A suctional cleaning system includes a drain line that drains a fluid. The drain line is fluidly coupled to a fluid source. A fitting is fluidly coupled to the drain line and the fluid passes through the fitting. A suction unit is selectively fluidly coupled to the fitting such that the suction unit is in fluid communication with the drain line. The suction unit suctionally cleans the drain line. Moreover, the suction unit selectively directs suction between the plurality of ports.

A suctional cleaning system includes a drain line that drains a fluid. The drain line is fluidly coupled to a fluid source. A fitting is fluidly coupled to the drain line and the fluid passes through the fitting. A suction unit is selectively fluidly coupled to the fitting such that the suction unit is in fluid communication with the drain line. The suction unit suctionally cleans the drain line. Moreover, the suction unit selectively directs suction between the plurality of ports.

A portable and compact, hand-held electrically powered vacuum tool, designed expressly for suctioning clogs from the drains and traps of sinks and bathtubs to pull clogs out of drains and traps thereby clearing the clog without use of chemicals and recover items such as rings and toothpaste-tube caps that have gone down the drain.

A portable and compact, hand-held electrically powered vacuum tool, designed expressly for suctioning clogs from the drains and traps of sinks and bathtubs to pull clogs out of drains and traps thereby clearing the clog without use of chemicals and recover items such as rings and toothpaste-tube caps that have gone down the drain.

The present application provides a borescope vacuum retrieval system for foreign objects. The borescope vacuum retrieval system may include a compressed air driven ejector vacuum system and a borescope in communication with the compressed air driven ejector vacuum system.

The present application provides a borescope vacuum retrieval system for foreign objects. The borescope vacuum retrieval system may include a compressed air driven ejector vacuum system and a borescope in communication with the compressed air driven ejector vacuum system.

A method includes the following steps. A wafer is disposed on a wafer-mounting surface of a wafer holder that is disposed in a chamber. The wafer-mounting surface is in parallel with a gravity direction. A gas is flown from a gas source to vacuum sealing device. An inductive coil wrapping around a vacuum sealing device excites the gas into plasma. The plasma is injected to the wafer.

A method includes the following steps. A wafer is disposed on a wafer-mounting surface of a wafer holder that is disposed in a chamber. The wafer-mounting surface is in parallel with a gravity direction. A gas is flown from a gas source to vacuum sealing device. An inductive coil wrapping around a vacuum sealing device excites the gas into plasma. The plasma is injected to the wafer.

A material deposition system is configured to deposit material on an electronic substrate, such as a printed circuit board. The material deposition system includes a frame, a support coupled to the frame and configured to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and two deposition heads coupled to the gantry. Each deposition head includes a needle, with the deposition heads being movable over the support by movement of the gantry. The material deposition system further includes a needle cleaner assembly movable on a needle cleaner gantry, with the needle cleaner assembly being configured to clean needles of the deposition heads. The material deposition system further includes a controller configured to control the operation of the needle cleaner assembly to perform a needle cleaning operation.

A material deposition system is configured to deposit material on an electronic substrate, such as a printed circuit board. The material deposition system includes a frame, a support coupled to the frame and configured to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and two deposition heads coupled to the gantry. Each deposition head includes a needle, with the deposition heads being movable over the support by movement of the gantry. The material deposition system further includes a needle cleaner assembly movable on a needle cleaner gantry, with the needle cleaner assembly being configured to clean needles of the deposition heads. The material deposition system further includes a controller configured to control the operation of the needle cleaner assembly to perform a needle cleaning operation.