An imaging device includes a two dimensional array of piezoelectric elements. Each piezoelectric element includes: a piezoelectric layer; a bottom electrode disposed on a bottom side of the piezoelectric layer and configured to receive a transmit signal during a transmit mode and develop an electrical charge during a receive mode; and a first top electrode disposed on a top side of the piezoelectric layer; and a first conductor, wherein the first top electrodes of a portion of the piezoelectric elements in a first column of the two dimensional array are electrically coupled to the first conductor.

An ultrasound transducer with at least one piezoelectric element configured to convert received acoustic signals into an electric potential, a shield connectable to ground and overlying the at least one piezoelectric element through which the acoustic signals pass before being received by the at least one piezoelectric element, the shield having acoustic conductivity and electrical attenuation characteristics that enable the acoustic signals to propagate therethrough while reducing a 100 volt per centimeter electric field to below a threshold level so that the piezoelectric element is exposed to a threshold electrical potential at least less than or equal to 10 V, and a housing accommodating the at least one piezoelectric element and shield.

An imaging device includes a two dimensional array of piezoelectric elements. Each piezoelectric element includes: a piezoelectric layer; a bottom electrode disposed on a bottom side of the piezoelectric layer and configured to receive a transmit signal during a transmit mode and develop an electrical charge during a receive mode; and a first top electrode disposed on a top side of the piezoelectric layer; and a first conductor, wherein the first top electrodes of a portion of the piezoelectric elements in a first column of the two dimensional array are electrically coupled to the first conductor.

A touch feedback and sensing device includes a circuit board, a piezoelectric ceramic actuator on the circuit board; and at least one strain sensor on the circuit board. The piezoelectric ceramic actuator includes a piezoelectric ceramic block, a cathode and an anode on the piezoelectric ceramic block. Different voltages are applied to the cathode and the anode to vibrate the piezoelectric ceramic block. The circuit board vibrates with vibration of the piezoelectric ceramic block. The at least one strain sensor is configured to detect and monitor vibration of the circuit board.

An imaging device includes a two dimensional array of piezoelectric elements. Each piezoelectric element includes: a piezoelectric layer; a bottom electrode disposed on a bottom side of the piezoelectric layer and configured to receive a transmit signal during a transmit mode and develop an electrical charge during a receive mode; and a first top electrode disposed on a top side of the piezoelectric layer; and a first conductor, wherein the first top electrodes of a portion of the piezoelectric elements in a first column of the two dimensional array are electrically coupled to the first conductor.

An ultrasonic imaging apparatus having a Micro-machined Ultrasonic Transducer (MUT), such as a Piezoelectric MUT (PMUT) or Capacitive MUT (CMUT), with a transmitting mode and a receiving mode for generating and sensing acoustic pressure in imaging applications. During transmission in a PMUT the inverse piezoelectric effect on the piezo layer causes transverse stress, which causes a bending moment in the PMUT structure leading to out-of-plane deflection. Different applied signs of voltage generates different signs of stress inside the piezo that in turn cause oscillating motion generating an acoustic pressure wave. During signal reception, incident pressure waves deflect the PMUT creating transverse stress, resulting in a charge determined through measuring voltage between electrodes. The apparatus is particularly well-suited for use in health care, such as measuring fat/muscle thickness, blood-flow, and blood pressure.

An adhesive apparatus with an electrostatic adhesive including a microstructured adhesive disposed over an electrode and/or a piezoelectric element. The adhesive can be added to any robotic gripper, such as a gripper finger formed of a flexible material and including a grip surface. The electrode and/or a piezoelectric element can be used for applying an electrostatic field and/or ultrasonic vibration, configured for cleaning the microstructured adhesive, releasing the adhesive, and/or sensing a load on the adhesive apparatus.

A piezoelectric film having a porosity between 20 and 40%, a thickness ranging from tens of microns to less than a few millimeters can be used to form an ultrasonic transducer UT for operation in elevated temperature ranges, that emit pulses having a high bandwidth. Such piezoelectric films exhibit greater flexibility allowing for conformation of the UT to a surface, and obviate the need for couplings or backings. Furthermore, a method of fabricating an UT having these advantages as well as better bonding between the piezoelectric film and electrodes involves controlling porosity within the piezoelectric film.

An apparatus comprises an ultrasonic transducer having a first and second electrode and switches which configured to selectively connect the first and second electrodes to a transmit voltage source or to a receive amplifier. The switches are configured to selectively connect a first input of the amplifier to the first electrode of the transducer and to selectively connect a second input of the amplifier to the second electrode of the transducer. The switches are also configured to selectively connect the voltage source to the first and second electrodes of the transducer. The transducer may include a piezoelectric layer attached to and sandwiched between the first electrode and the second electrode, and a flexible membrane attached to the first electrode. The piezoelectric layer may be patterned to form an annular ring at the outer diameter of the flexible membrane.

A sound producing device in which an adhesive layer between a piezoelectric element and a metal plate has sufficient electrical conductivity includes: a metal plate; a piezoelectric ceramic including a first adhesion surface, the first adhesion surface being a surface bonded to the metal plate; an alternating current power supply that applies an alternating voltage to the piezoelectric ceramic; and an adhesive layer formed from conductive adhesive and thermosetting adhesive which are spread over the first adhesion surface, the conductive adhesive being applied in a center portion of the first adhesion surface and the thermosetting adhesive being applied at three or more locations in a periphery of the first adhesion surface. An adhesion surface of the metal plate that is bonded to the piezoelectric ceramic is a second adhesion surface, and the first adhesion surface and the second adhesion surface are bonded together by the adhesive layer.