In one embodiment, a liquid discharge head includes, a circuit board including a drive IC, and a circulation flow path including a supply flow path that communicates with a liquid discharge unit that discharges liquid, and a collection flow path that is provided in a manner so that heat is transmittable to the circuit board, the collection flow path that communicates with the liquid discharge unit.

Methods and apparatuses herein provide for the application of viscous fluids, such as adhesives, in pre-determined patterns, to an advancing substrate. The fluid applicator comprises a slot die applicator and a substrate carrier. The slot die applicator comprises a plurality of applicator channels, each applicator channel being controlled by a switching valve, and wherein the switching valves are independently switchable.

An applicator for dispensing adhesive and a method of diverting flow in an applicator are disclosed. The applicator includes a plurality of pump assemblies each having an inlet and an outlet, a plurality of dispensing modules each having an inlet, and a flow diverter plate in fluid communication with the plurality of pump assemblies. The flow diverter plate defines a body having a first surface in fluid communication with the plurality of pump assemblies, a second surface opposite the first surface in fluid communication with the plurality of dispensing modules, and a plurality of diverter passages extending from the first surface to the second surface. Each of the plurality of diverter passages has a first opening on the first surface and a second opening on the second surface, and the first opening is in fluid communication with the outlet of one of the plurality of pump assemblies, and the second opening is in fluid communication with the inlet of at least one of the plurality of dispensing modules.

An optical bonding machine is provided that includes a robotic placement machine having a Z axis actuator coupled to a first end of a base portion of the robotic placement machine, the Z axis actuator capable of moving up and down a Z axis, and a pick and place plate operably connected to the Z axis actuator, and a vertically oriented adhesive application valve configured to apply an amount of adhesive onto an underside of a substrate, the underside of the substrate facing down when the amount of adhesive is applied, wherein the pick-and-place plate of the robotic placement machine manipulates the substrate within the optical bonding machine such that the substrate receives the amount of adhesive prior to being optically bonded to an other substrate; wherein a movement of the robotic placement machine is controllable over at least 3 axes.

A valve arrangement for applying fluid media, in particular glue, to surfaces, comprising a plurality of individual modules detachably connected to form a row, wherein in the row and between the adjacent individual modules is respectively formed a dividing plane, in which the respectively adjacent individual modules bear one against another, and at least one dividing plane is assigned a heating member for warming the valve arrangement, preferably a plurality of or all dividing planes are respectively assigned a heating member, which is seated in appropriate, mutually opposing receptacles, arranged to both sides of the dividing plane, of the two adjacent individual modules, and cooperates in such a way with those walls of the individual modules which delimit the receptacles that relative movements of the two individual modules in at least one spatial direction are limited or prevented.

An applicator for dispensing liquid material onto a substrate includes a body, a valve module, and a backpressure control device having a device passage. The body includes an inlet passage, a dispensing outlet passage, and a recirculation outlet passage. The valve module has a dispensing mode and a recirculation mode, and directs the liquid material through the dispensing outlet passage in the dispensing mode and directs the liquid material through the recirculation outlet passage in the recirculation mode. The backpressure control device directs the liquid material through the device passage in the recirculation mode such that a backpressure of the liquid material in the recirculation mode is substantially equal to a backpressure of the liquid material in the dispensing mode. A method of adjusting a backpressure experienced by liquid material is also disclosed.

A glue delivery system and method for providing precise application of glue on a substrate. A bead of glue is extruded from a first glue chamber to a leading edge of the substrate. A trailing edge of the substrate is blown off and over to the nozzle to receive a smear of glue from a second glue chamber. A gear pump is controlled by a servo drive that is connected to a servomotor utilizing a gear reducer. The pump regulates the extrusion of the glue onto the substrate that is programmed with empirical data of gear reducer ratio at which the glue flows within a constant speed, torque, current, speed and position of the glue. The empirical data is provided to a programmable logic circuit to achieve a precise pressure related to volume of a glue deposition and speed of the substrate onto which the glue is applied.

A liquid discharge apparatus includes a liquid chamber including a discharge orifice; a supplying unit configured to supply a pressurized liquid to the liquid chamber; a first valve member provided in the liquid chamber and including a valve portion configured to open and close the discharge orifice; a moving unit configured to move the first valve member; and a stirring mechanism configured to stir the pressurized liquid in the liquid chamber.

An improved system for application of liquid streams to a substrate. The system incorporates open face flow channels for carrying the liquid away from fully enclosed flow segments prior to discharge along an unconstrained flow path. The present invention further provides an improved, self-aligning modular assembly for delivery of impingement jet to the liquid streams for diverting the direction of the liquid streams. The present invention further provides an improved arrangement for collection of the deflected liquid in response to application of the impingement jet without excess residue build-up.

A system for dispensing hot melt adhesives, comprising an adhesive dispenser including a fluid passage leading to an outlet. The system further comprises a supply conduit fluidly connected to the fluid passage and a feeding mechanism configured to feed an elongate, flexible element of solid adhesive into the supply conduit. The system further comprises a first heating element positioned along at least a portion of the supply conduit to melt a portion of the elongate, flexible element being fed into the supply conduit and thereby form a supply of liquid adhesive within the supply conduit.