The invention relates to a coating device and to a method for metal-coating of workpieces, comprising a housing, which surrounds a working space, a retaining apparatus for retaining at least one workpiece in the working space, at least one deposition apparatus comprising a deposition nozzle for applying a metal powder to the workpiece surface to be coated, and a laser for locally melting the metal powder on the workpiece surface to form a coating, and at least one movement apparatus, by means of which the at least one deposition apparatus can be moved relative to the workpiece surface during the coating. Particularly efficient coating is made possible by at least two deposition apparatuses being arranged in the working space in the housing, which apparatuses are designed to simultaneously apply and melt metal powder.

An example system includes an additive manufacturing tool configured to receive a wire from a wire feeder, to receive current from a power source, and to supply the wire to a workpiece during an additive manufacturing process, and a mechanical oscillation system configured to mechanically oscillate a structural component toward and away from the workpiece, wherein the structural component is external to the wire feeder and the power source.

A microwave plasma apparatus for processing a material includes a plasma chamber, a microwave radiation source, and a waveguide guiding microwave radiation from the microwave radiation source to the plasma chamber. A process gas flows through the plasma chamber and the microwave radiation couples to the process gas to produce a plasma jet. A process material is introduced to the plasma chamber, becomes entrained in the plasma jet, and is thereby transformed to a stream of product material droplets or particles. The product material droplets or particles are substantially more uniform in size, velocity, temperature, and melt state than are droplets or particles produced by prior devices.

A container for powder, a method for marking of the containers for the powder and an apparatus for use of a powder. There is at least one RFID Chip provided in the container, wherein the RFID chip stores at least one set of parameters for material characterization of the powder in the container. A unique key is assigned to every type of powder by means of which the data in the RFID chip located in the container are readable, writeable and updateable via an antenna arranged outside the container.

A method for applying an abradable coating, comprises: generating a plasma; introducing a matrix-forming first particulate to the plasma at a first location; introducing a second particulate of an organic particulate and/or salt particulate to the plasma at a second location downstream from the first location to mix with the matrix-forming first particulate, the second particulate having a characteristic size in the range 6.0 micrometers to 45.0 micrometers; and directing the first particulate and the second particulate to a target to form a coating on the target.

A power coating system for a material in liquid, solid and/or gaseous form used in engineering applications. At least one feeding unit enables the material to be transmitted at a feed rate predetermined by the user. At least one plasma torch located in connection with the feeding unit enables the form of the material to be converted by the atomization method. A powder in an amount predetermined by the user is formed by conversion of the material by the plasma torch. A plurality of reservoirs allow the powder to be separated and collected in sizes predetermined by the user. At least one transmission line allows the powders to be conveyed to the reservoir. A vacuum unit allows the powders to be conveyed by vacuum on the transmission line where at least one part is pre-positioned by the user into the reservoir for applying the coating process.

A thermal spray assembly (10) for transforming precursor material (60) into a layer of deposited material joined to a substrate body. A plasma torch (20) produces a plasma jet from a plasma nozzle (28). A feeder mechanism (30) guides the precursor material (60) into the plasma jet in use and provides a feeder orifice (70) when in an open condition. The feeder mechanism comprises a guide chamber (34) and a moveable guide mechanism (32), and the guide chamber is capable of guiding the precursor material to the feeder orifice, through which the precursor material can move from the guide chamber and enter the plasma jet at a variable mean distance from the plasma nozzle (28) in response to movement of the guide mechanism (32).

A thermal spray assembly (10) for transforming precursor material (60) into a layer of deposited material joined to a substrate body. A plasma torch produces a plasma jet from a plasma nozzle (28) and a feeder mechanism (30) guides the precursor material into the plasma jet in use and is capable of providing a feeder orifice when in an open condition. The feeder mechanism (30) is provided with a distribution chamber configured for guiding moving precursor material azimuthally around the plasma torch, a plurality of deflector structures (38) configured for deflecting the precursor material (60) from the distribution chamber and guiding it into a guide chamber configured for guiding the precursor material (60) to the plasma jet in use.

Powder injection apparatus, plasma gun, and method of use. Powder injection apparatus includes a shroud attachable to an outlet nozzle of a thermal spray apparatus and a substantially smooth and continuous inner wall defining a bowl through which a plume of the thermal spray apparatus travels. At least one port in the inner wall is structured and arranged to receive a powder injection nozzle that injects powder into the plume.

The invention relates to a plasma coating device (10) and a method for homogenous coating of a substrate (12). It comprises a particle reservoir (14), a dosing device (16) for dosing the particles (15) contained in the particle reservoir (14), a processing chamber (20) and a transport line (18) to convey particles (15) into the processing chamber (20). The processing chamber pressure (P1) in the processing chamber (20) is lower than the particle reservoir pressure (P2) in the particle reservoir (14).