41) comprising inlet orifices (33, 43) so arranged as to correspond to a first arrangement of the watch components (2) on a first support (10), an outlet surface (32, 42) comprising outlet orifices (34, 44) so arranged as to correspond to a second arrangement of the watch components (2) on a second support (20), and guide elements (35, 45) adapted to guide the watch components (2) automatically from the inlet orifices (33, 43) to the outlet orifices (34, 44).

A method includes: providing a first substrate on which a plurality of first semiconductor devices is formed; providing a second substrate on which a plurality of second semiconductor devices is formed; and coupling the first and second substrates by contacting respective dummy pads of the first and second substrates, wherein at least one of the dummy pads of the first and second substrates comprises plural peaks and valleys.

The invention includes a method of promoting interfacial mechanical bonding of two or more components through the use of suspended and/or freestanding structures fabricated using an atom-scale assembly process on at least a portion of the surfaces of such components.

An integrated package method for MEMS element and ASIC chip includes forming a re-layout layer on a front surface of an ASIC wafer; coating an organic compound layer on the re-layout layer and applying a lithography process to the organic compound layer to from a microcavity array; aligning and bonding an electrode connection pad layer on a front surface of an MEMS element with the microcavity array to form a closed cavity structure; thinning and exposing a silicon substrate on a back surface of the MEMS element to a desired thickness; applying the lithographic process on the MEMS element to expose the electrode connection pad layer and an electrical contact area of the re-layout layer; and manufacturing a metal connection member connected to the electrode connection pad layer and the electrical contact area. An integrated package structure for MEMS element and ASIC chip is also provided.

A method includes: providing a first substrate on which a plurality of first semiconductor devices is formed; providing a second substrate on which a plurality of second semiconductor devices is formed; and coupling the first and second substrates by contacting respective dummy pads of the first and second substrates, wherein at least one of the dummy pads of the first and second substrates comprises plural peaks and valleys.

An alignment mark, a semiconductor device, and fabrication methods of the alignment mark and the semiconductor device are provided. The method includes providing a first base substrate, and forming a plurality of alignment marks on the first base substrate. The method also includes dicing the first base substrate to form a plurality of alignment dies. Each alignment die includes a diced first base substrate and at least one alignment mark diced from the plurality of alignment marks on the diced first base substrate. In addition, the method includes providing a second base substrate for aligning, and forming a bonding film on the second base substrate. Further, the method includes attaching an alignment die of the plurality of alignment dies to the bonding film on an alignment region of the second base substrate using a die attach process.

The present application discloses an anchor structure for application to a microelectromechanical system device comprising a cap layer, a device layer and a substrate layer. Such an anchor structure enhances the stress tolerance of the microelectromechanical system device. The anchor structure comprises a first anchor portion, a second anchor portion and a flexible member located in the device layer. The first anchor portion and the second anchor portion are connected to two sides of the flexible member, respectively. The first anchor is secured to the cap layer by a first bonding portion, and the second anchor is secured to the substrate layer by a second bonding portion.

A method for transferring a plurality of micro devices e is provided. The method includes picking up the micro devices from a carrier substrate by a transfer head, and iteratively performing a placing process. The placing process includes moving the transfer head to a position, at which an array of the micro devices is positioned over an array of receiving locations of a receiving substrate, and placing said array of the micro devices onto the array of the receiving locations of the receiving substrate.

A device (30, 40) for the transfer of a plurality of watch components (2) arranged on a first support (10) to their arrangement on a second support (20), wherein it comprises an inlet surface (31, 41) comprising inlet orifices (33, 43) so arranged as to correspond to a first arrangement of the watch components (2) on a first support (10), an outlet surface (32, 42) comprising outlet orifices (34, 44) so arranged as to correspond to a second arrangement of the watch components (2) on a second support (20), and guide elements (35, 45) adapted to guide the watch components (2) automatically from the inlet orifices (33, 43) to the outlet orifices (34, 44).

A method for transferring a plurality of micro devices e is provided. The method includes picking up the micro devices from a carrier substrate by a transfer head, and iteratively performing a placing process. The placing process includes moving the transfer head to a position, at which an array of the micro devices is positioned over an array of receiving locations of a receiving substrate, and placing said array of the micro devices onto the array of the receiving locations of the receiving substrate.