Systems and methods related to dispensing fluid and controlling a dispensing operation. The system includes a fluid dispenser including an inlet and an outlet, the dispenser being operable to start and stop the flow of the fluid from the outlet onto a substrate. A fluid supply reservoir adapted to hold the fluid, and having an outlet coupled in fluid communication with the inlet of the fluid dispenser to establish a flow path for the fluid between the fluid supply reservoir and the outlet of the fluid dispenser. The fluid supply reservoir further includes a pneumatic input coupled to an air flow path adapted to receive pressurized air for forcing the fluid from the outlet of the reservoir. An electronic air mass flow meter device is operatively coupled to the air flow path to produce electrical output signals proportional to the mass flow rate of the air flowing through the pneumatic input. Components and methods are provided to accurately determine the volume of the fluid in the reservoir, and to set the stroke length of a valve used in the system.

A discharge system includes: a head unit including discharge heads that discharge a liquid material from nozzle openings that are communication with cavities onto a target by changing the internal pressure of the cavities using piezo elements; a viscosity estimating unit that estimates the viscosity of the liquid material by sucking the liquid material from first vessels that hold the liquid material into the cavities; and a waveform control unit that controls the voltage applied to the piezo elements according to the estimated viscosity of the liquid material.

A sensing system includes a temperature sensor that measures a temperature inside a hopper, a heating element that generates heat inside the hopper to melt or heat an adhesive in the hopper according to a duty cycle, and a controller that examines the temperature measured inside the hopper and determines whether the duty cycle of the heating element is to be changed based on the temperature that is measured. The controller determines a level of the adhesive in the hopper based on the duty cycle of the heating element.

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space for treating a substrate therein; a support unit configured to support the substrate at the treating space; a nozzle for supplying a liquid to the substrate placed on the support unit; a liquid supply unit configured to supply the liquid to the nozzle and have a flow meter; and a flow rate measuring unit configured to verify an error of the flow meter; and a controller for controlling the liquid supply unit and the flow rate measuring unit, and wherein the flow rate measuring unit comprises: a cup for accommodating the liquid; a measuring means configured to verify a level of the liquid accommodated in the cup; and a discharge line for discharging the liquid within the cup and having a discharge valve installed thereon, and wherein the controller controls the liquid supply unit to discharge a liquid of a first amount to the cup for a first time in a state at which the discharge valve is closed, and controls the measuring means to determine whether an error has occurred in the flow meter by determining whether the level of the liquid accommodated in the cup is the first amount.

A fluid discharging system 10 includes a discharging device 30 configured to discharge fluid, a pump 20 configured to supply the fluid stored in a reservoir 22 to the discharging device 30, a supply line 40 connecting the discharging device 30 with the pump 20 to allow the fluid to pass therethrough, and a buffer tank 50, disposed at an intermediate location of the supply line 40, and configured to suck and discharge the fluid. The fluid discharging system 10 is capable of continuing supply of the fluid to the discharging device 30 by discharging the fluid from the buffer tank 50 to the supply line 40, while limiting the supply of the fluid from the pump 20 to the discharging device 30. The buffer tank 50 is capable of realizing a pressure acting state and a holding state.

A sealer management system processes a method for monitoring a sealer usage. The sealer management system includes: an application unit for applying a sealer to a vehicle body; a pump for supplying the sealer to the application unit; a first sensor for detecting absence of a sealer inside a sealer drum, and a second sensor for detecting whether the sealer drum has been replaced; a sealer application device including an application controller that recognizes when the sealer drum is replaced based on the detection information of the first sensor and the second sensor, and calculates the actual sealer usage by counting the number of times of the replacement of the sealer drum; and a management server that compares the actual sealer usage obtained from the sealer application device with a set standard sealer usage to determine whether a sealer usage failure event occurs.

A sealer management system processes a method for monitoring a sealer usage. The sealer management system includes: an application unit for applying a sealer to a vehicle body; a pump for supplying the sealer to the application unit; a first sensor for detecting absence of a sealer inside a sealer drum, and a second sensor for detecting whether the sealer drum has been replaced; a sealer application device including an application controller that recognizes when the sealer drum is replaced based on the detection information of the first sensor and the second sensor, and calculates the actual sealer usage by counting the number of times of the replacement of the sealer drum; and a management server that compares the actual sealer usage obtained from the sealer application device with a set standard sealer usage to determine whether a sealer usage failure event occurs.