Cleaning fixtures for a component(s) are disclosed. The cleaning fixtures may include a first and second component recess configured to receive a first and second component, respectively. Each component recess may be defined between a first and second member of the cleaning fixture. The cleaning fixture may also include a first solvent conduit in fluid communication with the first component recess, and a second solvent conduit in fluid communication with the second component recess. The first and second solvent conduit may include physical characteristic(s) configured to control delivery of solvent into the respective component recess at desired fluid parameter(s). The cleaning fixture may also include a first gas conduit in fluid communication with the first component recess, and a second gas conduit in fluid communication with the second component recess. Each of the first and second gas conduit may deliver a pressurized gas to the respective component recess.

Cleaning fixtures for a component(s) are disclosed. The cleaning fixtures may include a first and second component recess configured to receive a first and second component, respectively. Each component recess may be defined between a first and second member of the cleaning fixture. The cleaning fixture may also include a first solvent conduit in fluid communication with the first component recess, and a second solvent conduit in fluid communication with the second component recess. The first and second solvent conduit may include physical characteristic(s) configured to control delivery of solvent into the respective component recess at desired fluid parameter(s). The cleaning fixture may also include a first gas conduit in fluid communication with the first component recess, and a second gas conduit in fluid communication with the second component recess. Each of the first and second gas conduit may deliver a pressurized gas to the respective component recess.

A composition for producing a putty. The composition includes a binder component with 40 to 95 wt.-% of an epoxy resin based on a total mass of the binder component, a hardener component with 5 to 70 wt.-% of an NH-group-containing compound relative to a total mass of the hardener component, and 0.1 to 15 wt.-% of synthetic hollow bodies based on a total mass of the putty. The synthetic hollow bodies have a density of 0.005 to 0.8 g/cm.sup.3.

A two-component pumping system includes a first pump for pumping a first component, a second pump for pumping a second component, a motor, and a yoke assembly for connecting the motor to the first pump and the second pump and driving them simultaneously. The first pump includes a first displacement rod that reciprocates in a first pump axis. The second pump includes a second displacement rod that reciprocates in a second pump axis parallel to the first pump axis. The motor includes a drive shaft configured to reciprocate in a drive axis that is parallel to and in a common plane with the first and second pump axes. The motor is also configured to drive the first and second displacement rods in unison. The yoke assembly includes a top connector and a shoe. The top connector connects to the drive shaft.

A two-component pumping system includes a first pump for pumping a first component, a second pump for pumping a second component, a motor, and a yoke assembly for connecting the motor to the first pump and the second pump and driving them simultaneously. The first pump includes a first displacement rod that reciprocates in a first pump axis. The second pump includes a second displacement rod that reciprocates in a second pump axis parallel to the first pump axis. The motor includes a drive shaft configured to reciprocate in a drive axis that is parallel to and in a common plane with the first and second pump axes. The motor is also configured to drive the first and second displacement rods in unison. The yoke assembly includes a top connector and a shoe. The top connector connects to the drive shaft.

Cleaning fixtures for a component(s) are disclosed. The cleaning fixtures may include a first and second component recess configured to receive a first and second component, respectively. Each component recess may be defined between a first and second member of the cleaning fixture. The cleaning fixture may also include a first solvent conduit in fluid communication with the first component recess, and a second solvent conduit in fluid communication with the second component recess. The first and second solvent conduit may include physical characteristic(s) configured to control delivery of solvent into the respective component recess at desired fluid parameter(s). The cleaning fixture may also include a first gas conduit in fluid communication with the first component recess, and a second gas conduit in fluid communication with the second component recess. Each of the first and second gas conduit may deliver a pressurized gas to the respective component recess.

Cleaning fixtures for a component(s) are disclosed. The cleaning fixtures may include a first and second component recess configured to receive a first and second component, respectively. Each component recess may be defined between a first and second member of the cleaning fixture. The cleaning fixture may also include a first solvent conduit in fluid communication with the first component recess, and a second solvent conduit in fluid communication with the second component recess. The first and second solvent conduit may include physical characteristic(s) configured to control delivery of solvent into the respective component recess at desired fluid parameter(s). The cleaning fixture may also include a first gas conduit in fluid communication with the first component recess, and a second gas conduit in fluid communication with the second component recess. Each of the first and second gas conduit may deliver a pressurized gas to the respective component recess.

An insulation material formed of a composition, and a method of making an insulation material is provided. The composition forming the insulation material includes magnesium oxide; at least one of magnesium chloride, magnesium sulfate, and hydrates thereof; water; a foaming agent; a thickener; and a foam stabilizer. The composition is foamed to promote aeration of the composition to reduce density of the insulation material formed from the composition.

Provided are a cleaning method and cleaning device for cleaning with micro/nano-bubbles, with which a simple method of spraying a treatment solution containing micro/nano-bubbles onto a substrate to be processed makes it possible to efficiently and reliably peel off residual resist or remove contaminants from the substrate, while reducing an environmental load. This cleaning method is characterized in that, with respect to a substrate to be treated to which a resist film has adhered onto the substrate or a substrate to be treated to which the surface thereof has been contaminated with a metal or metal compounds, the resist film is peeled off or the metals or metal compounds are removed by spraying onto the substrate to be treated a treatment solution containing gaseous micro/nano-bubbles and having a temperature maintained at 30 C. to 90 C., the mean particle size of the micro/nano-bubbles when measured by an ice embedding method using a cryo-transmission electron microscope being 100 nm or smaller, preferably 30 nm or smaller, and also preferably the density of such bubbles being 10.sup.8 or more bubbles per 1 mL.

Provided are a cleaning method and cleaning device for cleaning with micro/nano-bubbles, with which a simple method of spraying a treatment solution containing micro/nano-bubbles onto a substrate to be processed makes it possible to efficiently and reliably peel off residual resist or remove contaminants from the substrate, while reducing an environmental load. This cleaning method is characterized in that, with respect to a substrate to be treated to which a resist film has adhered onto the substrate or a substrate to be treated to which the surface thereof has been contaminated with a metal or metal compounds, the resist film is peeled off or the metals or metal compounds are removed by spraying onto the substrate to be treated a treatment solution containing gaseous micro/nano-bubbles and having a temperature maintained at 30 C. to 90 C., the mean particle size of the micro/nano-bubbles when measured by an ice embedding method using a cryo-transmission electron microscope being 100 nm or smaller, preferably 30 nm or smaller, and also preferably the density of such bubbles being 10.sup.8 or more bubbles per 1 mL.