A baking oven for producing baked, preferably edible products, includes at least one upper heating apparatus configured as a radiant heating apparatus and at least one lower heating apparatus configured as a radiant heating apparatus in each of which a fuel mixture containing primary air and a fuel is burnt. The upper heating apparatus is disposed in an upper baking area and above an upper transport level and is directed onto a back surface of an upper plate configuration for heating a baking mould from above. The lower heating apparatus is disposed in a lower baking area between the upper transport level and a lower transport level and is directed onto the back surface of a lower plate configuration for heating the baking mould from above.

A baking plate for a baking oven for producing baked products such as soft waffles, crispy wafers, pancakes and the like. The baking plate has a carrier plate and one or more baking inserts disposed thereon, which are configured for receiving the batter to be baked. The baking inserts are formed from sintered ceramic that are very sturdy and tough and have low thermal expansion.

Disclosed is a waffle tong device and a method of using the waffle tong device. The waffle tong device being arranged so that a first and second side of the waffle tong device can be brought together by compressing a spring biased connector and once compressed, the waffle tong device can be placed on a waffle maker, filled with waffle batter and the waffle batter cooked to form a stuffed waffle. The spring biased connector configured such that once the waffle batter is cooked, the waffle tong device can be removed from the waffle maker and allowed to open whereupon the resultant stuffed waffle can be removed from the waffle tong device. Handle portions can be applied to the connector to allow for manipulation of the waffle tong device without risk of burns.

A method for making a plurality of wafer bodies is described, wherein two wafer sheets are mutually coupled so that respective parts are united together to form the wafer bodies, and wherein, subsequently, the united parts are separated from the mutually coupled wafer sheets. The method is characterized in that it involves the use of wafer sheets provided with coupling formations for guaranteeing a correct mutual positioning of the wafer sheets.