Patent classifications
B06B1/0622
COLLECTIVE PROCESS FOR ULTRASOUND TRANSDUCERS
The present disclosure relates to the bulk manufacture of transducer arrays, including arrays having at least one 3D printed (or otherwise additive manufactured) acoustic matching layers. In certain implementations, the manufactured transducers include a composite-piezoelectric transducer on a de-matching layer. In one implementation, by producing multiple arrays at once on a common carrier, and by using direct-deposit additive processes for the matching layers, the described processes greatly reduce the number of parts and the number of manual operations.
Ultrasonic transducer for parametric array
An ultrasonic transducer having a reduced cost of manufacture. The ultrasonic transducer includes a first insulative retaining layer, a second insulative retaining layer, and a vibrator film layer sandwiched between the first and second retaining layers. The first retaining layer includes a first plurality of apertures formed therethrough, and the second retaining layer includes a second plurality of apertures formed therethrough, in which the second apertures are substantially in registration with the first apertures. The ultrasonic transducer further includes a first cover portion having a plurality of spring/backplate assemblies connected thereto, and a second cover portion. The combination of the first retaining layer, the vibrator film layer, and the second retaining layer is sandwiched between the first and second cover portions of the ultrasonic transducer. The laminated construction of the ultrasonic transducer allows the formation of an array of ultrasonic film transducers using a single piece of ultrasonic vibrator film.
Ultrasound fingerprint sensing and sensor fabrication
Disclosed are systems, devices and methods for providing fingerprint sensors based on ultrasound imaging techniques in electronic devices and fabrication techniques for producing ultrasound-based fingerprint sensors. In some aspects, an ultrasound fingerprint sensor device includes an intermediate layer coupled to a base chip including an integrated circuit having conducive contacts at a surface of the base chip, the intermediate layer including an insulation layer formed on the base chip and a corresponding array of channeling electrode structures coupled to the conductive contacts and passing through the insulation layer, in which the channeling electrodes terminate at or above a top surface of the insulation layer to provide bottom electrodes; a plurality of ultrasonic transducer elements including an acoustic transducer material coupled to the bottom electrodes; and a plurality of top electrodes positioned on the ultrasonic transducer elements.
Acoustic Logging Tool Utilizing Fundamental Resonance
An acoustic logging tool includes a first acoustic transducer and a second acoustic transducer. At least a portion of the first transducer is parallel with the second transducer. The first and second acoustic transducers are configured to propagate an acoustic signal in the same direction. The first acoustic transducer is configured to generate an acoustic output having a different frequency than the second acoustic transducer.
ENERGY BASED FAT REDUCTION
Systems and methods for non-invasive fat reduction can include targeting a region of interest below a surface of skin, which contains fat and delivering ultrasound energy to the region of interest. The ultrasound energy generates a thermal lesion with said ultrasound energy on a fat cell. The lesion can create an opening in the surface of the fat cell, which allows the draining of a fluid out of the fat cell and through the opening. In addition, by applying ultrasound energy to fat cells to increase the temperature to between 43 degrees and 49 degrees, cell apoptosis can be realized, thereby resulting in reduction of fat.
PIEZOELECTRIC MICROMECHANICAL ULTRASONIC TRANSDUCERS AND TRANSDUCER ARRAYS
An apparatus may include one or more segmented piezoelectric micromechanical ultrasonic transducer (PMUT) elements. Each segmented PMUT element may include a substrate, an anchor structure disposed on the substrate and a membrane disposed proximate the anchor structure. The membrane may include a piezoelectric layer stack and a mechanical layer. The anchor structure may include boundary portions that divide the segmented PMUT element into segments. Each segment may have a corresponding segment cavity. The boundary portions may correspond to nodal lines of the entire membrane. The membrane may include a membrane segment disposed proximate each segment cavity. The membrane may be configured to undergo one or both of flexural motion and vibration when the segmented PMUT element receives or transmits signals.
ULTRASONIC PHASED ARRAY PROBE USING PCB AS MATCHING LAYER
Disclosed is a flexible ultrasonic transducer in which a single layer serves dual function as both a matching layer and a flexible circuit for making electrical connections, and there is no separate matching layer. Also disclosed is a method of assembling the flexible transducer.
Actuator device
Actuator device has a main body with base and superstructure bodies, the device having a plurality of actuators formed from a piezoelectric or electrostrictive material and each extend from the base body and form the superstructure body. The actuators each have at least two inner actuating electrodes of which at least one first inner actuating electrode extends, in a positive depthwise direction from the front side up to a distance from the rear side, and of which at least one second inner actuating electrode extends in a negative depthwise direction from the rear side up to a distance from the front side. At least one first inner actuating electrode of each actuator is provided for electrical connection to a first connection pole of an actuating device, a rear-side layer which is formed from electrically conductive material arranged on the rear side of the actuator device.
Ultrasonic probe apparatus and ultrasonic imaging apparatus using the same
An ultrasonic probe apparatus and an ultrasonic imaging apparatus are disclosed. The ultrasonic probe apparatus includes: an ultrasonic transducer configured to output an electrical signal upon receiving ultrasonic waves; a sound absorption unit, one surface of which is an installation surface of the ultrasonic transducer and is electrically connected to the ultrasonic transducer; a first electronic circuit electrically connected to the sound absorption unit; and a substrate connection unit disposed between the sound absorption unit and the first electronic circuit, configured to electrically interconnect the first electronic circuit and the sound absorption unit. The ultrasonic imaging apparatus includes the above ultrasonic probe and a main body.
ULTRASONIC DEVICE, ULTRASONIC PROBE, ULTRASONIC APPARATUS, AND ULTRASONIC DEVICE MANUFACTURING METHOD
An ultrasonic device includes: an element substrate including an ultrasonic transducer and a first connection electrode connected to the ultrasonic transducer; a reinforcing plate that is bonded to the element substrate to reinforce the element substrate; and a second connection electrode provided on the reinforcing plate. The first and second connection electrodes are connected to each other in a bonding portion between the element substrate and the reinforcing plate.