A cookie-cutting device is provided. The device is comprised of a cookie-cutting device designed to streamline the production of cream wafer cookies by cutting, shaping, and perforating dough in a single motion. The device comprises at least one cookie-cutting member with a continuous sidewall featuring notches for creating jagged edges or smooth options for plain edges. The bottom surface of the cutting member includes pointed members to perforate the dough, enabling customizable decorative patterns. Multiple cookie-cutting members can be arranged in various patterns to cut several cookies simultaneously, enhancing efficiency and reducing waste. The method of use involves pressing the device onto dough to simultaneously cut and perforate, simplifying and accelerating cookie production compared to manual techniques.