A cleaning device for cleaning a connecting aluminum plate for automobile battery integration and cleaning process thereof, the cleaning device is disposed in a dust-free workshop, which comprises a transfer mechanism which successively transfers the connecting aluminum plate to different workshops; the workshops successively comprise three cleaning workshops, five rinsing workshops, a preheating workshop, a vacuum drying workshop, a baking and sterilizing workshop and an inspection and packaging workshop. The present invention can clean connecting aluminum plate in a pipelined manner and consume less energy, and by which the dyne level of the surface tension of the cleaned products can accord with the packaging requirement.

The present disclosure relates to a die-pressing production device and method for flavored dried bean curd. The die-pressing production device includes a die-pressing apparatus and an intermittent fabric operation apparatus located on a side of the die-pressing apparatus; the die-pressing apparatus includes a frame body on which two parallel wrapping mechanisms for wrapping a to-be-pressed material are disposed, and a cover plate for downwards pressing the wrapping mechanisms and a jacking plate for upwards jacking the wrapping mechanisms are respectively disposed on the top and bottom of the frame body; and the intermittent fabric operation apparatus includes a rack and a roller set disposed on the rack, and the roller set is wound with a rotary fabric belt passing through a space between the two wrapping mechanisms.

A processing liquid nozzle includes: an ultrasonic wave generator including a oscillator that generates ultrasonic waves and a oscillating body that is joined to the oscillator; a first supply flow path configured to supply a first liquid to a position in contact with the oscillating body of the ultrasonic wave generator; an ejection flow path configured to supply the first liquid to which the ultrasonic waves are applied by the ultrasonic wave generator to an ejection port; and a second supply flow path connected to the ejection flow path on a downstream side from the ultrasonic wave generator and configured to supply a second liquid to the ejection flow path.

A part processing apparatus and method is disclosed that includes a media-blasting apparatus and a cleaning apparatus. The media-blasting apparatus is configured to blast a stream of media against a surface of a part, and the cleaning apparatus is configured to clean debris or particles from the surface of the part. The cleaning apparatus includes a first spray-and-wash unit, a first ultrasonic wash unit, a second ultrasonic wash unit, and a second spray-and-wash unit, which may be arranged in the listed order. Each of the units may be configured to utilize hot liquid or water to clean the part being processed. The first ultrasonic wash unit is configured to ultrasonically vibrate a liquid in the first ultrasonic wash unit at a first frequency, and the second ultrasonic wash unit is configured to ultrasonically vibrate a liquid in the second ultrasonic wash unit at a second frequency. The first and second frequencies may be different from each other, such that vibration at the second frequency causes additional debris or particles to be removed from the surface of the part that were not, or could not be, removed from exposure to vibration at the first frequency. The apparatus and method may further include a drying and/or inspection unit for the part after being processed in the cleaning apparatus.

A part processing apparatus and method is disclosed that includes a media-blasting apparatus and a cleaning apparatus. The media-blasting apparatus is configured to blast a stream of media against a surface of a part, and the cleaning apparatus is configured to clean debris or particles from the surface of the part. The cleaning apparatus includes a first spray-and-wash unit, a first ultrasonic wash unit, a second ultrasonic wash unit, and a second spray-and-wash unit. The first ultrasonic wash unit is configured to ultrasonically vibrate a liquid in the first ultrasonic wash unit at a first frequency, and the second ultrasonic wash unit is configured to ultrasonically vibrate a liquid in the second ultrasonic wash unit at a second frequency. The first and second frequencies may be different from each other, such that vibration at the second frequency causes additional debris or particles to be removed from the surface of the part.

An installation is provided for cleaning a plate used in an additive manufacturing process performed using a powder. The installation includes an entry lock, an exit lock, a dry cleaner, a wet cleaner, and a conveyor system. The entry lock is structured to accept into the installation a plate that is to be cleaned. The exit lock is structured to allow the plate to be extracted from the installation after cleaning. The dry cleaner is structured to clean the plate using vibrations and shocks in a first confinement enclosure. The wet cleaner is structured to clean the plate using at least one liquid in a second confinement enclosure. The conveyor system is structured to transport the plate between the dry cleaner, the wet cleaner, and the exit lock.

A hair extension is conveyed through a fluid held in a tub of a housing, in a conveying direction, while an ultrasonic transducer establishes ultrasonic cavitation at interfaces of the fluid with surfaces of the hair extension. The hair extension is rinsed while conveyed above the fluid to a completion position.

A method of cleaning a substrate in a megasonic cleaning chamber, comprises: flowing a cleaning fluid through a supply tube in a megasonic cleaning chamber toward a substrate; using a megasonic transducer to generate megasonic waves through the cleaning fluid and create cavities in the cleaning fluid; and using one or more sensors to determine properties of the cavities in-situ based on emissions received from the cavities. A non-transitory computer readable medium has instructions stored thereon that, when executed, causes the method to be performed.

A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process. The gap can be increased or reduced by 0.5/N for each rotation of the chuck, where is wavelength of ultra/mega sonic wave, N is an integer number between 2 and 1000. The gap is varied in the range of 0.5n during the cleaning process, where is wavelength of ultra/mega sonic wave, and n is an integer number starting from 1.

A method for producing an aluminum bar includes at least one machining step in which an aluminum bar-shaped work is machined while supplying a machining fluid containing oil to produce a machined aluminum bar-work, and a cleaning step in which the machined aluminum bar-shaped work is cleaned using a cleaning fluid to produce a cleaned machined aluminum bar-shaped work. The cleaning step is performed so that the oil contained in the machining fluid remains on a surface of the cleaned machined aluminum bar-shaped work in a range of 5 g/cm.sup.2 to 20 g/cm.sup.2.