B06B1/0651

ULTRASONIC/MEGASONIC CLEANING DEVICE
20200406312 · 2020-12-31 ·

An ultrasonic/megasonic cleaning device includes a cleaning unit including an upper casing and a lower casing connected to form a hollow chamber, an ultrasonic/megasonic generator provided in the hollow chamber, and a bottom quartz component provided with a quartz rod array composed of a plurality of vertically arranged quartz rod-like structures; a spray arm connected to the upper casing; and an ultrasonic/megasonic frequency control unit connected between the at least one signal source and the ultrasonic/megasonic generator, for constantly varying a frequency of the electrical signal output from the at least one signal source and introducing the electrical signal into the ultrasonic/megasonic generator, so as to dynamically vary an oscillation frequency of the ultrasonic/megasonic wave generated by the ultrasonic/megasonic generator; wherein the ultrasonic/megasonic frequency control unit includes a frequency-switching timing control unit configured to trigger am ultrasonic/megasonic frequency switching control unit to switch the oscillation frequency of the ultrasonic/megasonic wave from a first frequency to a second frequency when the ultrasonic/megasonic wave has been generated at the first frequency for a time period, the time period being randomly selected within a time range.

VIBRATION DEVICE AND DRIVING DEVICE
20200373856 · 2020-11-26 ·

A vibration device is provided that includes a vibration element with a piezoelectric vibrator and a driving device that causes the vibration element to vibrate. The vibration element includes a translucent body and the piezoelectric vibrator is electrically coupled to the driving device. The driving device includes a first circuit that applies an electric signal to the piezoelectric vibrator to render the vibration element in a resonant state, a second circuit that applies an electric signal to the piezoelectric vibrator according to a feedback signal output from the piezoelectric vibrator, and a switch that switches coupling between the first circuit and the piezoelectric vibrator and coupling between the second circuit and the piezoelectric vibrator at a certain timing.

Method for Tuning the Resonant Frequency of a Piezoelectric Micromachined Ultrasonic Transducer
20200338592 · 2020-10-29 ·

The teachings of the present disclosure enable the manufacture of one or more piezoelectric micromachined ultrasonic transducers (PMUTs) having a resonant frequency of a specific target value and/or substantially matched resonant frequencies. In accordance with the present disclosure, a flexible membrane of a PMUT is modified to impart a desired parameter profile for stiffness and/or mass to tune its resonant frequency to a target value. The desired parameter profile is achieved by locally removing or adding material to regions of one or more layers of the flexible membrane to alter its geometric dimensions and/or density. In some embodiments, material is added or removed non-uniformly across the structural layer to realize a material distribution that more strongly affects membrane stiffness than mass. In some embodiments, material having a specific residual stress is added to, and/or removed from, the membrane to define a desired modal stiffness for the membrane.

VIBRATION DEVICE AND OPTICAL DETECTION DEVICE
20200338607 · 2020-10-29 ·

A vibration device includes a vibrator including a cylinder including an opening, a light-transmissive cover directly or indirectly coupled to the cylinder to cover the opening of the cylinder, and a piezoelectric element to vibrate the light-transmissive cover, and including an opening end portion, an elastic member holding the opening end portion of the vibrator, and a case connected to the elastic member.

ULTRASONIC SENSOR

An ultrasonic sensor includes: an element storage case including a case-side diaphragm having a thickness direction along a directional axis; and an ultrasonic element accommodated in the element storage case and spaced apart from the case-side diaphragm. The ultrasonic element includes an element-side diaphragm having the thickness direction along the directional axis and provided by a thin part of a semiconductor substrate. The semiconductor substrate is arranged to provide a closed space between the case-side diaphragm and the element-side diaphragm. The semiconductor substrate is fixed and supported by the element-storage case.

PIEZO HAPTIC FEEDBACK DEVICE WITH INTEGRATED SUPPORT
20200306797 · 2020-10-01 ·

According to an embodiment, a device comprises: a piezoelectric element configured to convert an electrical voltage into a mechanical strain; and a conductive base plate onto which the piezoelectric element is fastened, wherein the conductive base plate comprises an integrated support positioned on an underside of the conductive base plate, wherein the conductive base plate is supported by the integrated support; wherein the device is configured to provide haptic feedback on a basis of the mechanical strain.

High Temperature Ultrasonic Transducers and Signal Connectors
20200269281 · 2020-08-27 · ·

Pressure vessels that operate at elevated temperatures and pressures (e.g., 600 F./316 C., 20000 psig), and ultrasonic transducers and signal connectors for use therein, are described. The pressure vessels include a housing defining a cavity. The housing includes a cylindrical body with plugs positioned within openings of the cylindrical body. Each plug has a recess extending from an external surface to a location ultrasonically adjacent the cavity. The pressure vessels additionally include transducer assemblies positioned within respective plug recesses. Each transducer assembly includes a signal connector positioned within the recess adjacent the external surface, a transducer having a piezoceramic element positioned within the recess at the location ultrasonically adjacent the cavity, and a metallic interconnection spring interconnecting the transducer to the signal connector.

ULTRASOUND PROBE, ULTRASOUND DIAGNOSTIC APPARATUS, AND METHOD FOR PRODUCING BACKING MATERIAL
20200268358 · 2020-08-27 ·

An ultrasound probe of the present invention has a piezoelectric element and a backing material disposed on one direction side with respect to the piezoelectric element, the backing material containing heat conductive particles. The backing material has a heat conductivity of 2.0 W/mk or more, and the content of the heat conductive particles is less than 30 vol % based on the total volume of the backing material.

Piezoelectric micromachined ultrasonic transducers having differential transmit and receive circuitry

An apparatus comprises an ultrasonic transducer having a first and second electrode and switches which configured to selectively connect the first and second electrodes to a transmit voltage source or to a receive amplifier. The switches are configured to selectively connect a first input of the amplifier to the first electrode of the transducer and to selectively connect a second input of the amplifier to the second electrode of the transducer. The switches are also configured to selectively connect the voltage source to the first and second electrodes of the transducer. The transducer may include a piezoelectric layer attached to and sandwiched between the first electrode and the second electrode, and a flexible membrane attached to the first electrode. The piezoelectric layer may be patterned to form an annular ring at the outer diameter of the flexible membrane.

INPUT DEVICE AND ELECTRONIC DEVICE COMPRISING SAME

Provided is an input device. The input device includes a piezoelectric vibration member; a frame disposed to contact at least one area of the piezoelectric vibration member; and a connection member disposed on one surface of the piezoelectric vibration member. The piezoelectric vibration member detects a pressure applied from the outside to generate a voltage and is vibrated in accordance with a signal applied from an external device.