Methods are provided to fabricate thick-film pastes with low cost by using base metals. The pastes achieve high conductivity and are sintered at low or high temperatures in the air. Therein, an aluminum powder is cladded with copper particles in a thickness of tens of nanometers to several microns for obtaining a copper-clad aluminum paste with high conductivity. The copper particles can be reduced with silver. A nanoscale silver-clad aluminum powder has a sintering temperature down to about 350 celsius degrees. Hence, the PCB electroplating copper electrode can be replaced to expel the expensive yellow-light development. The problem of solution pollution during electroplating is solved. Nevertheless, the expensive metal silver electrode used in screen printing can be replaced. The problem of the expensive required reduction atmosphere in screen printing can be solved as well. Thus, the material cost is significantly reduced for PCB substrates or ceramic substrates.

A hybrid article is disclosed including a coating disposed on and circumscribing the lateral surface of a core having a core material. The coating includes about 35% to about 95% of a first metallic material having a first melting point, and about 5% to about 65% of a second metallic material having a second melting point lower than the first melting point. The coating is sinter-bonded to the core. A method for forming the hybrid article is disclosed including disposing the core in a die, introducing a slurry having the metallic materials into a gap between the lateral surface and the die, and sintering the slurry, forming the coating. A method for closing an aperture of an article is disclosed including inserting the hybrid article into the aperture, and brazing the hybrid article to the article, welding the aperture with the hybrid article serving as weld filler, or both.

This disclosure relates to a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying a fine silver particle dispersion on a substrate, wherein the fine silver particle dispersion comprises, (i) 60 to 95 wt. % of fine silver particles, wherein particle diameter (D50) of the fine silver particles is 50 to 300 nm, (ii) 4.5 to 39 wt. % of a solvent; and (iii) 0.1 to 3 wt. % of a resin, wherein the glass transition temperature (Tg) of the resin is 70 to 300 C., wherein the weight percentages are based on the weight of the fine silver particle dispersion; and (b) heating the applied fine silver particle dispersion at 80 to 1000 C.

A heat transfer surface with a convective cooling layer includes a metal substrate and a porous metal foam layer transient liquid phase (TLP) bonded on the metal substrate. The porous metal foam layer includes a plurality of high melting temperature (HMT) particles and a plurality of micro-channels. A first TLP intermetallic layer is positioned between, and TLP bonds together, adjacent HMT particles to form the porous metal foam layer. A second TLP intermetallic layer is positioned between and TLP bonds a subset of the plurality of HMT particles to the metal substrate such that the porous metal foam layer is TLP bonded to the metal substrate. The plurality of micro-channels extend from an outer surface of the porous metal foam layer to the metal substrate such that a cooling fluid may be wicked through the plurality of micro-channels to the surface of the metal substrate.

A heat transfer surface with a convective cooling layer includes a metal substrate and a porous metal foam layer transient liquid phase (TLP) bonded on the metal substrate. The porous metal foam layer includes a plurality of high melting temperature (HMT) particles and a plurality of micro-channels. A first TLP intermetallic layer is positioned between, and TLP bonds together, adjacent HMT particles to form the porous metal foam layer. A second TLP intermetallic layer is positioned between and TLP bonds a subset of the plurality of HMT particles to the metal substrate such that the porous metal foam layer is TLP bonded to the metal substrate. The plurality of micro-channels extend from an outer surface of the porous metal foam layer to the metal substrate such that a cooling fluid may be wicked through the plurality of micro-channels to the surface of the metal substrate.

A liquid composition includes copper particles, an organic acid, and a solvent. The copper particle has a particle size of 0.5 m30 m which falls in a micron scale. The liquid composition performs reaction sintering by redox reactions taken place between the copper particles and an organic acid solution at a low temperature of 150 C. in order to produce a dense copper layer and improve the conventional micron-scale copper particles that requires a protective atmosphere for the high-temperature sintering before achieving the required densification. This liquid composition also prevents an excessive oxidation of the nano copper particles during the low-temperature sintering process and a failure of the dense sintering. Due to the agglomeration of nano copper particles, some areas have to be sintered first, so that the sintered products have a good uniformity of tissue and a low resistance below 0.04 ohm per square (/).

Selected is a composition containing a silver powder generating gaseous carbon dioxide, acetone vapor, and water vapor in a case where the silver powder is heated at 100 C., a stress relaxation body having a Young's modulus lower than a Young's modulus of a sintered body of the silver powder, and a solvent, in which a particle size distribution of primary particles of the silver powder has a first peak in a range of a particle size of 20 to 70 nm and a second peak in a range of a particle size of 200 to 500 nm, an organic substance in the silver powder is decomposed by 50% by mass or more at 150 C., and a mass ratio between the silver powder and the stress relaxation body is 99:1 to 60:40.

Selected is a composition containing a silver powder generating gaseous carbon dioxide, acetone vapor, and water vapor in a case where the silver powder is heated at 100 C., a stress relaxation body having a Young's modulus lower than a Young's modulus of a sintered body of the silver powder, and a solvent, in which a particle size distribution of primary particles of the silver powder has a first peak in a range of a particle size of 20 to 70 nm and a second peak in a range of a particle size of 200 to 500 nm, an organic substance in the silver powder is decomposed by 50% by mass or more at 150 C., and a mass ratio between the silver powder and the stress relaxation body is 99:1 to 60:40.

A metallic nanoparticle dispersion includes metallic nanoparticles, a binder, and a liquid carrier, characterized in that the binder is a copolymer of vinyl chloride and a hydroxyfunctional monomer.

The magnetic tape includes a magnetic layer having ferromagnetic powder and a binder on a non-magnetic support, in which the magnetic layer includes a timing-based servo pattern, the ferromagnetic powder is ferromagnetic hexagonal ferrite powder having an activation volume equal to or smaller than 1,600 nm.sup.3, and an edge shape of the timing-based servo pattern specified by a magnetic force microscope observation is a shape in which a difference (l.sub.99.9l.sub.0.1) between a value l.sub.99.9 of a cumulative frequency function of 99.9% of a position deviation width from an ideal shape in a longitudinal direction of the magnetic tape and a value l.sub.0.1 of the cumulative frequency function of 0.1% thereof is equal to or smaller than 180 nm.