A vibration device includes a light transmissive body, a first cylindrical body, a plate-shaped spring portion, a second cylindrical body, and a vibrating body. The light transmissive body includes a main body portion on an inner side of a portion supported by the first cylindrical body, and a protruding portion extending from the main body portion toward an outer circumference of the light transmissive body and protruding outward more than a portion supported by the first cylindrical body. A ratio between an equivalent mass calculated from a moment of inertia of the protruding portion and a weight of the main body portion is about 0.8 to about 1.2, and a resonant frequency of the light transmissive body is larger than a resonant frequency of the spring portion.

A sound source for acoustic communication, navigation, and networking of an underwater glider may include a cylindrical body, a rigid front section disposed anteriorly to the cylindrical body, a plurality of metal rods, a resonant pipe surrounding the rods, and a rod-mounted piezo-ceramic transducer disposed between the body and the front section. Each rod may be attached at a first end to an anterior portion of the body and at a second end to a posterior portion of the front section. The pipe may be disposed between the body and the front section. The transducer may be disposed within the pipe. A posterior end of the pipe may be separated from the anterior portion of the body by a first orifice, and an anterior end of the pipe may be separated from the posterior portion of the front section by a second orifice.

Methods for improving the electromechanical coupling coefficient and bandwidth of micromachined ultrasonic transducers, or MUTs, are presented as well as methods of manufacture of the MUTs improved by the presented methods.

An ultrasound energy delivery system is provided that includes a transducer and a housing.

A vibration device includes a top plate elastic body, a cylindrical body that includes a first end portion and a second end portion and is coupled with the top plate elastic body to retain the top plate elastic body on a side of the first end portion. The cylindrical body includes on a side of the second end portion, a ring-shaped flange portion extended outward in a radial direction of the cylindrical body, and a piezoelectric element fixed to the ring-shaped flange portion to cause the cylindrical body to vibrate.

The invention relates to an ultrasonic transducer (1) for transmitting and/or for receiving ultrasonic waves, comprising a backing layer (2), a matching layer (A) for impedance matching to the fluid (F), a piezoelectric element (4) arranged between the backing layer (2) and the matching layer (A), a first electrode (3a) between the support layer (2) and the piezo element (4) providing a first electrical contact (K1) of the piezo element (4), wherein the matching layer (A) is formed by a flexible printed circuit board (Lp) and the flexible printed circuit board (Lp) provides a second electrical contact (K2) of the piezo element (4).

An ultrasonic sensor includes: an element storage case including a case-side diaphragm having a thickness direction along a directional axis; and an ultrasonic element accommodated in the element storage case and spaced apart from the case-side diaphragm. The ultrasonic element includes an element-side diaphragm having the thickness direction along the directional axis and provided by a thin part of a semiconductor substrate. The semiconductor substrate is arranged to provide a closed space between the case-side diaphragm and the element-side diaphragm. The semiconductor substrate is fixed and supported by the element-storage case.

Articles of manufacture, including an apparatus for omnidirectional spiral surface acoustic wave generation, are provided. An acoustic wave device that generates a plurality of acoustic wave includes a piezoelectric material to convert electric energy into the plurality of acoustic waves. The acoustic wave device also includes a transducer. The transducer includes a plurality of fingers arranged in a spiral formation. The plurality of acoustic waves induce acoustic streaming along the piezoelectric material in multiple directions to isolate a fluid component within a fluid located on the acoustic wave device.

A vibration device includes a vibration plate, a piezoelectric element, and a wiring member. The vibration plate has conductivity. The piezoelectric element is disposed on the vibration plate. The wiring member is disposed to oppose the vibration plate via the piezoelectric element. The piezoelectric element includes a piezoelectric element body, a first external electrode, and a second external electrode. The piezoelectric element body has a first main surface and a second main surface facing away from each other in an opposing direction of the vibration plate and the wiring member. The first external electrode is disposed on the first main surface and electrically connected to the vibration plate. The second external electrode is disposed on the second main surface and electrically connected to the wiring member. The vibration plate includes a first projection projecting toward the wiring member and electrically connected to the wiring member.

An ultrasonic transducer that includes a delay line, an active piezoelectric element, and interposing metal conductive layer between the delay line and active piezoelectric element. The delay line and active piezoelectric element are joined so that ultrasonic waves may be coupled from the active piezoelectric element into the delay line or from the delay line into the active piezoelectric element. A via is formed, using a milling operation, in the active piezoelectric element to expose the edge of the interposing metal conductive layer between the delay line and active piezoelectric element. A conductive layer makes electrical contact between the interposing metal conductive layer and the surface of the active piezoelectric element to allow an electrical connection to be made from the surface of the active piezoelectric element to the interposing metal conductive layer.