A substrate cleaning device includes a rotation mechanism that rotates the substrate, a first cleaning solution supply nozzle that discharges a cleaning solution to which ultrasonic vibration is applied to the surface of the substrate, and a swing mechanism that swings the first cleaning solution supply nozzle from a vicinity of a rotation center of the substrate toward an outer peripheral edge of the substrate in a range narrower than a half-surface of the substrate.

An example system to clean a continuous substrate includes: one or more high pressure nozzles configured to spray a high pressure, low flow spray of a first cleaning fluid at the continuous substrate to remove particulate matter from the continuous substrate; an agitation bath and a plurality of rollers configured to transport the continuous substrate from a first volume having the high pressure, low volume spray, to a second volume having the agitation bath; an agitator in the agitation bath, comprising at least one of a megasonic transducer or an ultrasonic transducer, and configured to direct energy at the continuous substrate; and a vacuum roller configured to vacuum moisture from the continuous substrate during transporting of the continuous substrate from the first volume to the second volume; a dryer configured to dry the continuous substrate.

An ultrasonic cleaning machine for recycling and cleaning plastic, including a support assembly and a cleaning body, the cleaning body being mounted on the support assembly, the cleaning body being provided with a cleaning chamber for material cleaning, the cleaning body being provided with a plurality of ultrasonic vibrators for transmitting ultrasonic waves into the cleaning chamber, and the plurality of ultrasonic vibrators being distributed in the interlayer of the cleaning body. When cleaning a material, the material is evenly transported into the cleaning chamber through a feed apparatus. There is a liquid cleaning medium inside the cleaning chamber. When the material passes through the cleaning chamber filled with the cleaning medium, the ultrasonic waves generated by the plurality of ultrasonic vibrators form a cavitation effect to clean the material.

A feed-through ultrasonic cleaning system for winding of a large-sized superconducting coil, including a sealed chamber system, a main ultrasonic cleaning system, a deionized water spraying system, a compressed air blow-drying system, an automatic control system. During the winding of an armored superconducting coil, a superconducting conductor which is fed at a constant speed successively passes through a sealed chamber, an ultrasonic cleaning chamber, a first compressed air blow-drying chamber, a deionized water spray chamber, and a second compressed air blow-drying chamber in the ultrasonic cleaning system. By integrating mechanical dynamic sealing, ultrasonic cleaning and automatic control, the present invention meets a special requirement of removing oil and completely cleaning the conductor during the winding of large-sized superconducting coils.

A cleaning device is configured to include a first cleaning tank that holds water to which a small amount of an additive is added as a first cleaning fluid, a second cleaning tank that holds water, a water-based cleaning agent, an alkaline cleaning fluid, or a hydrophilic organic solvent as a second cleaning fluid, a first microscopic air bubble generation device, a first circulating pump, an ultrasonic wave emitting device, and a carrier device. Hydrophobic oil is removed by a cleaning target being exposed to the first cleaning fluid including microscopic air bubbles sprayed from a nozzle in an interior of the first cleaning tank, after which hydrophilic oil is removed by ultrasonic cleaning in the second cleaning tank.

A flowback tank cleaning system and method is described. A flowback tank includes a self-cleaning system. A flowback tank cleaning method may include moving solid debris collected at a bottom of a collection section of a flowback tank towards a lift auger using a cleaning auger or a conveyer belt extending along a length of the collection section, the bottom of the collection section including an angled trough, funneling solid debris towards the cleaning auger or conveyor belt by placing the cleaning auger or conveyor belt at a base of the angled trough, spraying fluid downward through a series of fluid outlets, removing the sand so moved by the cleaning auger or conveyer belt from the flowback tank using the lift auger, and removing the fluid from the flowback tank using a drain manifold below the cleaning auger or conveyer belt.

A substrate treatment apparatus includes: a first bath storing a cleaning solution and having a first opening formed in an upper surface thereof; and a first ultrasonic oscillator installed in the first bath and providing ultrasonic waves toward a surface of the cleaning solution exposed by the first opening to form a water film protruding from the surface of the cleaning solution, wherein a substrate is not immersed in the first bath, and a surface of the substrate is placed adjacent to the first opening and cleaned by the water film.

A dosing apparatus for dosing a powder product inside containers includes a hopper provided with an inner cavity for containing the product, a lower portion provided with a supply duct with a terminal aperture for the outflow of the product, a metering screw rotating inside the supply duct and a washing manifold provided with an inlet opening and containing at least a sonotrode. In a cleaning configuration of the dosing apparatus, the washing manifold is connected to the hopper coupling the inlet opening to the supply duct, so as to receive and contain a washing liquid introduced in the hopper. The sonotrode is activated to produce alternate pressure waves capable of generating in the washing liquid air bubbles adapted to propagate towards the inner cavity through the supply duct, and to implode thus creating shock waves.

A flowback tank cleaning system and method is described. A flowback tank includes a self-cleaning system. A flowback tank cleaning method may include moving solid debris collected at a bottom of a collection section of a flowback tank towards a lift auger using a cleaning auger or a conveyer belt extending along a length of the collection section, the bottom of the collection section including an angled trough, funneling solid debris towards the cleaning auger or conveyor belt by placing the cleaning auger or conveyor belt at a base of the angled trough, spraying fluid downward through a series of fluid outlets, removing the sand so moved by the cleaning auger or conveyer belt from the flowback tank using the lift auger, and removing the fluid from the flowback tank using a drain manifold below the cleaning auger or conveyer belt.

The present invention discloses a method for effectively cleaning vias, trenches or recessed areas on a substrate using an ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f.sub.1 and power P.sub.1 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate increasing to a first set value, setting said ultra/mega sonic power supply at frequency f.sub.2 and power P.sub.2 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f.sub.1 and power P.sub.1 again; repeating above steps till the substrate being cleaned.