Patent classifications
B01J13/18
Water repellent organosilicon materials
A process for increasing the hydrophobicity of a porous product by treating the product, or a composition providing for the product, with a water repellent material, characterized in that the porous product or a composition providing the product, is treated with an aqueous suspension of microcapsules where the microcapsules comprise a water repellent organosilicon core material selected from an organosilane, a partially condensed organosilane and a branched siloxane resin, and a shell of a silicon-based network polymer comprising silica units.
COMPOSITIONS COMPRISING BENEFIT AGENT CONTAINING DELIVERY PARTICLE
Compositions that include benefit agent delivery particles, the particles having a core and a shell encapsulating the core, the shell including certain acrylate-based polymers. Processes for making and using such compositions.
COMPOSITIONS COMPRISING BENEFIT AGENT CONTAINING DELIVERY PARTICLE
Compositions that include benefit agent delivery particles, the particles having a core and a shell encapsulating the core, the shell including certain acrylate-based polymers. Processes for making and using such compositions.
PACKAGE STRUCTURE HAVING SOLDER MASK LAYER WITH LOW DIELECTRIC CONSTANT AND METHOD OF FABRICATING THE SAME
A package structure having a solder mask layer with a low dielectric constant includes a substrate, a conductive structure on the substrate, and a solder mask layer on the substrate. The solder mask layer includes bubbles and a solder mask material, wherein the bubbles are disposed within the solder mask layer and the solder mask material covers the bubbles.
PACKAGE STRUCTURE HAVING SOLDER MASK LAYER WITH LOW DIELECTRIC CONSTANT AND METHOD OF FABRICATING THE SAME
A package structure having a solder mask layer with a low dielectric constant includes a substrate, a conductive structure on the substrate, and a solder mask layer on the substrate. The solder mask layer includes bubbles and a solder mask material, wherein the bubbles are disposed within the solder mask layer and the solder mask material covers the bubbles.
Friable shell microcapsules, process for preparing the same and method of use thereof
The present application describes a microcapsule comprising: (i) a lipophilic core material, and (ii) a microcapsule shell, wherein microcapsule shell formed from oil-in-water emulsion polymerisation of monomer mixture consisting essentially of: (a) greater than 70 to about 99% by weight of at least one polyfunctional ethylenically unsaturated monomer, (b) about 1 to about 30% by weight of at least one unsaturated carboxylic acid monomer or its ester, and (c) about 0 to about 30% by weight of at least one vinyl monomer. Also provides process for preparing the same and its method of use in various applications.
MICRON-SIZED SILICA HOLLOW SPHERES WITH RASPBERRY-LIKE STRUCTURES AND A LOW-COST METHOD FOR PREPARATION THEREOF
A method of producing hollow inorganic microparticles each having a raspberry-like structure is disclosed herein. The method includes forming a suspension comprising hierarchical microparticles directly from mixing of aqueous reactants, wherein the aqueous reactants are aqueous solutions each containing a reactant for forming the hierarchical microparticles, wherein the hierarchical microparticles comprise CaCO.sub.3 vaterite particles, adding a base, adding a silica precursor, wherein the base is added prior to adding the silica precursor, and removing the hierarchical microparticles with an acid to obtain the hollow inorganic microparticles each having the raspberry-like structure. A hollow inorganic microparticle having a raspberry-like structure produced according to the method is also disclosed herein.
Hollow particles and use thereof
Hollow particles having a shell including at least one layer, wherein the at least one layer contains a vinyl-based resin, and contains a phosphorus atom and/or a sulfur atom.
Hollow particles and use thereof
Hollow particles having a shell including at least one layer, wherein the at least one layer contains a vinyl-based resin, and contains a phosphorus atom and/or a sulfur atom.
COMPOSITION FOR PREPARING HOLLOW PARTICLES, HOLLOW PARTICLES USING THE SAME AND METHOD OF MANUFACTURING THE HOLLOW PARTICLES
A composition for stably preparing a hollow particle by a coacervation method, a hollow particle prepared using a composition for preparing a hollow particle, and a method of preparing a hollow particle are disclosed. A mono-disperse hollow particle is stably provided by excellent coacervate forming capability, such that it is expected to be beneficially used as a carrier in various fields such as a cosmetic, a paint, plastic, rubber, a synthetic wood, a refractory material, and an agricultural chemical.