A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, and an ultrasonic cleaning module configured to spray a cleaning solution onto the wafer and apply ultrasonic waves to the cleaning solution to ultrasonically vibrate the cleaning solution.

Embodiments of the disclosure provided herein include systems and methods for cleaning semiconductor substrates The method includes rotating a substrate disposed on a substrate support, spraying a front side of the substrate using a cleaning agent including one or more chelating agents through a front side nozzle assembly disposed above the substrate support, and spraying a back side of the substrate using the cleaning agent through a back side dispenser assembly disposed below the substrate support.

A vibrating body according to an embodiment is used for cleaning a substrate. A contact portion of the vibrating body with a liquid on a surface of the substrate has an inclined region inclined with respect to an end portion of the vibrating body facing the substrate. An angle between the inclined region and an extension line of the end portion of the vibrating body is , which satisfies the following condition: 20 degrees87 degrees

A cleaning system for a meat-packing plant includes a tank with a potassium-based cleaner disposed in the tank. A track has a gambrel disposed on the track. The track includes a dip over the tank to dip the gambrel into the potassium-based cleaner as the gambrel moves along the track. A processed animal carcass is removed from the gambrel prior to the gambrel being dipped into the potassium-based cleaner. A fresh animal carcass is disposed on the gambrel after the gambrel is dipped into the potassium-based cleaner.

A wafer cleaning apparatus includes a wafer roller rotating a wafer around a first direction parallel to a normal direction of a first surface of the wafer, a first brush facing the first surface of the wafer, a second brush facing a second surface of the wafer opposite to the first surface, a first cleaning tank disposed apart from the first brush and movable to accommodate at least a portion of the first brush, and a second cleaning tank disposed apart from the second brush and movable to accommodate at least a portion of the second brush. The first and second cleaning tanks include a first solution injection member connected to a first solution supply pipe and a second solution injection member connected to a second solution supply pipe, respectively. Each of the first and second solution injection members includes a bubble generating filter having a plurality of through-holes.

In one embodiment, a cleaning and drying module includes a process rotor having grip pins for holding a substrate. The process rotor rotates and moves between lowered and raised positions. A plurality of sweep arms each have a nozzle mechanism to apply a cleaning and/or drying fluid to the substrate. A collection rotor rotates synchronously with the process rotor. The collection rotor includes a collection weir defined by a bottom portion of the collection rotor and the inner surface. The collection weir collects fluids and particles from the process rotor and the substrate. Drain holes are positioned in the collection weir to drain fluids and particles from the collection weir. A rotor cover surrounds and extends above the sidewall of the collection rotor defining an annular volume between the rotor cover and the collection rotor. An exhaust draws air through the drain holes and receives the collected fluids and particles.

An ultrasonic cleaning machine for recycling and cleaning plastic, including a support assembly and a cleaning body, the cleaning body being mounted on the support assembly, the cleaning body being provided with a cleaning chamber for material cleaning, the cleaning body being provided with a plurality of ultrasonic vibrators for transmitting ultrasonic waves into the cleaning chamber, and the plurality of ultrasonic vibrators being distributed in the interlayer of the cleaning body. When cleaning a material, the material is evenly transported into the cleaning chamber through a feed apparatus. There is a liquid cleaning medium inside the cleaning chamber. When the material passes through the cleaning chamber filled with the cleaning medium, the ultrasonic waves generated by the plurality of ultrasonic vibrators form a cavitation effect to clean the material.

A wafer cleaning apparatus according to the present disclosure includes a rotary table that supports and rotates a wafer so that the wafer rotates about a rotational axis, and an ultrasonic vibration device that vibrates a liquid film so that vibration having an ultrasonic frequency is generated in the liquid film formed on an upper surface of the wafer.

Embodiments of the disclosure provided herein include systems and methods for cleaning semiconductor substrates The method includes rotating a substrate disposed on a substrate support, spraying a front side of the substrate using a cleaning agent including one or more chelating agents through a front side nozzle assembly disposed above the substrate support, and spraying a back side of the substrate using the cleaning agent through a back side dispenser assembly disposed below the substrate support.

In one embodiment, a cleaning and drying module includes a process rotor having grip pins for holding a substrate. The process rotor rotates and moves between lowered and raised positions. A plurality of sweep arms each have a nozzle mechanism to apply a cleaning and/or drying fluid to the substrate. A collection rotor rotates synchronously with the process rotor. The collection rotor includes a collection weir defined by a bottom portion of the collection rotor and the inner surface. The collection weir collects fluids and particles from the process rotor and the substrate. Drain holes are positioned in the collection weir to drain fluids and particles from the collection weir. A rotor cover surrounds and extends above the sidewall of the collection rotor defining an annular volume between the rotor cover and the collection rotor. An exhaust draws air through the drain holes and receives the collected fluids and particles.