An apparatus for dispensing a liquid comprising: a supply flow path; a pressurised liquid source arranged to supply pressurised liquid to the supply flow path; a junction downstream of the pressurised liquid source, wherein at the junction the supply flow path is branched into a dispense flow path and a return or drain flow path; and a valve or pump in the return or drain flow path downstream of the junction.

Embodiments included herein are directed towards apparatuses, systems, and methods for fluid dispensing. Embodiments may include piezo-actuated valves, dispense cassettes, and closed loop systems for regulating pressure associated with fluid dispensers. Embodiments of an apparatus may include a piezo-actuated valve and a dispense cassette.

A remote metering station for pumping a flow of adhesive to a dispensing module is disclosed. The remote metering station includes a manifold having a front surface, a back surface opposite to the front surface, a first side surface, a second side surface opposite the first side surface, a top surface, and a bottom surface opposite to said top surface. The remote metering station also includes a modular pump assembly removably mounted to the manifold, where the modular pump assembly includes a bottom surface, an outlet on the bottom surface, the outlet being in fluid communication with the manifold, and an inlet for receiving the adhesive. The modular pump assembly further includes a gear assembly and a drive motor coupled to the gear assembly. The gear assembly is operable for pumping the adhesive from the inlet to the outlet.

A treatment solution supply apparatus for supplying a treatment solution to a solution treatment apparatus which applies the treatment solution to a substrate to perform a predetermined treatment, there being a plurality of solution treatment apparatuses which are supply destinations of the treatment solution, the treatment solution supply apparatus includes: a sending unit common among the plurality of solution treatment apparatuses, the sending unit being configured to send the treatment solution stored in a treatment solution supply source to each of the plurality of solution treatment apparatuses; and a control unit configured to control the sending unit, wherein the sending unit includes a plurality of pumps configured to suck the treatment solution and load the treatment solution thereinto and to send the loaded treatment solution, and wherein the control unit is configured to control suction timing of each of the plurality of pumps so that at least one of the plurality of pumps becomes a state capable of sending the treatment solution to the plurality of solution treatment apparatuses at all times.

A device for intermittently applying a flowable substance to a substrate includes an applicator nozzle for applying the flowable substance to the substrate, a tank for holding the flowable substance, a pump for delivering the substance, and a drive means, wherein the pump is actively connected to the tank and driven by drive means, and further including an actuator actively connected to the pump and transferred into two positions, in a first position the actuator conducts the substance to the applicator nozzle, and in a second position blocks the feed to the applicator nozzle, and further including a control device for activating the actuator and for regulating the speed of the drive means of the pump. A method for applying the substance using the device is also provided.

A hot melt dispensing system is described. The hot melt dispensing system includes a melter that melts solid material into hot melt, a pump that pumps the hot melt from the melter to at least one applicator, and a pressure control system that controls a pressure of pressurized air for operating the pump. The pressure control system includes a regulator assembly that controls the pressure of the pressurized air, and a drive component that actuates the regulator assembly. The hot melt dispensing system also includes a controller that determines a pressure setting for the pressurized air. The drive component receives the pressure setting from the controller and actuates the regulator assembly to a position associated with the pressure setting.

An apparatus for accurately coating discrete patches of coating on a moving substrate is described. The coating system applies coating to a moving substrate using a coating distribution device. A flow pump pumps the coating from a reservoir into the coating distributing device where a portion of the coating is deposited and the remainder is allowed to returned back to the reservoir. The coating distribution device selectively meters a portion of the coating it receives from the flow pump onto the substrate at a variable rate. When the coating distribution device transitions from metering to not metering and to reverse metering, it induces a vacuum in the coating distribution device. The induced vacuum causes a portion of the coating being distributed onto the substrate to flow in reverse quickly breaking the deposition of the coating.

A sealing system for applying resin to a cut edge of a composite structure, the cut edge having exposed carbon fibers. The system includes: a tool that comprises a nozzle and a resin source; a controller configured to control: a movement of the tool, and flow of resin from the resin source to the nozzle; and an application tip connected to the nozzle of the tool and configured to apply the resin to the cut edge of the composite structure. The application tip may have an exterior surface with a circular cross section and an indentation for a first length along a longitudinal axis of the application tip and a first end and a second end configured such that a resin flows from the first end to the second end.

Provided is a liquid chemical supply module and a substrate processing apparatus including the same, the liquid chemical supply module including a main supplier for supplying a liquid chemical from a liquid chemical tank to at least one substrate processing apparatus, and at least one distribution supplier for connecting between the main supplier and any one substrate processing apparatus to distribute the liquid chemical supplied through the main supplier to the any one substrate processing apparatus, wherein the distribution supplier includes a distribution line branched from a main line of the main supplier, a first circulation line branched from the distribution line and connecting between the distribution line and the main line, and a second circulation line branched from the distribution line connecting between the distribution line and the main line.

Systems and methods for applying a liquid coating to a substrate are disclosed herein. One exemplary method includes calibrating flow rate of a material through a coating system. A target flow rate for the material through a spray nozzle is received, a first operating pressure of the coating system based upon the target flow rate is calculated, and the material is ejected onto a least part of a surface with the material flowing through the spray nozzle at the first operating pressure of the coating system. Subsequent to a comparison between an operating flow rate and the target flow rate, the operating pressure is adjusted to a second operating pressure and at least part of the substrate is sprayed with the material flowing through the spray nozzle at the second operating pressure of the coating system.