An ultrasound transducer according to the disclosure includes: a piezoelectric element; and a support member that supports the piezoelectric element, in which: the piezoelectric element includes a flat piezoelectric body, a first electrode that is laminated on at least one side of the piezoelectric body in a thickness direction, and a second electrode that is laminated on at least the other side of the piezoelectric body in the thickness direction; the support member includes a first terminal that is connected to the first electrode of the piezoelectric element, and a second terminal that is connected to the second electrode of the piezoelectric element; and the first terminal and the second terminal respectively include portions that do not overlap the piezoelectric element in the thickness direction.

Aspects of this disclosure relate to driving a capacitive micromachined ultrasonic transducer (CMUT) with a pulse train of unipolar pulses. The CMUT may be electrically excited with a pulse train of unipolar pulses such that the CMUT operates in a continuous wave mode. In some embodiments, the CMUT may have a contoured electrode.

The present disclosure discloses an ultrasonic cutting holder for a honeycomb core, including a holder, a swing mechanism, a transducer, a first-stage amplitude transformer, a second-stage amplitude transformer, an ultrasonic cutting tool, and an ultrasonic power transmission mechanism. The present disclosure provides an ultrasonic cutting holder for a honeycomb core with large amplitude output capacity and considering the interchangeability requirements among different vibration systems, which solves the problem of the applicability of ultrasonic cutting holder on the universal machine tool and improves the automation level of ultrasonic cutting.

Some embodiments of the invention relate to an applicator for applying ultrasound energy to a tissue volume, comprising: an array comprising a plurality of ultrasound transducers, the transducers arranged side by side, the transducers configured to emit unfocused ultrasound energy suitable to thermally damage at least a portion of the tissue volume, each of the transducers comprising a coating thin enough so as not to substantially affect heat transfer via the coating to the tissue; and a cooling module configured to apply cooling via the transducers to prevent overheating of a surface of the tissue volume being contacted by the transducers.

An ultrasonic sensor and a display device and may drive a plurality of sensing pixels disposed in the ultrasonic sensor simultaneously to transmit an ultrasonic wave, may make a first electrode disposed in a sensing pixel to be floated at a timing receiving a reflected signal to store the signal, and then may perform a sensing sequentially. Therefore, as an accurate sensing may be possible while reducing a duration and a number of an ultrasonic wave transmitting, a sensitivity and an accuracy of a sensing may be maintained while improving a driving efficiency of the ultrasonic sensor.

An ultrasonic transducer module including: a plurality of piezoelectric elements, each being aligned in the same direction that is a longitudinal direction thereof; an electrode formed on a surface of each of the piezoelectric elements; a wiring member configured to be joined with the electrode and electrically connected with the electrode; and a dematching layer provided on a surface of each of the piezoelectric elements, the surface being opposite to another surface of the corresponding piezoelectric element on which the electrode and the wiring member are joined.

A MEMS device includes a membrane portion, a piezoelectric layer made of a piezoelectric single crystal, a first electrode on a first surface of the piezoelectric layer, a second electrode on a second surface of the piezoelectric layer opposite to the first direction, and a first layer covering the first surface of the piezoelectric layer. At least a portion of the piezoelectric layer is included in the membrane portion. Each of the first electrode and the second electrode has a tapered cross-sectional shape with a width which decreases with increasing distance from the piezoelectric layer on a cross section along a plane vertical to the surface in the first direction.

A wafer level ultrasonic chip module includes a substrate, a composite layer and a base material. The substrate has a through slot passing through an upper surface and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The composite layer has a groove passing through an upper surface and a lower surface of the protective layer, and communicating with the through slot. Rhe ultrasonic body corresponds to the through slot. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.

Methods for improving the electromechanical coupling coefficient and bandwidth of micromachined ultrasonic transducers, or MUTs, are presented as well as methods of manufacture of the MUTs improved by the presented methods.

An imaging device includes a two dimensional array of piezoelectric elements. Each piezoelectric element includes: a piezoelectric layer; a bottom electrode disposed on a bottom side of the piezoelectric layer and configured to receive a transmit signal during a transmit mode and develop an electrical charge during a receive mode; and a first top electrode disposed on a top side of the piezoelectric layer; and a first conductor, wherein the first top electrodes of a portion of the piezoelectric elements in a first column of the two dimensional array are electrically coupled to the first conductor.